Nothing Special   »   [go: up one dir, main page]

CN104406322A - Adsorption type refrigerating system - Google Patents

Adsorption type refrigerating system Download PDF

Info

Publication number
CN104406322A
CN104406322A CN201410734070.XA CN201410734070A CN104406322A CN 104406322 A CN104406322 A CN 104406322A CN 201410734070 A CN201410734070 A CN 201410734070A CN 104406322 A CN104406322 A CN 104406322A
Authority
CN
China
Prior art keywords
heat
heat pump
adsorption
adsorbent bed
thermal release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410734070.XA
Other languages
Chinese (zh)
Other versions
CN104406322B (en
Inventor
罗宝军
梁祥飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gree Electric Appliances Inc of Zhuhai
Original Assignee
Gree Electric Appliances Inc of Zhuhai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gree Electric Appliances Inc of Zhuhai filed Critical Gree Electric Appliances Inc of Zhuhai
Priority to CN201410734070.XA priority Critical patent/CN104406322B/en
Publication of CN104406322A publication Critical patent/CN104406322A/en
Application granted granted Critical
Publication of CN104406322B publication Critical patent/CN104406322B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B17/00Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00Adapting or protecting infrastructure or their operation
    • Y02A30/27Relating to heating, ventilation or air conditioning [HVAC] technologies
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/62Absorption based systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sorption Type Refrigeration Machines (AREA)

Abstract

The invention discloses an adsorption type refrigerating system, and relates to the technical field of air conditioners. The technical problem of low refrigeration efficiency of an electrically-driven adsorption refrigeration system in the prior art is solved. The adsorption refrigeration system comprises an adsorption refrigeration device and a heat pump, wherein the heat pump comprises a heat absorption device and a heat release device, the adsorption refrigeration device comprises an adsorption bed for absorbing heat and a heat release device, the heat absorption device of the heat pump is in heat connection with the heat release device and/or an external multi-waste heat source, and the heat absorption device of the heat pump can absorb heat from the heat release device and/or the external multi-waste heat source; the heat releasing device of the heat pump is thermally connected with the adsorption bed for absorbing heat, and the heat pump can conduct the heat absorbed by the heat releasing device and/or the external redundant heat source to the adsorption bed for absorbing heat. The invention is used for improving the refrigeration efficiency of the adsorption refrigeration system.

Description

Adsorption refrigeration system
Technical field
The present invention relates to air-conditioning technical field, particularly relate to a kind of adsorption refrigeration system.
Background technology
Peak-trough electricity for field of air conditioning utilizes, and usually adopts the cold-storage and thermal storage mode of latent heat or sensible heat.Cold-storage mainly refers at electric load low-valley interval, adopt electric refrigerator group refrigeration, the latent heat of water or sensible heat is utilized to be stored up by cold with the form of ice or water at low temperature, discharged in the peak of power consumption period, to meet air-conditioning or the production technology chilling requirement of building, thus realize the object of electrical network peak load shifting.Accumulation of heat refers at electrical network low-valley interval operation electric heating equipment, the heat storage medium left in heat-accumulator tank is heated, converts electric energy to thermal energy storage, discharged in peak times of power consumption, to meet constructure heating or domestic hot-water's calorific requirement, thus realize the object of electrical network peak load shifting.
In cold-storage and thermal storage process, the operational efficiency of mechanical vapor compression system is very low, and cold-storage and thermal storage utilizes in process and still there is energy loss.Compared with mechanical vapor compression system, absorption refrigeration self possesses cold-storage and thermal storage effect, and has the features such as unit volume cold-storage and thermal storage ability is large, cold-storage and thermal storage loss is little.
But the applicant finds: prior art at least exists following technical problem:
In prior art, on the one hand the efficiency of absorbing refrigeration system is as a kind of Refrigeration Technique of thermal drivers, COP (refrigerating efficiency) very low (being generally 0.3 ~ 0.7).For direct electro heating, the electricity of 1kwh can only obtain the heat of 1kwh, therefore adopts refrigerating efficiency in the absorption type refrigerating process of the direct heat driven of electricity very low, very uneconomical.
Summary of the invention
One of them object of the present invention proposes a kind of adsorption refrigeration system, solves the technical problem that the refrigerating efficiency of electric drive adsorption refrigeration system in prior art is lower.Many technique effects that optimal technical scheme in many technical schemes provided by the invention can produce refer to hereafter sets forth.
For achieving the above object, the invention provides following technical scheme:
The adsorption refrigeration system that the embodiment of the present invention provides, comprises adsorb refrigerating device and heat pump, and described heat pump comprises heat sink and heat-releasing device, and described adsorption refrigerating device comprises heat absorption adsorbent bed and thermal release device, wherein:
The heat sink of described heat pump and described thermal release device and/or outside unnecessary thermal source thermally coupled, and the heat sink of described heat pump can from described thermal release device and/or outside unnecessary thermal source draw heat;
Heat-releasing device and the described heat absorption adsorbent bed of described heat pump are thermally coupled, and it can be given described heat absorption adsorbent bed from the heat conduction of described thermal release device and/or described outside unnecessary thermal source absorption by described heat pump.
In preferably or alternatively embodiment, described adsorption refrigeration system also comprises energy storage equipment, wherein:
Between the heat sink of described heat pump and described thermal release device, the heat-releasing device of described heat pump and/or external heat source separately and formed thermally coupled by described energy storage equipment between described heat absorption adsorbent bed; Described energy storage equipment can conduct to cryogenic substance after putting aside a period of time from high temperature material draw heat.
In preferably or alternatively embodiment, described energy storage equipment comprises the first accumulator and the second accumulator, wherein:
The heat-releasing device of described heat pump and formed thermally coupled by described first accumulator between described external heat source and described heat absorption adsorbent bed;
Formed thermally coupled by described second accumulator between the heat sink of described heat pump and described thermal release device.
In preferably or alternatively embodiment, described energy storage equipment is connected by the heat-releasing device of heat catalysis transfer conduit and the heat sink of described heat pump, described thermal release device, described heat pump and/or described external heat source, wherein:
Between the heat sink of described heat pump and described thermal release device, the heat-releasing device of described heat pump and/or described external heat source form thermally coupled by the heat catalysis in described heat catalysis transfer conduit and described energy storage equipment separately and between described heat absorption adsorbent bed.
In preferably or alternatively embodiment, described thermal release device comprises the first thermal release device and the second thermal release device, wherein:
The heat sink three of described first thermal release device, described second thermal release device and described heat pump is connected with described second accumulator by described heat catalysis transfer conduit;
In heat catalysis transfer conduit between described second thermal release device and the heat sink of described heat pump and the heat catalysis of the heat catalysis import of described second thermal release device and described second thermal release device export between described heat catalysis transfer conduit on be provided with conducting control valve.
In preferably or alternatively embodiment, described adsorb refrigerating device comprises solution and smokes adsorbent bed, adsorption condensing device, absorption evaporimeter and described heat absorption adsorbent bed, wherein:
The refrigerant outlet of described heat absorption adsorbent bed is connected with the refrigerant inlet of described adsorption condensing device;
The refrigerant outlet of described adsorption condensing device is connected with the refrigerant inlet of described absorption evaporimeter;
The refrigerant inlet that refrigerant outlet and the described solution of described absorption evaporimeter smoke adsorbent bed is connected;
Described adsorption condensing device forms described first thermal release device, and described solution smokes adsorbent bed and forms described second thermal release device.
In preferably or alternatively embodiment, described adsorb refrigerating device also comprises throttling arrangement, and the refrigerant outlet of described adsorption condensing device is connected by the refrigerant inlet of described throttling arrangement with described absorption evaporimeter.
In preferably or alternatively embodiment, described heat pump comprises heat pump condenser, evaporator with heat pump and compressor, wherein:
The refrigerant exit of described compressor is connected with the refrigerant inlet of described heat pump condenser;
The refrigerant exit of described heat pump condenser is connected with the refrigerant inlet of described evaporator with heat pump;
The refrigerant exit of described evaporator with heat pump is connected with the refrigerant inlet of described compressor;
Described heat pump condenser forms the heat-releasing device of described heat pump, and described evaporator with heat pump forms the heat sink of described heat pump.
In preferably or alternatively embodiment, described heat pump also comprises heat pump expansion valve, and the refrigerant exit of described heat pump condenser is connected with the refrigerant inlet of described evaporator with heat pump by described heat pump expansion valve.
In preferably or alternatively embodiment, described adsorb refrigerating device comprises solution and smokes adsorbent bed, adsorption condensing device, absorption evaporimeter and described heat absorption adsorbent bed, wherein:
The refrigerant outlet of described heat absorption adsorbent bed is connected with the refrigerant inlet of described adsorption condensing device;
The refrigerant outlet of described adsorption condensing device is connected with the refrigerant inlet of described absorption evaporimeter;
The refrigerant inlet that refrigerant outlet and the described solution of described absorption evaporimeter smoke adsorbent bed is connected;
Described solution smokes adsorbent bed and/or described adsorption condensing device forms described thermal release device.
In preferably or alternatively embodiment, described adsorb refrigerating device also comprises throttling arrangement, and the refrigerant outlet of described adsorption condensing device is connected by the refrigerant inlet of described throttling arrangement with described absorption evaporimeter.
In preferably or alternatively embodiment, described solution smokes adsorbent bed and described adsorption condensing device forms described thermal release device.
In preferably or alternatively embodiment, described external heat source comprises solar heat-collection plate, waste heat of plant gathering-device and water heater one wherein, two or three.
In preferably or alternatively embodiment, described water heater is gas heater or electric heater.
In preferably or alternatively embodiment, in described heat pump, the evaporating temperature scope of refrigerant is 20 DEG C ~ 60 DEG C, and condensation temperature scope is 50 DEG C ~ 100 DEG C.
Based on technique scheme, the embodiment of the present invention at least can produce following technique effect:
Present invention utilizes heat pump and can realize heat energy efficiently by the feature of cryogenic object to the transfer of high temp objects, combine adsorb refrigerating device and heat pump, heat pump is utilized (to be preferably absorption refrigeration condensation thermal discharge from the thermal release device of adsorption refrigerating device, thermal discharge in adsorption process) and/or outside unnecessary thermal source draw heat, and the driving heat source of the driving heat source using the heat-releasing device of heat pump to be adsorption refrigerating device and heat absorption adsorbent bed imports heat into, improve the temperature of heat absorption adsorbent bed, because the refrigerating efficiency of absorption refrigeration and refrigerating capacity affect by driving heat source temperature, therefore, in some temperature range, adopt heat pump raising heat source temperature can significantly improve the refrigerating efficiency of system, and this part electricity than merit (refrigerating capacity/power consumption) higher than mechanical refrigeration efficiency, so the technical problem that the refrigerating efficiency solving electric drive adsorption refrigeration system in prior art is lower.
In addition, the various heating sources modes such as combustion gas (such as gas heater), waste heat of plant, solar energy that combine in optimal technical scheme in many technical schemes provided by the invention provide thermal source for adsorbent bed, avoid the absorption refrigeration fluctuation of service based on low grade residual heat, solar energy equal energy source, thus improve low grade residual heat, solar energy equal energy source ease for use, contribute to promoting the share of these energy in energy resource consumption.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
The schematic diagram of annexation between the part of the adsorption refrigeration system that a kind of embodiment that Fig. 1 is the embodiment of the present invention provides;
The schematic diagram of annexation between the part of the adsorption refrigeration system that the another kind of embodiment that Fig. 2 is the embodiment of the present invention provides;
The schematic diagram of annexation between the part of the adsorption refrigeration system that the preferred embodiment that Fig. 3 is the embodiment of the present invention provides;
Reference numeral: 1, the first accumulator; 2, the second accumulator; 3, heat pump condenser; 4, heat pump expansion valve; 5, evaporator with heat pump; 6, compressor; 7, heat absorption adsorbent bed; 8, adsorption condensing device; 9, throttling arrangement; 10, evaporimeter is adsorbed; 11, solution smokes adsorbent bed; 12, solar heat-collection plate; 13, waste heat of plant gathering-device; 14, water heater; 15, adsorb refrigerating device; 16, heat pump; 17, conducting control valve.
Detailed description of the invention
Content of the present invention and the distinctive points between the present invention and prior art can be understood below with reference to accompanying drawing Fig. 1 ~ Fig. 3 and word content.Hereafter by accompanying drawing and the mode enumerating embodiment more of the present invention, technical scheme of the present invention (comprising optimal technical scheme) is described in further detail.It should be noted that: any technical characteristic in the present embodiment, any technical scheme is all one or more in the technical characteristic of plurality of optional or optional technical scheme, cannot exhaustive all alternative technical characteristics of the present invention and alternative technical scheme in order to describe succinct to need in presents, also the embodiment being not easy to each technical characteristic all emphasizes that it is one of optional numerous embodiments, so those skilled in the art should know: arbitrary technological means provided by the invention can be carried out replacing or two or more technological means or technical characteristic arbitrarily provided by the invention being carried out mutually combining and obtain new technical scheme.Any technical characteristic in the present embodiment and any technical scheme all do not limit the scope of the invention, protection scope of the present invention should comprise those skilled in the art do not pay creative work thinkable any alternate embodiments and those skilled in the art new technical scheme that two or more technological means or technical characteristic arbitrarily provided by the invention are carried out mutually combining and obtain.
Embodiments provide that a kind of refrigerating efficiency is high, the adsorption refrigeration system of good energy saving property.
Below in conjunction with the elaboration that Fig. 1 ~ Fig. 3 carries out specifically to technical scheme provided by the invention.
As shown in FIG. 1 to 3, the adsorption refrigeration system that the embodiment of the present invention provides comprises adsorb refrigerating device 15 and heat pump 16, heat pump 16 comprises heat sink (being preferably evaporator with heat pump 5) and heat-releasing device (being preferably heat pump condenser 3), adsorption refrigerating device comprises heat absorption adsorbent bed 7 and thermal release device (be preferably adsorption condensing device 8 reconciliation and smoke adsorbent bed 11), wherein: heat absorption adsorbent bed 7 adsorbs for cold-producing medium, heat absorption.
(outside unnecessary thermal source can be the waste heat of other air-conditioners or household electrical appliance for the heat sink of heat pump 16 and thermal release device and/or outside unnecessary thermal source, such as, heat in waste gas, tail gas) thermally coupled, and the heat sink of heat pump 16 can from thermal release device and/or outside unnecessary thermal source draw heat.Thermally coupledly in the present invention include but not limited to the thermally coupled mode such as heat transfer, thermal convection current, as long as the transmission of heat can be realized.
The heat-releasing device of heat pump 16 is thermally coupled with heat absorption adsorbent bed 7, and heat pump 16 can by its heat conduction from thermal release device and/or outside unnecessary thermal source absorption to heat absorption adsorbent bed 7.
Present invention utilizes heat pump 16 and can realize heat energy efficiently by the feature of cryogenic object to the transfer of high temp objects, combine adsorb refrigerating device 15 and heat pump 16, heat pump 16 is utilized (to be preferably absorption refrigeration condensation thermal discharge from the thermal release device of adsorption refrigerating device, thermal discharge in adsorption process) draw heat, and the driving heat source of the driving heat source using the heat-releasing device of heat pump 16 to be adsorption refrigerating device and heat absorption adsorbent bed 7 imports heat into, improve the temperature of heat absorption adsorbent bed 7, because the refrigerating efficiency of absorption refrigeration and refrigerating capacity affect by driving heat source temperature, therefore, in some temperature range, heat pump 16 is adopted to improve the refrigerating efficiency that driving heat source temperature can significantly improve system, and this part electricity than merit (refrigerating capacity/power consumption) higher than mechanical refrigeration efficiency.
As preferably or alternatively embodiment, adsorption refrigeration system also comprises energy storage equipment, wherein: between the heat sink of heat pump 16 and thermal release device, the heat-releasing device of heat pump 16 and/or external heat source (external heat source can be solar heat-collection plate 12, waste heat of plant gathering-device 13 or water heater 14) separately and formed thermally coupled between heat absorption adsorbent bed 7 by energy storage equipment.Energy storage equipment can conduct to cryogenic substance after putting aside a period of time from high temperature material draw heat.
Energy storage equipment can play the effect of conduction, temporary heat energy, avoids the waste of the heat of heat pump 16 or adsorption refrigerating device generation.
As preferably or alternatively embodiment, energy storage equipment comprises the first accumulator 1 and the second accumulator 2 as shown in Figures 2 and 3, wherein:
The heat-releasing device of heat pump 16 and formed thermally coupled by the first accumulator 1 between external heat source and heat absorption adsorbent bed 7.Formed thermally coupled by the second accumulator 2 between the heat sink of heat pump 16 and thermal release device.
Separate operation by two accumulators, can avoid interacting between two accumulators.Certainly, also can by two accumulator designs be a large single accumulator as required.
As preferably or alternatively embodiment, energy storage equipment is connected by the heat-releasing device of the heat sink of heat catalysis transfer conduit and heat pump 16, thermal release device, heat pump 16 and/or external heat source, wherein: between the heat sink of heat pump 16 and thermal release device, the heat-releasing device of heat pump 16 and/or external heat source form thermally coupled by the heat catalysis (such as water) in heat catalysis transfer conduit and energy storage equipment separately and between heat absorption adsorbent bed 7.Adopt the mode of the heat transfer of the heat catalysis in heat catalysis transfer conduit with low cost, be convenient to arrange, process and manufacture.
As preferably or alternatively embodiment, thermal release device comprises the first thermal release device and the second thermal release device, wherein:
The heat sink three of the first thermal release device, the second thermal release device and heat pump 16 is connected with the second accumulator 2 by heat catalysis transfer conduit.
In heat catalysis transfer conduit between second thermal release device and the heat sink of heat pump 16 and the heat catalysis of the heat catalysis import of the second thermal release device and the second thermal release device export between heat catalysis transfer conduit on be provided with conducting control valve 17.
Heat catalysis transfer conduit between the heat catalysis import of the second thermal release device and the heat catalysis of the second thermal release device export makes the second thermal release device and the first thermal release device define parallel relationship, the second thermal release device can be able to be selected temporarily to disconnect by controlling conducting control valve 17 thus.
As preferably or alternatively embodiment, adsorb refrigerating device 15 comprises solution and smokes adsorbent bed 11, adsorption condensing device 8, absorption evaporimeter 10 and heat absorption adsorbent bed 7, wherein:
The heat absorption refrigerant outlet of adsorbent bed 7 is connected with the refrigerant inlet of adsorption condensing device 8.
The refrigerant outlet of adsorption condensing device 8 is connected with the refrigerant inlet of absorption evaporimeter 10.
The refrigerant outlet of absorption evaporimeter 10 is connected with the refrigerant inlet that solution smokes adsorbent bed 11.
Adsorption condensing device 8 forms the first thermal release device, and solution smokes adsorbent bed 11 and forms the second thermal release device.
The heat produced in adsorb refrigerating device 15 process of refrigerastion can all be absorbed by energy storage device and heat pump 16 and finally be supplied to the heat absorption adsorbent bed 7 of adsorb refrigerating device 15 by above-mentioned design, and the waste that not only avoid heat thus also substantially increases the refrigerating efficiency of adsorb refrigerating device 15.
As preferably or alternatively embodiment, adsorb refrigerating device 15 also comprises throttling arrangement 9, and the refrigerant outlet of adsorption condensing device 8 is connected by the refrigerant inlet of throttling arrangement 9 with absorption evaporimeter 10.Throttling arrangement 9 can adopt expansion valve to realize.Throttling arrangement 9 can reduce the pressure of cold-producing medium, to be conducive to cold-producing medium heat absorption in absorption evaporimeter 10, evaporation.
As preferably or alternatively embodiment, heat pump 16 comprises heat pump condenser 3, evaporator with heat pump 5 and compressor 6, wherein:
The refrigerant exit of compressor 6 is connected with the refrigerant inlet of heat pump condenser 3.
The refrigerant exit of heat pump condenser 3 is connected with the refrigerant inlet of evaporator with heat pump 5.
The refrigerant exit of evaporator with heat pump 5 is connected with the refrigerant inlet of compressor 6.
Heat pump condenser 3 forms the heat-releasing device of heat pump 16, and evaporator with heat pump 5 forms the heat sink of heat pump 16.
Heat pump 16 can realize heat energy efficiently by the transfer of cryogenic object to high temp objects, evaporator with heat pump 5 can be utilized thus to draw the waste heat of the release of adsorb refrigerating device 15 as heat sink for improving the temperature of the driving heat source of adsorb refrigerating device 15, to improve the refrigerating efficiency of adsorb refrigerating device 15.
As preferably or alternatively embodiment, heat pump 16 also comprises heat pump expansion valve 4, and the refrigerant exit of heat pump condenser 3 is connected with the refrigerant inlet of evaporator with heat pump 5 by heat pump expansion valve 4.Heat pump expansion valve 4 can reduce the pressure of refrigerant in heat pump 16, absorbs heat, evaporates to be conducive to refrigerant in evaporator with heat pump 5.
As preferably or alternatively embodiment, adsorb refrigerating device 15 comprises solution and smokes adsorbent bed 11, adsorption condensing device 8, absorption evaporimeter 10 and heat absorption adsorbent bed 7, wherein:
The heat absorption refrigerant outlet of adsorbent bed 7 is connected with the refrigerant inlet of adsorption condensing device 8.
The refrigerant outlet of adsorption condensing device 8 is connected with the refrigerant inlet of absorption evaporimeter 10.
The refrigerant outlet of absorption evaporimeter 10 is connected with the refrigerant inlet that solution smokes adsorbent bed 11.
Solution smokes adsorbent bed 11 and/or condenser forms thermal release device.
Solution smokes the cold-producing medium in adsorbent bed 11 can discharge certain heat in the process of desorb.Cold-producing medium in condenser also can discharge certain heat in condensation process, be no matter the heat that solution smokes the cold-producing medium release in adsorbent bed 11, or the heat of the cold-producing medium release in condenser all can carry out absorbing heat with the cold-producing medium be conducive in heat absorption adsorbent bed 7 with the temperature improving the heat absorption adsorbent bed 7 of adsorb refrigerating device 15 by heat pump 16, adsorption operation.
As preferably or alternatively embodiment, adsorb refrigerating device 15 also comprises throttling arrangement 9, and the refrigerant outlet of adsorption condensing device 8 is connected by the refrigerant inlet of throttling arrangement 9 with absorption evaporimeter 10.Throttling arrangement 9 can adopt expansion valve to realize.Throttling arrangement 9 can reduce the pressure of cold-producing medium, to be conducive to cold-producing medium heat absorption in absorption evaporimeter 10, evaporation.
As preferably or alternatively embodiment, solution smokes adsorbent bed 11 and forms thermal release device with condenser.Solution smokes adsorbent bed 11 all can produce certain heat in the course of the work with condenser, the refrigerating efficiency utilizing this heat to improve adsorb refrigerating device 15 by heat pump 16 can avoid the energy dissipation produced in adsorb refrigerating device 15 course of work, has energy-conservation advantage.
As preferably or alternatively embodiment, external heat source comprises solar heat-collection plate 12, waste heat of plant gathering-device 13 and water heater 14 one wherein, two or three.External heat source is preferably solar heat-collection plate 12, waste heat of plant gathering-device 13 and water heater 14 and includes.Water heater 14 can be gas heater 14 or electric heater 14.
The heat that external heat source comprises the release of solar heat-collection plate 12, waste heat of plant gathering-device 13 and water heater 14 all may be used for the temperature of the driving heat source improving adsorb refrigerating device 15 to improve the refrigerating capacity of adsorb refrigerating device 15.In addition, the various heating sources mode such as combustion gas (such as gas heater 14), waste heat of plant, solar energy that present invention incorporates provides thermal source for adsorbent bed, avoid the absorption refrigeration fluctuation of service based on low grade residual heat, solar energy equal energy source, thus improve low grade residual heat, solar energy equal energy source ease for use, contribute to promoting the share of these energy in energy resource consumption.
As preferably or alternatively embodiment, in heat pump 16, the evaporating temperature scope of refrigerant is 20 DEG C ~ 60 DEG C, and condensation temperature scope is 50 DEG C ~ 100 DEG C.The refrigerant of above-mentioned evaporating temperature and condensation temperature not only can play good refrigeration, and is convenient to control.
Arbitrary technical scheme disclosed in the invention described above unless otherwise stated, if the number range of it discloses, so disclosed number range is preferred number range, anyly it should be appreciated by those skilled in the art: preferred number range is only the numerical value that in many enforceable numerical value, technique effect is obvious or representative.Because numerical value is more, cannot be exhaustive, so the present invention just discloses component values to illustrate technical scheme of the present invention, and the above-mentioned numerical value enumerated should not form the restriction to the invention protection domain.
If employ the word such as " first ", " second " herein to limit parts, those skilled in the art should know: the use of " first ", " second " is only used to be convenient to describe carry out difference as not having outside Stated otherwise to parts, the implication that above-mentioned word is not special.
Simultaneously, if the invention described above discloses or relate to parts or the structural member of connection fastened to each other, so, unless otherwise stated, be fixedly connected with and can be understood as: can releasably be fixedly connected with (such as using bolt or screw to connect), also can be understood as: to be non-removablely fixedly connected with (such as rivet, weld), certainly, connection fastened to each other also can be replaced by integral type structure (such as use casting technique is integrally formed create) (obviously cannot adopt except integrally formed technique).
In addition, apply in arbitrary technical scheme disclosed in the invention described above for represent position relationship or shape term unless otherwise stated its implication comprise approximate with it, similar or close state or shape.Arbitrary parts provided by the invention both can be assembled by multiple independent part, and also can be one of the forming manufacture technics separate part out.
Finally should be noted that: above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit; Although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the field are to be understood that: still can modify to the specific embodiment of the present invention or carry out equivalent replacement to portion of techniques feature; And not departing from the spirit of technical solution of the present invention, it all should be encompassed in the middle of the technical scheme scope of request of the present invention protection.

Claims (15)

1. an adsorption refrigeration system, it is characterized in that, comprise adsorb refrigerating device (15) and heat pump (16), described heat pump (16) comprises heat sink and heat-releasing device, described adsorption refrigerating device comprises heat absorption adsorbent bed (7) and thermal release device, wherein:
The heat sink of described heat pump (16) and described thermal release device and/or outside unnecessary thermal source thermally coupled, and the heat sink of described heat pump (16) can from described thermal release device and/or outside unnecessary thermal source draw heat;
Heat-releasing device and the described heat absorption adsorbent bed (7) of described heat pump (16) are thermally coupled, and it can be given described heat absorption adsorbent bed (7) from the heat conduction of described thermal release device and/or described outside unnecessary thermal source absorption by described heat pump (16).
2. adsorption refrigeration system according to claim 1, is characterized in that, described adsorption refrigeration system also comprises energy storage equipment, wherein:
Between the heat sink of described heat pump (16) and described thermal release device, the heat-releasing device of described heat pump (16) and/or external heat source separately and formed thermally coupled by described energy storage equipment between described heat absorption adsorbent bed (7); Described energy storage equipment can conduct to cryogenic substance after putting aside a period of time from high temperature material draw heat.
3. adsorption refrigeration system according to claim 2, is characterized in that, described energy storage equipment comprises the first accumulator (1) and the second accumulator (2), wherein:
The heat-releasing device of described heat pump (16) and formed thermally coupled by described first accumulator (1) between described external heat source and described heat absorption adsorbent bed (7);
Formed thermally coupled by described second accumulator (2) between the heat sink of described heat pump (16) and described thermal release device.
4. adsorption refrigeration system according to claim 3, it is characterized in that, described energy storage equipment is connected by the heat-releasing device of heat catalysis transfer conduit and the heat sink of described heat pump (16), described thermal release device, described heat pump (16) and/or described external heat source, wherein:
Between the heat sink of described heat pump (16) and described thermal release device, the heat-releasing device of described heat pump (16) and/or described external heat source form thermally coupled by the heat catalysis in described heat catalysis transfer conduit and described energy storage equipment separately and between described heat absorption adsorbent bed (7).
5. adsorption refrigeration system according to claim 4, is characterized in that, described thermal release device comprises the first thermal release device and the second thermal release device, wherein:
The heat sink three of described first thermal release device, described second thermal release device and described heat pump (16) is connected with described second accumulator (2) by described heat catalysis transfer conduit;
In heat catalysis transfer conduit between the heat sink of described second thermal release device and described heat pump (16) and the heat catalysis of the heat catalysis import of described second thermal release device and described second thermal release device export between described heat catalysis transfer conduit on be provided with conducting control valve (17).
6. adsorption refrigeration system according to claim 5, it is characterized in that, described adsorb refrigerating device (15) comprises solution and smokes adsorbent bed (11), adsorption condensing device (8), absorption evaporimeter (10) and described heat absorption adsorbent bed (7), wherein:
The refrigerant outlet of described heat absorption adsorbent bed (7) is connected with the refrigerant inlet of described adsorption condensing device (8);
The refrigerant outlet of described adsorption condensing device (8) is connected with the refrigerant inlet of described absorption evaporimeter (10);
The refrigerant inlet that refrigerant outlet and the described solution of described absorption evaporimeter (10) smoke adsorbent bed (11) is connected;
Described adsorption condensing device (8) forms described first thermal release device, and described solution smokes adsorbent bed (11) and forms described second thermal release device.
7. adsorption refrigeration system according to claim 6, it is characterized in that, described adsorb refrigerating device (15) also comprises throttling arrangement (9), and the refrigerant outlet of described adsorption condensing device (8) is connected by the refrigerant inlet of described throttling arrangement (9) with described absorption evaporimeter (10).
8. adsorption refrigeration system according to claim 1, is characterized in that, described heat pump (16) comprises heat pump condenser (3), evaporator with heat pump (5) and compressor (6), wherein:
The refrigerant exit of described compressor (6) is connected with the refrigerant inlet of described heat pump condenser (3);
The refrigerant exit of described heat pump condenser (3) is connected with the refrigerant inlet of described evaporator with heat pump (5);
The refrigerant exit of described evaporator with heat pump (5) is connected with the refrigerant inlet of described compressor (6);
Described heat pump condenser (3) forms the heat-releasing device of described heat pump (16), and described evaporator with heat pump (5) forms the heat sink of described heat pump (16).
9. adsorption refrigeration system according to claim 8, it is characterized in that, described heat pump (16) also comprises heat pump expansion valve (4), and the refrigerant exit of described heat pump condenser (3) is connected with the refrigerant inlet of described evaporator with heat pump (5) by described heat pump expansion valve (4).
10. adsorption refrigeration system according to claim 1, it is characterized in that, described adsorb refrigerating device (15) comprises solution and smokes adsorbent bed (11), adsorption condensing device (8), absorption evaporimeter (10) and described heat absorption adsorbent bed (7), wherein:
The refrigerant outlet of described heat absorption adsorbent bed (7) is connected with the refrigerant inlet of described adsorption condensing device (8);
The refrigerant outlet of described adsorption condensing device (8) is connected with the refrigerant inlet of described absorption evaporimeter (10);
The refrigerant inlet that refrigerant outlet and the described solution of described absorption evaporimeter (10) smoke adsorbent bed (11) is connected;
Described solution smokes adsorbent bed (11) and/or described adsorption condensing device (8) forms described thermal release device.
11. adsorption refrigeration systems according to claim 10, it is characterized in that, described adsorb refrigerating device (15) also comprises throttling arrangement (9), and the refrigerant outlet of described adsorption condensing device (8) is connected by the refrigerant inlet of described throttling arrangement (9) with described absorption evaporimeter (10).
12. adsorption refrigeration systems according to claim 10, is characterized in that, described solution smokes adsorbent bed (11) and forms described thermal release device with described adsorption condensing device (8).
13. according to the arbitrary described adsorption refrigeration system of claim 1-12, it is characterized in that, described external heat source comprises solar heat-collection plate (12), waste heat of plant gathering-device (13) and water heater (14) one wherein, two or three.
14. adsorption refrigeration systems according to claim 13, is characterized in that, described water heater (14) is gas heater or electric heater.
15. according to the arbitrary described adsorption refrigeration system of claim 1-12, and it is characterized in that, the evaporating temperature scope of described heat pump (16) interior refrigerant is 20 DEG C ~ 60 DEG C, and condensation temperature scope is 50 DEG C ~ 100 DEG C.
CN201410734070.XA 2014-12-05 2014-12-05 Adsorption type refrigerating system Active CN104406322B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410734070.XA CN104406322B (en) 2014-12-05 2014-12-05 Adsorption type refrigerating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410734070.XA CN104406322B (en) 2014-12-05 2014-12-05 Adsorption type refrigerating system

Publications (2)

Publication Number Publication Date
CN104406322A true CN104406322A (en) 2015-03-11
CN104406322B CN104406322B (en) 2017-02-01

Family

ID=52643970

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410734070.XA Active CN104406322B (en) 2014-12-05 2014-12-05 Adsorption type refrigerating system

Country Status (1)

Country Link
CN (1) CN104406322B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6314744B1 (en) * 1998-05-01 2001-11-13 Toyota Jidosha Kabushiki Kaisha Air-conditioning system and operation control method thereof
CN2709884Y (en) * 2004-06-08 2005-07-13 河南新飞电器有限公司 Cold-storage air-conditioning system of cold producing by solar energy
CN1701208A (en) * 2003-06-09 2005-11-23 松下电器产业株式会社 Regenerative heat pump system
CN101354204A (en) * 2008-09-09 2009-01-28 上海理工大学 Triple supply method capable of implementing refrigeration, heating and heat water supply functions
CN102252480A (en) * 2011-05-19 2011-11-23 河南新飞电器有限公司 Solar energy refrigerator
CN104034084A (en) * 2014-06-23 2014-09-10 周永奎 Cooling and power combined supply method and device of adsorptive heat pump
CN204460825U (en) * 2014-12-05 2015-07-08 珠海格力电器股份有限公司 Adsorption type refrigerating system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6314744B1 (en) * 1998-05-01 2001-11-13 Toyota Jidosha Kabushiki Kaisha Air-conditioning system and operation control method thereof
CN1701208A (en) * 2003-06-09 2005-11-23 松下电器产业株式会社 Regenerative heat pump system
CN2709884Y (en) * 2004-06-08 2005-07-13 河南新飞电器有限公司 Cold-storage air-conditioning system of cold producing by solar energy
CN101354204A (en) * 2008-09-09 2009-01-28 上海理工大学 Triple supply method capable of implementing refrigeration, heating and heat water supply functions
CN102252480A (en) * 2011-05-19 2011-11-23 河南新飞电器有限公司 Solar energy refrigerator
CN104034084A (en) * 2014-06-23 2014-09-10 周永奎 Cooling and power combined supply method and device of adsorptive heat pump
CN204460825U (en) * 2014-12-05 2015-07-08 珠海格力电器股份有限公司 Adsorption type refrigerating system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
吴静怡,王如竹: "间歇热源驱动下的吸附式制冷系统运行特性研究", 《工程热物理学报》 *

Also Published As

Publication number Publication date
CN104406322B (en) 2017-02-01

Similar Documents

Publication Publication Date Title
CN204963286U (en) Changes in temperature type air conditioning system and single cold mould air conditioning system
CN203628875U (en) Radiator assembly, air conditioner and air conditioning system
CN105091395A (en) Cooling and heating type air-conditioner system and single-cooling type air-conditioner system
CN103574987A (en) Cold and hot multi-functional economizer system
CN204963284U (en) Changes in temperature type air conditioning system and single cold mould air conditioning system
CN104110756A (en) Movable ice storage type refrigerator and air conditioner all-in-one machine structure
CN103234301B (en) Air conditioner heat exchange system and control method thereof
CN102937315A (en) Refrigeration and cold accumulation system
CN104296454A (en) Refrigerator
CN104236177A (en) Phase-change heat storage and coolant supercooling heat exchanger and air conditioning system with same
CN204460825U (en) Adsorption type refrigerating system
CN103033021A (en) Refrigerator and air conditioner integrated machine
CN202304077U (en) Air-cooling heat pump unit
CN102494375A (en) Ultrahigh and low-temperature refrigerating, heating and water heating three-purpose air-conditioning system
CN204421238U (en) Air conditioner and heat storage device
CN102305496B (en) Air-cooled heat pump unit
CN204153898U (en) The hybrid system of ice-storage air-conditioning refrigerator integrated machine
CN104406322A (en) Adsorption type refrigerating system
CN205137996U (en) Air conditioner constant temperature dehydrating unit
CN201764753U (en) A piece of refrigerating equipment
CN102661634A (en) Air source heat pump integrated device capable of cooling, heating and supplying hot water
CN202630504U (en) Cold-heat integration device of air energy heat pump
CN202209772U (en) Wall-mounted air source heat pump water heater
CN203405030U (en) Air-conditioner energy saver
CN204177010U (en) Refrigerator

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant