CN104465636A - Novel semiconductor packaging body - Google Patents
Novel semiconductor packaging body Download PDFInfo
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- CN104465636A CN104465636A CN201410636233.0A CN201410636233A CN104465636A CN 104465636 A CN104465636 A CN 104465636A CN 201410636233 A CN201410636233 A CN 201410636233A CN 104465636 A CN104465636 A CN 104465636A
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- packaging body
- polymer film
- molecular polymer
- film substrate
- novel semi
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Abstract
The invention discloses a novel semiconductor packaging body. The novel semiconductor packaging body comprises two high-molecular polymer film substrates, an object to be packaged is packaged between the two high-molecular polymer film substrates through encapsulation colloid, the two high-molecular polymer film substrates are each provided with a waterproof antioxidant layer, the waterproof antioxidant layer of at least one high-molecular polymer film substrate is provided with a metal circuit layer, and the object to be packaged is connected to the metal circuit layer. The novel semiconductor packaging body resolves the problems that an existing packaging technology can not provide a freely bending mechanical performance for product, and an existing common flexible base can not provide enough protection for a chip and a device.
Description
Technical field
The present invention relates to a kind of novel semi-conductor packaging body, belong to encapsulation technology field.
Background technology
Encapsulation technology is a kind of technology of the plastics of integrated circuit insulation or ceramic material being packed.For CPU, the actual volume seen and outward appearance are not size and the looks of real CPU core, but the product of the elements such as CPU core after encapsulation.Encapsulation technology encapsulation is necessary for chip, is also vital, because chip must be isolated from the outside, causes electric property to decline to prevent the impurity in air to the corrosion of chip circuit; On the other hand, the chip after encapsulation is also more convenient for installing and transport.The performance also directly having influence on chip self performance due to the quality of encapsulation technology and the PCB(printed circuit board be attached thereto) Design and manufacture, therefore it is vital.
At present, main flow encapsulation technology uses rigid material such as ceramic, duroplasts encapsulates, but for emerging flexible semiconductor material device and wearable mobile electronic device, traditional encapsulation technology can not provide in the mechanical performance of product can the mechanical performance of random bending fold; Meanwhile, the flexible substrates of existing routine can not provide enough excellent protective effect to chip and device.
Summary of the invention
Goal of the invention: the object of the invention is to for the deficiencies in the prior art; there is provided a kind of novel semi-conductor packaging body, which solves existing encapsulation technology can not provide and can arbitrarily the problem of the mechanical performance of bending fold and the flexible substrates of existing routine can not carry enough for the problem protected chip and device in the mechanical performance of product.
Technical scheme: a kind of novel semi-conductor packaging body of the present invention, comprise two panels high molecular polymer film substrate, object to be packaged is packaged between two panels high molecular polymer film substrate by embedding colloid, two panels high molecular polymer film substrate is equipped with waterproof anti oxidation layer, to promote waterproof and the non-oxidizability of film substrate; , wherein, at least the described waterproof anti oxidation layer of a slice high molecular polymer film substrate is provided with metal circuitry, and for connecting the electrode of chip stitch or contact of semiconductor device electrode, object to be packaged is connected on metal circuitry.
Improve technique scheme further: described high molecular polymer film substrate adopts poly-naphthalenedicarboxylic acid or polyimides to be made.
As preferably: described waterproof anti oxidation layer is aluminium oxide and silicon nitride alternatively layered structure, the overlapping number of plies is required to determine by encapsulation performance.
Further: described waterproof anti oxidation layer is prepared by chemical deposition.
Further: described encapsulated object is the micro-system of semiconductor chip, semiconductor device or multiple semiconductor chip composition.
As preferably: described semiconductor chip connector contacts by pressing with metal circuitry.
As preferably: described embedding colloid is waterproof hot melt adhesive, can promote the waterproof of package edge and antioxygenic property.
Described waterproof hot melt adhesive adopts polyamide polymer to be prepared from.
Compared with prior art, its beneficial effect is in the present invention:
1, solving that existing encapsulation technology can not provide in the mechanical performance of product can the problem of the random mechanical performance of bending fold.
2, solve protection problem chip and device being proposed to enough confessions, improve semiconductor water resistance, later stage reliability, and on portable, frivolous, there is good effect.
3, multiple chip can be encapsulated in a circuit board by this design simultaneously simultaneously, saves package area, and the chip of difference in functionality can be connected to form micro-system by circuit.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of described high molecular polymer film substrate.
Fig. 2 is the schematic diagram processing waterproof antioxidation coating on described high molecular polymer film substrate.
Fig. 3 is the schematic diagram making metal circuitry on described high molecular polymer film substrate.
Fig. 4 is the schematic top plan view that described metal circuitry is made on flexible substrates.
Fig. 5 is the schematic diagram be connected to by chip on the metal circuitry circuit of substrate.
Fig. 6 is the schematic diagram that use two plate base realizes double-faced packaging.
Schematic cross-section when Fig. 7 is double layer substrate encapsulation.
Fig. 8 fills the schematic diagram that embedding colloid completes encapsulation between double layer substrate.
In figure: 1, high molecular polymer film substrate; 2, waterproof anti oxidation layer; 3, metal circuitry; 4, semiconductor chip; 5, waterproof hot melt adhesive.
Embodiment
Below in conjunction with accompanying drawing, technical solution of the present invention is described in detail, but protection scope of the present invention is not limited to described embodiment.
Embodiment 1: a kind of novel semi-conductor packaging body, comprise two panels high molecular polymer film substrate 1, described high molecular polymer film substrate 1 adopts poly-naphthalenedicarboxylic acid or polyimides to be made, object to be packaged is packaged between two panels high molecular polymer film substrate 1 by waterproof hot melt adhesive 5, and described waterproof hot melt adhesive adopts polyamide polymer to be prepared from.
Described two panels high molecular polymer film substrate 1 is provided with waterproof anti oxidation layer 2, and described waterproof anti oxidation layer 2 is aluminium oxide and silicon nitride alternatively layered structure, and it is prepared by chemical deposition.
Described waterproof anti oxidation layer 2 is provided with metal circuitry 3, and for connecting the electrode of chip stitch or contact of semiconductor device electrode, described encapsulated object is the micro-system of semiconductor chip, semiconductor device or multiple semiconductor chip composition; Object to be packaged is connected on metal circuitry 3, and wherein, described semiconductor chip 4 connector contacts by pressing with metal circuitry 3.
The manufacturing process of packaging body of the present invention is: on substrate, process waterproof anti oxidation layer and make metal circuitry, encapsulation process chips connector contacts by pressing with the metallic circuit on substrate, finally uses PUR class material by double base adhesive seal.
As mentioned above, although represented with reference to specific preferred embodiment and described the present invention, it shall not be construed as the restriction to the present invention self.Under the spirit and scope of the present invention prerequisite not departing from claims definition, various change can be made in the form and details to it.
Claims (8)
1. a novel semi-conductor packaging body, it is characterized in that: comprise two panels high molecular polymer film substrate, object to be packaged is packaged between two panels high molecular polymer film substrate by embedding colloid, described two panels high molecular polymer film substrate is equipped with waterproof anti oxidation layer, wherein at least the described waterproof anti oxidation layer of a slice high molecular polymer film substrate is provided with metal circuitry, and object to be packaged is connected on metal circuitry.
2. a kind of novel semi-conductor packaging body according to claim 1, is characterized in that: described high molecular polymer film substrate adopts poly-naphthalenedicarboxylic acid or polyimides to be made.
3. a kind of novel semi-conductor packaging body according to claim 1, is characterized in that: described waterproof anti oxidation layer is aluminium oxide and silicon nitride alternatively layered structure.
4. a kind of novel semi-conductor packaging body according to claim 3, is characterized in that: described waterproof anti oxidation layer is prepared by chemical deposition.
5. a kind of novel semi-conductor packaging body according to claim 1, is characterized in that: described encapsulated object is the micro-system of semiconductor chip, semiconductor device or multiple semiconductor chip composition.
6. a kind of novel semi-conductor packaging body according to claim 1, is characterized in that: described semiconductor chip connector contacts by pressing with metal circuitry.
7. a kind of novel semi-conductor packaging body according to claim 1, is characterized in that: described embedding colloid is waterproof hot melt adhesive.
8. a kind of novel semi-conductor packaging body according to claim 7, is characterized in that: described waterproof hot melt adopts polyamide polymer to be prepared from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410636233.0A CN104465636A (en) | 2014-11-12 | 2014-11-12 | Novel semiconductor packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410636233.0A CN104465636A (en) | 2014-11-12 | 2014-11-12 | Novel semiconductor packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465636A true CN104465636A (en) | 2015-03-25 |
Family
ID=52911438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410636233.0A Pending CN104465636A (en) | 2014-11-12 | 2014-11-12 | Novel semiconductor packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465636A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109599370A (en) * | 2017-09-30 | 2019-04-09 | 财团法人工业技术研究院 | Flexible chip package |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1482840A (en) * | 2002-09-13 | 2004-03-17 | 统宝光电股份有限公司 | Packaging protecting structure |
| US20110175102A1 (en) * | 2010-01-20 | 2011-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device |
| CN102270622A (en) * | 2010-06-07 | 2011-12-07 | 佳邦科技股份有限公司 | Die-sized semiconductor element package and manufacturing method thereof |
| CN103215569A (en) * | 2003-05-16 | 2013-07-24 | 纳幕尔杜邦公司 | Barrier films for plastic substrates fabricated by atomic layer deposition |
-
2014
- 2014-11-12 CN CN201410636233.0A patent/CN104465636A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1482840A (en) * | 2002-09-13 | 2004-03-17 | 统宝光电股份有限公司 | Packaging protecting structure |
| CN103215569A (en) * | 2003-05-16 | 2013-07-24 | 纳幕尔杜邦公司 | Barrier films for plastic substrates fabricated by atomic layer deposition |
| US20110175102A1 (en) * | 2010-01-20 | 2011-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device |
| CN102270622A (en) * | 2010-06-07 | 2011-12-07 | 佳邦科技股份有限公司 | Die-sized semiconductor element package and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109599370A (en) * | 2017-09-30 | 2019-04-09 | 财团法人工业技术研究院 | Flexible chip package |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |