CN104409387A - Packaging device and packaging method - Google Patents
Packaging device and packaging method Download PDFInfo
- Publication number
- CN104409387A CN104409387A CN201410582923.2A CN201410582923A CN104409387A CN 104409387 A CN104409387 A CN 104409387A CN 201410582923 A CN201410582923 A CN 201410582923A CN 104409387 A CN104409387 A CN 104409387A
- Authority
- CN
- China
- Prior art keywords
- bed die
- mold
- separator
- locating piece
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract description 14
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 21
- 238000012856 packing Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000001746 injection moulding Methods 0.000 description 12
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a packaging device and packaging method. The packaging device comprises a lower mold, and an upper mold which is in opposite arrangement with the lower mold and limits a formation space together with the lower mold, wherein the formation space is divided into two parts symmetrical about a separator or a virtual separator arranged between the lower mold and the upper mold.
Description
Technical field
The present invention relates to a kind of method for packing and sealed in unit, specifically, relate to a kind of sealed in unit and the method for packing that can prevent warpage.
Background technology
Along with the development of electronics industry, have developed a kind of injection molding packaging module.Wherein, the substrate of such as PCB is installed the chip of some arrays; make to be electrically connected to each other (such as between chip and substrate; wire bonding is carried out to each chip); in order to protect IC and electric connection structure; utilize transfer shaping technology by the injection mo(u)lding in specific injection mold of the encapsulating material of melting, thus obtain injection molding packaging module.
Figure 1A to Fig. 1 C shows the schematic diagram of traditional injection moulding encapsulation method.As shown in Figure 1A to Fig. 1 C, the substrate 100 it being provided with chip is placed in mould 200, is then injected the encapsulating material of melting by the injection channel of mould.When after the cavity that encapsulating material is filled in full mould 200, encapsulating material is solidified, and from mould, take out the substrate after encapsulation, i.e. injection molding packaging module 110.Then, cut off the encapsulating material between different modules, thus obtain multiple independently injection molding packaging module 110a and 110b.
Traditional injection moulding encapsulation method Problems existing is, in the process of injection mo(u)lding, because storeroom thermal coefficient of expansion various in injection molding packaging module does not mate and the asymmetry of structure, causing after injection mo(u)lding, there is more serious buckling deformation problem in the injection molding packaging module of gained.
Summary of the invention
Each aspect of the present invention relates to a kind of sealed in unit, and this equipment, in the process forming layer injection molding packaging module, can prevent package module buckling deformation.
Each aspect of the present invention also relates to a kind of method for packing, utilizing the method to be formed in the process of layer injection molding packaging module, can prevent package module buckling deformation.
According to an aspect of the present invention, a kind of sealed in unit comprises: bed die; Mold, is relatively arranged with bed die, and limits molding space together with bed die, and wherein, described molding space is divided into the two parts about the separator be arranged between bed die and mold or virtual partition part symmetry.
According to an aspect of the present invention, sealed in unit also can comprise: the first locating piece, is formed on the side of sealed in unit; Second locating piece, is formed on the opposite side relative with the first locating piece, and wherein, the first locating piece and the second locating piece support bed die and mold, to limit molding space between bed die and mold.
According to an aspect of the present invention, the first locating piece and the second locating piece can respectively relative to separators or virtual partition part is symmetrical or near symmetrical.
According to an aspect of the present invention, the first locating piece and the second locating piece can be respectively formed at the both sides of separator, and give prominence to up and/or down from the both sides of separator.
According to an aspect of the present invention, the first locating piece and the second locating piece can be formed on bed die and mold respectively two ends on or be formed the part of bed die and mold.
According to an aspect of the present invention, described separator can comprise the upper separator and lower separator that are bonded to each other.
According to an aspect of the present invention, substrate to be packaged can be set respectively in bed die and mold.
Another aspect of the present invention relates to a kind of method for packing, and the method comprises the steps: the first substrate it being formed with chip to be placed in bed die, is placed in mold by the second substrate it being formed with chip; Bed die and mold are bonded to each other, thus molding space is limited between bed die and mold, described molding space is divided into the two parts about the separator be arranged between bed die and mold or virtual partition part symmetry, wherein, the first substrate and the second substrate lay respectively in described two parts; In molding space, inject the encapsulating material of molten condition, make encapsulant be filled in described two parts of molding space simultaneously; After the packed material of molding space is full of, encapsulating material is solidified, and remove bed die and mold, obtain package module intermediate; By package module intermediate separately, to form independently package module.
According to an aspect of the present invention, in the step of being separated by package module intermediate, package module can be separated with distance piece by stripping, and/or can make package module intermediate separately by cutting separator or encapsulating material.
Less buckling deformation can be had according to the package module that embodiments of the invention obtain or substantially not there is buckling deformation, therefore, it is possible to significantly improve the yield of package module, thus improving product yield, reduce manufacturing cost.
Accompanying drawing explanation
By the description to embodiment carried out below in conjunction with accompanying drawing, above-mentioned and/or other object of the present invention and advantage will become apparent, wherein:
Figure 1A to Fig. 1 C is the schematic diagram of injection moulding encapsulation method traditional in prior art;
Fig. 2 A and Fig. 2 B is plane graph according to the sealed in unit of exemplary embodiment of the present invention and cutaway view respectively;
Fig. 3 shows the exemplary view sub-anatomy of the separator according to another exemplary embodiment of the present invention;
Fig. 4 A to Fig. 4 E shows the cutaway view of the method for packing according to exemplary embodiment of the present invention;
Fig. 5 shows the cutaway view of the sealed in unit according to another exemplary embodiment of the present invention.
Embodiment
In more detail the present invention is described below with reference to accompanying drawings, exemplary embodiment of the present invention shown in the drawings.It will be appreciated by those skilled in the art that only with illustrative meaning to provide these embodiments, and should not be interpreted as limiting the scope of the invention.On the contrary, provide these embodiments to make the disclosure to be thoroughly with complete, and scope of the present invention will be conveyed to those skilled in the art fully.
Fig. 2 A and Fig. 2 B is plane graph according to the sealed in unit of exemplary embodiment of the present invention and cutaway view respectively.
With reference to Fig. 2 A and Fig. 2 B, the sealed in unit 200 according to exemplary embodiment of the present invention comprises: bed die 210; Mold 220, is relatively arranged with bed die 210, and limits molding space together with bed die 210; Separator 230, is arranged between bed die 210 and mold 220, molding space is divided into two parts that are symmetrical about separator 230 or near symmetrical.
Separator 230 can be the separator of rigidity, and according to one embodiment of present invention, separator 230 can be formed by copper.But the present invention is not limited thereto, separator 230 can be formed by other material with predetermined physical stability and chemical stability.
Sealed in unit 200 can also comprise formation the first locating piece 231 on one side thereof and the second locating piece 232 be formed on the side relative with the first locating piece.First locating piece 231 and the second locating piece 232 can be formed to have specific height, thus support bed die 210 and mold 220, to contribute to limiting molding space between bed die 210 and mold 220.According to one embodiment of present invention, first locating piece 231 and the second locating piece 232 can respectively relative to separator 230 symmetry or near symmetrical, thus contribute to forming molding space that is symmetrical relative to separator 230 or near symmetrical, but the present invention is not limited thereto.
First locating piece 231 and the second locating piece 232 can be respectively formed at the both sides of separator 230, and give prominence to up and/or down from the both sides of separator 230.But the present invention is not limited thereto, the first locating piece 231 and the second locating piece 232 can be respectively formed on bed die 210 and/or mold 220, and can contact with separator 230 respectively.In another embodiment, the first locating piece 231 and the second locating piece 232 can be formed by the part extended from its two ends of bed die 210 and/or mold 220.
Sealed in unit 200 can also comprise inlet 240 for injecting encapsulating material and the outlet 250 for the air of discharging molding space.Preferably, inlet 240 and outlet 250 are respectively formed at the both sides respect to one another place of sealed in unit 200, with the discharge of the injection and air that are conducive to encapsulating material.The quantity of inlet 240 and outlet 250 can be one or more, and when forming multiple inlet 240 and outlet 250, inlet 240 and outlet 250 can distribute equably along the both sides respect to one another of sealed in unit 200.
Fig. 3 shows the exemplary view sub-anatomy of the separator according to another exemplary embodiment of the present invention.
With reference to Fig. 3, separator 330 can comprise separator 335 and lower separator 336.Upper separator 335 and lower separator 336 can be bonded to each other to form separator 330.According to one embodiment of present invention, adhesive can be utilized to be bonded to each other to make upper separator 335 and lower separator 336, but to the present invention is not limited thereto, other method also can be used to be bonded to each other to make upper separator 335 and lower separator 336, such as, fixture, fixture etc. is used.
Comprise separator 335 and lower separator 336 at separator 330, can by upper separator 335 and lower separator 336 are separated from each other make easily to be mutually symmetrical relative to separator 330 or near symmetrical molding space separately.Upper separator 335 and lower separator 336 can be separated from each other by making the engagement means between upper separator 335 and lower separator 336 lose efficacy.Such as, the viscosity of adhesive can be made to reduce, remove for the fixing fixture of above separator 335 and lower separator 336 or the part be fixed to one another between excision separator 335 and lower separator 336, separator 335 and lower separator 336 are separated from each other.
More particularly, the specific part of upper separator and lower separator can be made (such as by methods such as electric resistance weldings, marginal portion) be fixed to one another, after completing injection molding packaging, the part that can be fixed by removal (such as, cut away the marginal portion be fixed to one another), thus separator and lower separator are separated from each other.
Also the first locating piece 331 and the second locating piece 332 can be attached to respectively the both sides of separator 330, the first locating piece 331 and the second locating piece 332 are given prominence to up and/or down from the both sides of separator 230.
By using according to sealed in unit 200 of the present invention, substrate to be packaged can be set respectively in bed die 210 and mold 220, after moulding, can be formed simultaneously being mutually symmetrical about separator 230 or two package modules of near symmetrical.Due to two package modules contact with each other on surface and be mutually symmetrical or near symmetrical (namely, form aspectant encapsulation modular structure), so can effectively reduce or prevent the buckling deformation problem that the asymmetry due to thermal expansion coefficient difference and structure causes.
Below with reference to Fig. 4 A to Fig. 4 E, the method for packing according to exemplary embodiment of the present invention is described in more detail.Fig. 4 A to Fig. 4 E shows the cutaway view of the method for packing according to exemplary embodiment of the present invention.
With reference to Fig. 4 A to Fig. 4 E, first, the substrate 490a it being formed with various chip is placed in bed die 410, the substrate 490b it being formed with chip is placed in mold 420.Then, bed die 410 and mold 420 are bonded to each other, and make distance piece 430 between bed die 410 and mold 420, make the molding space limited between bed die 410 and mold 420 be divided into two parts that are symmetrical about separator 430 or near symmetrical.Wherein, substrate 490a and substrate 490b lays respectively in described two parts.
Substrate 490a and substrate 490b can be identical substrate.But the present invention is not limited thereto, substrate 490a and substrate 490b can be different substrate.Preferably, substrate 490a and substrate 490b has and is mutually symmetrical or the structure of near symmetrical.
According to one embodiment of present invention, substrate 490a and substrate 490b can be printed circuit board (PCB) (PCB).But the present invention is not limited thereto, substrate 490a and substrate 490b can be other substrate, such as ceramic bases, lead frame etc.
Inject the encapsulating material of molten condition from the inlet 440 of the mould after combination, and gas is got rid of by outlet 450 from molding space, encapsulating material is filled in two parts of the symmetrical about separator 430 of molding space or near symmetrical simultaneously.
After the packed material of molding space is full of, encapsulating material is solidified, and remove bed die 410 and mold 420, thus obtain package module intermediate 460.
Next, package module can be separated with distance piece 430 by peeling off, thus form independently package module 470a and 470b.In addition, also can by along the heartcut separator 430 of separator 430, thus formed on it there is tectal independently package module 480a and 480b.In this case, when distance piece 430 is formed by electric conducting material (such as copper), package module 480a and 480b it with conductive covering layer can be formed, thus can by the electric connection structure making conductive covering layer patterning form other.In addition, according to one embodiment of present invention, when separator 430 is formed by the upper separator be bonded to each other and lower separator, package module 480a and 480b can be formed by making upper separator and lower separator separate.
Package module 470a, 470b, 480a and/or 480b of utilizing said method to obtain can have less buckling deformation or substantially not have buckling deformation, therefore, it is possible to significantly improve the yield of package module, thus improve product yield, reduce manufacturing cost.Package module 470a, 470b, 480a and/or 480b can be used to other follow-up operation, to prepare electronic product.
Fig. 5 shows the cutaway view of the sealed in unit according to another exemplary embodiment of the present invention.
With reference to Fig. 5, the sealed in unit 500 according to another exemplary embodiment of the present invention comprises: bed die 510; Mold 520, is relatively arranged with bed die 510, and limits molding space together with bed die 510; Virtual partition part 530, between bed die 510 and mold 520, is divided into two parts that are symmetrical about virtual partition part 530 or near symmetrical by molding space.
In the present embodiment, the first locating piece and the second locating piece can be respectively formed on mold and bed die, and contact with each other in the position of virtual partition part 530.But the present invention is not limited thereto, the first locating piece and the second locating piece can be formed the part extended from mold and bed die, and the first locating piece and the second locating piece can contact with each other in other position.
According to the present embodiment, virtual partition part 530 can not be the component of necessary being, but between bed die 510 and mold 520 virtual interface (being represented by the dotted line in Fig. 5).In this case, the molding space between bed die 510 and mold 520 is mutually symmetrical about virtual partition part 530, thus the two panels package module intermediate after being formed can have the virtual plane of symmetry.After this package module intermediate of formation, along this virtual plane of symmetry cutting encapsulating material, thus package module independent of each other can be formed.
Although be specifically described the present invention in conjunction with the specific embodiments, but it will be appreciated by those skilled in the art that without departing from the spirit and scope of the present invention, various amendment in form and details and change can be carried out to these embodiments.Scope of the present invention is by claims and equivalents thereof.
Claims (10)
1. a sealed in unit, described sealed in unit comprises:
Bed die;
Mold, is relatively arranged with bed die, and limits molding space together with bed die,
Wherein, described molding space is divided into the two parts about the separator be arranged between bed die and mold or virtual partition part symmetry.
2. sealed in unit as claimed in claim 1, described sealed in unit also comprises:
First locating piece, is formed on the side of sealed in unit;
Second locating piece, is formed on the opposite side relative with the first locating piece,
Wherein, the first locating piece and the second locating piece support bed die and mold, to limit molding space between bed die and mold.
3. sealed in unit as claimed in claim 2, wherein, the first locating piece and the second locating piece are respectively relative to separator or virtual partition part is symmetrical or near symmetrical.
4. sealed in unit as claimed in claim 2, wherein, the first locating piece and the second locating piece are respectively formed at the both sides of separator, and give prominence to up and/or down from the both sides of separator.
5. sealed in unit as claimed in claim 2, wherein, on the two ends that the first locating piece and the second locating piece are formed on bed die and mold respectively or be formed the part of bed die and mold.
6. sealed in unit as claimed in claim 1, wherein, described separator comprises the upper separator and lower separator that are bonded to each other.
7. sealed in unit as claimed in claim 1, wherein, arranges substrate to be packaged respectively in bed die and mold.
8. a method for packing, the method comprises the steps:
The first substrate it being formed with chip is placed in bed die, the second substrate it being formed with chip is placed in mold;
Bed die and mold are bonded to each other, thus molding space is limited between bed die and mold, described molding space is divided into the two parts about the separator be arranged between bed die and mold or virtual partition part symmetry, wherein, the first substrate and the second substrate lay respectively in described two parts;
In molding space, inject the encapsulating material of molten condition, make encapsulant be filled in described two parts of molding space simultaneously;
After the packed material of molding space is full of, encapsulating material is solidified, and remove bed die and mold, obtain package module intermediate;
By package module intermediate separately, to form independently package module.
9. method as claimed in claim 8, wherein, in the step of being separated by package module intermediate, makes package module separate with distance piece by peeling off.
10. method as claimed in claim 8, wherein, in the step of being separated by package module intermediate, makes package module intermediate separately by cutting separator or encapsulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410582923.2A CN104409387A (en) | 2014-10-27 | 2014-10-27 | Packaging device and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410582923.2A CN104409387A (en) | 2014-10-27 | 2014-10-27 | Packaging device and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104409387A true CN104409387A (en) | 2015-03-11 |
Family
ID=52647003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410582923.2A Pending CN104409387A (en) | 2014-10-27 | 2014-10-27 | Packaging device and packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104409387A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2259687Y (en) * | 1995-03-14 | 1997-08-13 | 阜宁县晶体管厂 | Micro-high-voltage silicon rectifier stack combination block package die |
| CN2369355Y (en) * | 1999-02-09 | 2000-03-15 | 日月光半导体制造股份有限公司 | Sealing adhesive device for semiconductor device |
| US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
| JP3161449B2 (en) * | 1999-01-25 | 2001-04-25 | 日本電気株式会社 | Semiconductor resin sealing method |
| US20040158978A1 (en) * | 2003-02-14 | 2004-08-19 | Lee Sang-Hyeop | Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB |
| US20040169292A1 (en) * | 2002-04-25 | 2004-09-02 | Micron Technology, Inc. | Standoffs for centralizing internals in packaging process |
| CN101740404A (en) * | 2008-11-05 | 2010-06-16 | 矽品精密工业股份有限公司 | Structure of semiconductor packaging piece and manufacture method thereof |
| CN102005419A (en) * | 2009-08-27 | 2011-04-06 | 三菱电机株式会社 | Power semiconductor device and manufacturing method for the same |
| CN102593015A (en) * | 2011-01-12 | 2012-07-18 | 瑞萨电子株式会社 | Manufacturing method of semiconductor device |
| CN103094130A (en) * | 2011-11-04 | 2013-05-08 | 台湾积体电路制造股份有限公司 | Apparatus and methods for molded underfills in flip chip packaging |
-
2014
- 2014-10-27 CN CN201410582923.2A patent/CN104409387A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2259687Y (en) * | 1995-03-14 | 1997-08-13 | 阜宁县晶体管厂 | Micro-high-voltage silicon rectifier stack combination block package die |
| US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
| JP3161449B2 (en) * | 1999-01-25 | 2001-04-25 | 日本電気株式会社 | Semiconductor resin sealing method |
| CN2369355Y (en) * | 1999-02-09 | 2000-03-15 | 日月光半导体制造股份有限公司 | Sealing adhesive device for semiconductor device |
| US20040169292A1 (en) * | 2002-04-25 | 2004-09-02 | Micron Technology, Inc. | Standoffs for centralizing internals in packaging process |
| US20040158978A1 (en) * | 2003-02-14 | 2004-08-19 | Lee Sang-Hyeop | Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB |
| CN101740404A (en) * | 2008-11-05 | 2010-06-16 | 矽品精密工业股份有限公司 | Structure of semiconductor packaging piece and manufacture method thereof |
| CN102005419A (en) * | 2009-08-27 | 2011-04-06 | 三菱电机株式会社 | Power semiconductor device and manufacturing method for the same |
| CN102593015A (en) * | 2011-01-12 | 2012-07-18 | 瑞萨电子株式会社 | Manufacturing method of semiconductor device |
| CN103094130A (en) * | 2011-11-04 | 2013-05-08 | 台湾积体电路制造股份有限公司 | Apparatus and methods for molded underfills in flip chip packaging |
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Application publication date: 20150311 |