CN104384708A - Laser processing method of chip packaging shell - Google Patents
Laser processing method of chip packaging shell Download PDFInfo
- Publication number
- CN104384708A CN104384708A CN201410526403.XA CN201410526403A CN104384708A CN 104384708 A CN104384708 A CN 104384708A CN 201410526403 A CN201410526403 A CN 201410526403A CN 104384708 A CN104384708 A CN 104384708A
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- CN
- China
- Prior art keywords
- laser processing
- chip package
- protective layer
- package shell
- shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser processing method of a chip packaging shell. The method can be widely applied to laser processing of the chip packaging shell, and comprises the following steps of providing a semi-finished product of the chip packaging shell, wherein the semi-finished product of the chip packaging shell is provided with a cavity for holding a chip; coating the bottom surface of the cavity and the four sides of the inner circumference of the cavity with protection layers; performing laser processing on the semi-finished product of the chip packaging shell to form a pattern corresponding to the chip; peeling the protection layers. The laser processing graph accuracy of the shell can be guaranteed, and meanwhile, the surface pollution of the shell is avoided; moreover, the protection layers can be peeled, so that the secondary pollution of the subsequent processing of the shell is avoided.
Description
Technical field
The present invention relates to microwave device and manufacture field, mainly relate to a kind of laser processing of chip package shell.
Background technology
Microwave device General Requirements can adapt to use in various different adverse circumstances, has strict requirement to the reliability of shell, and key factor is that the ceramic-metal encapsulation of requirement shell has high air-tightness and required precision.In order to meet air-tightness requirement, generally select solder by pottery and metal sealing.Along with the development of microwave device miniaturization, the integrated level of device uprises gradually.In order to realize highdensity package casing requirement, the chips welding district pattern edge of enclosure and the spacing of pottery are generally at tens microns.In order to meet required precision, the figure in General Requirements chips welding district can reach the automation paster that micron-sized tolerance grade has met chip.Laser Processing advantage is that precision is high, and shortcoming easily pollutes on inside the pottery of shell and surface the secondary attachment affecting chip, and make the appearance requirement of shell not up to standard.In order to solve the problem, the present invention proposes a kind of novel Laser Processing metal-ceramic packaging shell method.
Summary of the invention
In view of this, what the present invention proposed is a kind of laser processing of chip package shell, and the principal character of the method first armor coatedly carries out Laser Processing to shell again.By metal-ceramic packaging shell surface coating a kind of protective layer, after to be laser machined again by certain method by this protective layer peel off and not to case surface generation damage and pollution.
The invention provides a kind of laser processing of chip package shell, comprise the following steps: chip package shell semi-finished product described in are provided, there is the cavity of the described chip of an accommodation; Described cavity basal surface and interior Thursday side armor coated; Again Laser Processing is carried out to form described chip corresponding pattern to described package casing semi-finished product; Finally described protective layer is peeled off.
Further, described protective layer is formulated by a certain proportion of organic solvent.
Further, the component of described protective layer comprises terpinol 60%-70%, polyvinyl butyral resin 10%-20%, alcohol 10%-30%.
Further, described protective layer comprises terpinol 70%, thickener polyvinyl butyral resin 10%, etoh solvent 20%.
Further, described protective layer is peeled off by the mode selecting cleaning solution to soak.
Further, described detergent solution is acetone, isopropyl alcohol, benzinum.
Further, described protective layer is peeled off to comprise and described shell is immersed in 8-12 hour in the acetone solvent of uniform temperature.
Further, in described shell immersion process, select the hairbrush of certain degree of hardness by clean for the mixed pollutants grooming of the case surface after immersion.
Further, further comprising the steps of: the shell that described protective layer is peeled off to be dried or dries.
Compared with prior art, its advantage is in the present invention:
This method combines Laser Processing precision height and the free of contamination advantage of printed pattern.This method decreases the problem polluting ceramic inner walls in conventional laser processing metal-ceramic package process while effectively increasing Laser Processing pattern precision.The method can be widely used in the Laser Processing of metal-ceramic packaging shell.
Accompanying drawing explanation
Fig. 1 is the floor map of the present invention's chip package shell to be processed;
Fig. 2 is the generalized section of chip package shell of the present invention;
Fig. 3 is the laser processing flow chart of chip package shell of the present invention.
Detailed description of the invention
Fig. 1 is the floor map of chip package shell of the present invention.As shown in Figure 1, the present invention's chip to be laser machined is selectively metal-ceramic shell, and it comprises the cavity of the described chip of an accommodation, described cavity comprise basal surface and interior Thursday gusset become.Wherein, the main production of metal-ceramic shell is as follows: utilize silver-copper brazing alloy that different metal parts and pottery are welded into metal-ceramic shell in high precision temperature control stove.
The aluminium oxide that pottery is generally 95% by content is formed.The processing technology of pottery is as follows: by size accurately and on the green band of densification, utilize laser boring, micropore slip casting, tie, the technique such as accurate conductor paste printing makes required circuitous pattern and can weld metal layer, utilize laser to begin to speak, ceramic chips that the technique such as lamination makes required definite shape, molded the pottery of definite shape by high precision temperature control stove high temperature sintering.
Fig. 2 is the generalized section of chip package shell of the present invention.As shown in Figure 2, utilize silver-copper brazing alloy that different metal parts and pottery are welded into metal-ceramic shell in high precision temperature control stove.Wherein, weld-ring 1 can the selection of material be 4J42, and pottery 2 can the selection of material be 95% aluminium oxide, solder 3, solder 5 can the selection of material silver, copper, and heat sink 4 can select material B eO, and base 6 can the selection of material WuCu, lead-in wire 7 can the selection of material 4J42, and the figure 8 of laser cutting can select material oxidation beryllium.Encapsulate the chip of different model as required, utilize laser marking machine to cut into corresponding pattern in metal-ceramic enclosure.
Wherein, the value of the Edge Distance X of the figure 8 Edge Distance ceramic frame 9 of required cutting is at micron order.Because chamber 8 has and connects pottery and the silver-copper brazing alloy of metal in the enclosure, if directly select laser marking machine to carry out marking figure in metal-ceramic enclosure, under the high temperature action of laser, silver-copper brazing alloy can melt instantaneously and sputters to surrounding in divergent shape.The surface presentation vesicular texture of ceramic material, these are formed pollution by the ceramic segment that the solder bits of high temperature melt can be embedded in outer casing inner wall.Because metal-ceramic shell also needed to carry out gold-plated process on surface in the later stage, therefore above-mentioned pollution is unacceptable in actual use.
Fig. 3 is the laser processing flow chart of chip package shell of the present invention.As shown in Figure 3, the invention provides a kind of laser processing of chip package shell, comprise the following steps: chip package shell semi-finished product described in are provided, there is the cavity of the described chip of an accommodation; Described cavity basal surface and interior Thursday side armor coated; Again Laser Processing is carried out to form described chip corresponding pattern to described package casing semi-finished product; Finally described protective layer is peeled off.
Wherein, described protective layer is peeled off by the mode selecting cleaning solution to soak, and described detergent solution can be acetone, isopropyl alcohol, benzinum, and described protective layer is peeled off can be immersed in 8-12 hour in the acetone solvent of uniform temperature by described shell.In described shell immersion process, select the hairbrush of certain degree of hardness by clean for the mixed pollutants grooming of the case surface after immersion.Selectively, the shell that described protective layer is peeled off can be dried or dry finally.
Wherein, described protective layer is prepared by a certain proportion of organic solvent and protective layer can be allowed to reach best protection effect.If protective layer is too rare, liquid surface forms refraction thus cannot carry out high accuracy contraposition under camera lens when Laser Processing; If protective layer is too thick, smooth interface cannot be formed in chamber in the enclosure.Laser beam cannot make concentration of energy just cannot form clear smooth figure on surface due to the difference of the depth of field.Protective layer composition of the present invention mainly contains three kinds: main material terpinol, thickener polyvinyl butyral resin, etoh solvent.Its ratio is terpinol 60%-70%, polyvinyl butyral resin 10%-20%, alcohol 10%-30%.Preferably, the component of described protective layer comprises main material terpinol 70%, thickener polyvinyl butyral resin 10%, etoh solvent 20%.Method armor coated before Laser Processing is utilized to avoid shell to pollute.
This method combines Laser Processing precision height and the free of contamination advantage of printed pattern.This method decreases the problem polluting ceramic inner walls in conventional laser processing metal-ceramic package process while effectively increasing Laser Processing pattern precision.The method can be widely used in the Laser Processing of metal-ceramic packaging shell.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned embodiment, within the scope of technical conceive of the present invention; can carry out multiple equivalents to technical scheme of the present invention, these equivalents all belong to protection scope of the present invention.
It should be noted that in addition, each the concrete technical characteristic described in above-mentioned detailed description of the invention, in reconcilable situation, can be combined by any suitable mode.In order to avoid unnecessary repetition, the present invention illustrates no longer separately to various possible combination.
Claims (9)
1. a laser processing for chip package shell, comprises the following steps:
Chip package shell semi-finished product described in one are provided, there is the cavity of the described chip of an accommodation;
Described cavity basal surface and interior Thursday side armor coated;
Again Laser Processing is carried out to form described chip corresponding pattern to described package casing semi-finished product;
Finally described protective layer is peeled off.
2. the laser processing of chip package shell according to claim 1, is characterized in that: described protective layer is formulated by a certain proportion of organic solvent.
3. the laser processing of chip package shell according to claim 2, is characterized in that: the component of described protective layer comprises terpinol 60%-70%, polyvinyl butyral resin 10%-20%, alcohol 10%-30%.
4. the laser processing of chip package shell according to claim 3, is characterized in that: described protective layer comprises terpinol 70%, thickener polyvinyl butyral resin 10%, etoh solvent 20%.
5. the laser processing of chip package shell according to claim 1, is characterized in that: described protective layer is peeled off by the mode selecting cleaning solution to soak.
6. the laser processing of chip package shell according to claim 5, is characterized in that: described detergent solution is acetone, isopropyl alcohol, benzinum.
7. the laser processing of chip package shell according to claim 1, is characterized in that: described protective layer is peeled off to comprise and described shell is immersed in 8-12 hour in the acetone solvent of uniform temperature.
8. the laser processing of chip package shell according to claim 7, is characterized in that: in described shell immersion process, selects the hairbrush of certain degree of hardness by clean for the mixed pollutants grooming of the case surface after immersion.
9. the laser processing of chip package shell according to claim 8, is characterized in that: further comprising the steps of: dried by the shell that described protective layer is peeled off or dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410526403.XA CN104384708A (en) | 2014-10-08 | 2014-10-08 | Laser processing method of chip packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410526403.XA CN104384708A (en) | 2014-10-08 | 2014-10-08 | Laser processing method of chip packaging shell |
Publications (1)
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| CN104384708A true CN104384708A (en) | 2015-03-04 |
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Family Applications (1)
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| CN201410526403.XA Pending CN104384708A (en) | 2014-10-08 | 2014-10-08 | Laser processing method of chip packaging shell |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS59151130A (en) * | 1983-02-18 | 1984-08-29 | Hitachi Ltd | Liquid crystal display element |
| EP0772213A1 (en) * | 1995-11-01 | 1997-05-07 | Fuji Polymertech Co., Ltd | Manufacturing method for key tops |
| CN1309527A (en) * | 1999-12-16 | 2001-08-22 | 松下电器产业株式会社 | Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
| CN1579697A (en) * | 2003-08-07 | 2005-02-16 | 鸿富锦精密工业（深圳）有限公司 | Laser working method |
| JP2006140311A (en) * | 2004-11-12 | 2006-06-01 | Tokyo Ohka Kogyo Co Ltd | Protective film agent used for laser dicing and method of processing wafer using the same |
| CN101889056A (en) * | 2007-12-07 | 2010-11-17 | 电气化学工业株式会社 | Protective film for laser processing and processing method using the same |
| CN102131878A (en) * | 2008-08-27 | 2011-07-20 | 日东电工株式会社 | Adhesive tape or sheet |
| CN102324904A (en) * | 2011-05-19 | 2012-01-18 | 应达利电子(深圳)有限公司 | Manufacturing method of packaging body for quartz crystal resonator or oscillator |
| JP4873843B2 (en) * | 2004-07-28 | 2012-02-08 | 日東電工株式会社 | Manufacturing method of laser processed products |
| CN103028848A (en) * | 2012-12-06 | 2013-04-10 | 中国电子科技集团公司第四十一研究所 | Method for machining medium substrate by utilizing laser |
| CN203747234U (en) * | 2014-02-28 | 2014-07-30 | 深圳市宏钢机械设备有限公司 | Packaging outer shell for laser device of CTP printing industry |
-
2014
- 2014-10-08 CN CN201410526403.XA patent/CN104384708A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151130A (en) * | 1983-02-18 | 1984-08-29 | Hitachi Ltd | Liquid crystal display element |
| EP0772213A1 (en) * | 1995-11-01 | 1997-05-07 | Fuji Polymertech Co., Ltd | Manufacturing method for key tops |
| CN1309527A (en) * | 1999-12-16 | 2001-08-22 | 松下电器产业株式会社 | Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
| CN1579697A (en) * | 2003-08-07 | 2005-02-16 | 鸿富锦精密工业（深圳）有限公司 | Laser working method |
| JP4873843B2 (en) * | 2004-07-28 | 2012-02-08 | 日東電工株式会社 | Manufacturing method of laser processed products |
| JP2006140311A (en) * | 2004-11-12 | 2006-06-01 | Tokyo Ohka Kogyo Co Ltd | Protective film agent used for laser dicing and method of processing wafer using the same |
| CN101889056A (en) * | 2007-12-07 | 2010-11-17 | 电气化学工业株式会社 | Protective film for laser processing and processing method using the same |
| CN102131878A (en) * | 2008-08-27 | 2011-07-20 | 日东电工株式会社 | Adhesive tape or sheet |
| CN102324904A (en) * | 2011-05-19 | 2012-01-18 | 应达利电子(深圳)有限公司 | Manufacturing method of packaging body for quartz crystal resonator or oscillator |
| CN103028848A (en) * | 2012-12-06 | 2013-04-10 | 中国电子科技集团公司第四十一研究所 | Method for machining medium substrate by utilizing laser |
| CN203747234U (en) * | 2014-02-28 | 2014-07-30 | 深圳市宏钢机械设备有限公司 | Packaging outer shell for laser device of CTP printing industry |
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Application publication date: 20150304 |