CN104362113A - Semiconductor wafer cooling apparatus - Google Patents
Semiconductor wafer cooling apparatus Download PDFInfo
- Publication number
- CN104362113A CN104362113A CN201410488398.8A CN201410488398A CN104362113A CN 104362113 A CN104362113 A CN 104362113A CN 201410488398 A CN201410488398 A CN 201410488398A CN 104362113 A CN104362113 A CN 104362113A
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- semiconductor wafer
- cooling pipe
- pallet
- mounting surface
- cooling
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 157
- 238000001816 cooling Methods 0.000 title claims abstract description 130
- 239000002826 coolant Substances 0.000 claims abstract description 52
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 113
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 14
- 239000000498 cooling water Substances 0.000 description 10
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 3
- 230000003292 diminished effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
To provide a semiconductor wafer cooling apparatus which cools a semiconductor wafer that is an irradiated object while inhibiting temperature variation of the semiconductor wafer. The semiconductor wafer cooling apparatus of the present invention comprises a tray 1 having a loading surface on which semiconductor wafers 10 are loaded, a cooling pipeline 2 in which flows coolant for cooling the semiconductor wafers 10 loaded on the loading surface, and a vacuum pipeline 3 having openings on the loading surface and provided in a tray 1 for absorbing the semiconductor wafers 10 loaded on the loading surface.
Description
The application is the divisional application that the Chinese application number 201110180911.3 proposed based on June 30th, 2011 applies for (semiconductor Wafer Cooling Device), below quotes its content.
Technical field
The present invention relates to and possess such as loading and the semiconductor Wafer Cooling Device of the pallet cooled as the semiconductor wafer of shone thing during irradiation radioactive ray.
Background technology
Electronics in p-type semiconductor material is carried out the life-span that time of compound or compound is carried out in hole in n-type semiconductor time are called minority carrier.In order to minority carrier more promptly compound residual after conducting, need to control the life-span, this life control is by spreading the heavy metal of gold, platinum etc., or the charged particle irradiating electronics, proton etc. carries out.
In order to prevent the temperature of the semiconductor wafer in such radiation exposure operation from rising, to the cooling pipe that the pallet coolant that arranges cooling water etc. of mounting semiconductor wafer flows through, wafer is cooled.Such as, in the electron beam irradiation delivery device for treated objects recorded in patent documentation 1, become following structure, that is, be configured with cooling pipe the inside of cooled plate that the pallet with mounting treated object touches is snakelike, by the cooling water flow through in this cooling pipe, treated object cooled.
Patent documentation 1: Japanese Unexamined Patent Publication 10-312764 publication.
By snakelike configuration cooling pipe as described in Patent Document 1, can be cooled by the whole face of 1 cooling pipe to pallet.; in the configuration structure of such cooling pipe; due to be arranged in the part directly over cooling pipe different with the cooling performance of the part pallet be positioned at directly over pipeline enclosure; so according to the contact position of semiconductor wafer and pallet, even if also produce temperature difference in single wafer.And then, because in upstream and downstream, the temperature of coolant is different, so according to the mounting position on pallet, produce temperature difference between wafer.
In addition, when the semiconductor wafer as shone thing has warpage, in same semiconductor wafer, produce the part contacted with pallet and discontiguous part, produce temperature difference in these sections.
Due to such in the face of semiconductor wafer, the temperature difference that produces between wafer, cause the problem producing deviation in the life-span of the semiconductor element made cutting out from semiconductor wafer, other electrical characteristic.
Summary of the invention
The present invention is point in view of the above problems, and its object is to provides a kind of semiconductor Wafer Cooling Device, such as, in radiation exposure operation, suppress the temperature deviation of the semiconductor wafer as shone thing to cool.
For solving the scheme of problem
Semiconductor Wafer Cooling Device of the present invention, possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; Cooling pipe, is configured in described pallet, flows through the coolant cooled the described semiconductor wafer loaded in described mounting surface; And vacuum pipe, in described mounting surface, there is opening and be arranged on described pallet, the described semiconductor wafer that described mounting surface loads is adsorbed.
2nd semiconductor Wafer Cooling Device of the present invention possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; And a cooling pipe, configure to lapel shape between two ends in described pallet, flow through the coolant that the described semiconductor wafer loaded in described mounting surface is cooled, when by the square chips cut out from described semiconductor wafer while be set to a (mm), the sidewall thickness of described cooling pipe is set to b (mm), the distance c (mm) of the adjacent pipeline of described cooling pipe meets:
[numerical expression 1]
3rd semiconductor Wafer Cooling Device of the present invention possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; And a pair cooling pipe, be configured in described pallet, flow through the coolant that the described semiconductor wafer loaded in described mounting surface is cooled, each of described cooling pipe is the structure be connected in parallel by multiple pipeline, and the pipeline forming the described cooling pipe of a side alternately configures with the pipeline of the described cooling pipe forming the opposing party in the face parallel with described mounting surface.
4th semiconductor Wafer Cooling Device of the present invention possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; Cooling pipe, is configured in described pallet, flows through the coolant cooled the described semiconductor wafer loaded in described mounting surface; And hold-down ring, the peripheral part of the described semiconductor wafer that described mounting surface loads is abutted from the opposition side of described mounting surface, described semiconductor wafer is pressed into described mounting surface.
5th semiconductor Wafer Cooling Device of the present invention possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; And cooling pipe, arrange in planar throughout described mounting surface in described pallet, flow through the coolant that the described semiconductor wafer loaded in described mounting surface is cooled.
6th semiconductor Wafer Cooling Device of the present invention possesses: pallet, and it has the mounting surface of mounting semiconductor wafer; Cooling pipe, is configured in described pallet, flows through the coolant cooled the described semiconductor wafer loaded in described mounting surface; And coolant flow path direction switch unit, the flow direction of the coolant in described cooling pipe is switched.
The effect of invention
1st semiconductor Wafer Cooling Device of the present invention is owing to possessing: have opening in mounting surface and be arranged on pallet, to the vacuum pipe that the semiconductor wafer loaded in mounting surface adsorbs, therefore, it is possible to suppress the unilateral interior temperature difference of semiconductor die.
In the 2nd semiconductor Wafer Cooling Device of the present invention, when by the square chips cut out from described semiconductor wafer while be set to a (mm), the sidewall thickness of described cooling pipe is set to b (mm), met by the distance c (mm) of the adjacent pipeline of cooling pipe:
[numerical expression 1]
, thus at least immediately below the scope of more than 1/2 of square chips, form cooling pipe 2, therefore cooling effectiveness improves.
In the 3rd semiconductor Wafer Cooling Device of the present invention, each of a pair cooling pipe is the structure be connected in parallel by multiple pipeline, the pipeline forming the described cooling pipe of a side alternately configures with the pipeline of the described cooling pipe forming the opposing party in the face parallel with described mounting surface, and each pipeline becomes equal with the distance of semiconductor wafer thus.If make the flow direction of the cooling water in cooling pipe 2a, 2b on the contrary towards, any place semiconductor wafer being positioned in pallet can cool equably, and the temperature between wafer can be suppressed uneven.
In the 4th semiconductor Wafer Cooling Device of the present invention, described semiconductor wafer is pressed into the hold-down ring of described mounting surface by abutting from the opposition side of described mounting surface the peripheral part of the semiconductor wafer loaded in mounting surface, the adhesion of the mounting surface of semiconductor wafer and pallet improves, therefore whole of semiconductor wafer is uniformly cooled by pallet, suppresses the temperature in wafer face uneven.
In the 5th semiconductor Wafer Cooling Device of the present invention, owing to possessing: in described pallet throughout mounting surface arrange in planar, flow through cooling pipe to the coolant that the semiconductor wafer loaded in mounting surface cools, so whole of pallet can be cooled equably, suppress the temperature difference in wafer face.
In the 6th semiconductor Wafer Cooling Device of the present invention, owing to possessing: the coolant flow path direction switch unit switched the flow direction of the coolant in described cooling pipe, so the temperature difference produced in the upstream side and downstream of coolant stream can be relaxed, suppress the temperature difference between wafer.
Accompanying drawing explanation
Fig. 1 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 1.
Fig. 2 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 2.
Fig. 3 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 3.
Fig. 4 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 3.
Fig. 5 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 4.
Fig. 6 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 4.
Fig. 7 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 5.
Fig. 8 is the structure chart of the variation of the semiconductor Wafer Cooling Device of execution mode 5.
Fig. 9 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 6.
Embodiment
(execution mode 1)
Fig. 1 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 1, and Fig. 1 (a) is plane graph, and Fig. 1 (b) is the A-A profile in Fig. 1 (a).
In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 in its mounting surface.Be formed with cooling pipe 2 in the inside of pallet 1, carried out the cooling of semiconductor wafer 10 by the coolant of the such as cooling water that flows through in cooling pipe 2 etc.Such as, cooling pipe 2, as shown in Fig. 1 (a), is 1 cooling pipe configuring to lapel shape (snakelike configuration) between the two ends of pallet 1.
And then in the inside of pallet 1, not disturb the mode of cooling pipe 2 to form vacuum pipe 3, form the opening of vacuum pipe 3 in the mounting surface of pallet 1.The inside of vacuum pipe 3 is in the state be depressurized by vacuum pump, semiconductor wafer 10 vacuum suction can be made in the mounting surface of pallet 1 by the opening arranged in the mounting surface of pallet 1.
That is, the semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, has the mounting surface of mounting semiconductor wafer 10; Cooling pipe 2, is configured in pallet 1, flows through the coolant cooled the semiconductor wafer 10 loaded in mounting surface; And vacuum pipe 3, in mounting surface, there is opening and be arranged on pallet 1, the semiconductor wafer 10 that mounting surface loads is adsorbed.By with vacuum pipe 3, by vacuum suction, semiconductor wafer 10 does not arrange gap relative to pallet 1, its whole contacts with pallet 1.Because whole of semiconductor wafer 10 is cooled uniformly across pallet 1, so obtain the uneven effect diminished of temperature in wafer face.
Further, illustrated example when arranging the opening of vacuum pipe 3 in the mode at the center being positioned at semiconductor wafer 10 in Fig. 1, but by increasing the quantity of opening, the adhesion of semiconductor wafer 10 and pallet 1 can be improved further.
< effect >
Semiconductor Wafer Cooling Device according to the present embodiment, as described, obtains following effect.That is, the semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, has the mounting surface of mounting semiconductor wafer 10; Cooling pipe 2, is configured in pallet 1, flows through the coolant cooled the semiconductor wafer 10 loaded in mounting surface; And vacuum pipe 3, in mounting surface, there is opening and be arranged on pallet 1, the semiconductor wafer 10 that mounting surface loads is adsorbed.By with vacuum pipe 3 by vacuum suction, semiconductor wafer 10 does not arrange gap relative to pallet 1, its whole contacts with pallet 1, and therefore whole of semiconductor wafer 10 is cooled uniformly across pallet 1, obtains the effect that the temperature inequality in wafer face diminishes.
(execution mode 2)
Fig. 2 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 2.In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 (with reference to Fig. 1) in its mounting surface.Be formed with cooling pipe 2 in the inside of pallet 1, by the coolant of the such as cooling water that flows through in cooling pipe 2 etc., carry out the cooling of semiconductor wafer 10.Cooling pipe 2 is 1 cooling pipe configuring to lapel shape (snakelike configuration) between the two ends of pallet 1.
When by the square chips cut out from semiconductor wafer 10 while be set to a (mm), the sidewall thickness of cooling pipe 2 is set to b (mm), distance (pipeline enclosure every) c (mm) of the adjacent pipeline of cooling pipe 2 is met:
[numerical expression 2]
。Such as when by square chips while be set to a=22.5 (mm), when the sidewall thickness of cooling pipe 2 being set to b=1.25 (mm), pipeline enclosure is every c≤8.75 (mm).By such structure, owing at least forming cooling pipe 2 immediately below the scope of more than 1/2 of square chips, so cooling effectiveness improves.
If further, be applied in the vacuum pipe 3 described in execution mode 1 to the semiconductor Wafer Cooling Device of present embodiment, the temperature inequality in wafer face can also be made to diminish outside cooling effectiveness improves.
< effect >
Semiconductor Wafer Cooling Device according to the present embodiment, obtains following effect as described.Namely, in the semiconductor Wafer Cooling Device of present embodiment, cooling pipe 2 is 1 cooling pipe configured to lapel shape between two ends in pallet 1, when by the square chips cut out from semiconductor wafer 10 while be set to a (mm), the sidewall thickness of cooling pipe 2 is set to b (mm), numerical expression (1) is met by making the distance c of the adjacent channel of cooling pipe 2 (mm), thus at least immediately below the scope of more than 1/2 of square chips, form cooling pipe 2, therefore cooling effectiveness improves.
(execution mode 3)
Fig. 3, Fig. 4 are the structure charts of the semiconductor Wafer Cooling Device of execution mode 3.In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 (with reference to Fig. 1) in its mounting surface.Be formed with a pair cooling pipe 2a, 2b in the inside of pallet 1, by the coolant of the such as cooling water that flows through at mutual rightabout in cooling pipe 2a, 2b etc., carry out the cooling of semiconductor wafer 10.
Cooling pipe 2a, 2b are the structure be connected in parallel by multiple lateral respectively, and the lateral of cooling pipe 2a alternately configures in the face parallel with the mounting surface of pallet 1 with the lateral of cooling pipe 2b.
Fig. 4 (a) is the figure observing cooling pipe 2a, 2b from the rear side (face contrary with mounting surface) of pallet 1, Fig. 4 (b) is the figure observing cooling pipe 2a, 2b from the A side of Fig. 4 (a), Fig. 4 (c) is the figure observing cooling pipe 2a, 2b from the B side of Fig. 4 (a), Fig. 4 (d) is the figure observing cooling pipe 2a, 2b from the C side of Fig. 3.
Because the multiple pipelines forming cooling pipe 2a, 2b alternately configure in the face parallel with the mounting surface of pallet 1, so the distance of each pipeline and semiconductor wafer 10 is equal, and then due in cooling pipe 2a, 2b the flow direction of cooling water different, so any place semiconductor wafer 10 being positioned in pallet 1 can both cool equably, the temperature between wafer can be suppressed uneven.
In addition, by making cooling pipe 2b move to the rear side of pallet 1 in the both ends of pallet 1, thus mutually cooling pipe 2a, 2b is not arranged in the short dimensional directions of pallet 1 intrusively.
If further, be applied in the vacuum pipe 3 described in execution mode 1 to the semiconductor Wafer Cooling Device of present embodiment, the temperature between wafer can be suppressed uneven, and the temperature inequality in wafer face is diminished.
< effect >
The semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, and it has the mounting surface of mounting semiconductor wafer 10; And a pair cooling pipe 2a, 2b, the coolant that the semiconductor wafer 10 be placed in mounting surface is cooled is flow through in mutually opposite direction, cooling pipe 2a, 2b are the structure be connected in parallel by many laterals respectively, and the lateral forming the cooling pipe 2a of a side alternately configures with the lateral of the cooling pipe 2b forming the opposing party in the face parallel with described mounting surface.Thus, suppress the temperature on pallet 1 uneven, the temperature deviation therefore between wafer, in wafer face reduces.
(execution mode 4)
Fig. 5 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 4.Fig. 5 (a) is the plane graph of pallet 1, and Fig. 5 (b) is the B-B profile of Fig. 5 (a).In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 in its mounting surface.Be formed with cooling pipe 2 in the inside of pallet 1, by the coolant of the such as cooling water that flows through in cooling pipe 2 etc., carry out the cooling of semiconductor wafer 10.Cooling pipe 2 is such as 1 cooling pipe configuring to lapel shape (snakelike configuration) between the two ends of pallet 1.
And then the semiconductor Wafer Cooling Device of present embodiment possesses: hold-down ring 4, the mounting surface of the peripheral part of semiconductor wafer 10 for pallet 1 is pressed.Various structure can be considered to hold-down ring 4, but such as in the hold-down ring 4 shown in Fig. 5 (b), 3 legs do not imbed the inside of pallet 1 intrusively with cooling pipe 2, utilize motor driven to move in the vertical direction relative to the mounting surface of pallet 1 by this leg, thus the peripheral part of hold-down ring 4 pairs of semiconductor wafers 10 abut, pressing.
Thus, the adhesion of the mounting surface of semiconductor wafer 10 and pallet 1 improves, and therefore whole of semiconductor wafer 10 is cooled uniformly across pallet 1, obtains the effect that the temperature inequality in wafer face diminishes.
Or as shown in Figure 6, adopt and integrally form screw 1a with pallet 1, the structure using knurled nut 5 hold-down ring 4 to be pressed into the mounting surface of pallet 1 from top also can.Do not need the structural elements imbedding pallet 1 in this case, therefore, it is possible to do not consider the hold-down ring of configuration intrusively 4 with cooling pipe 2.
Further, also can be applied in the semiconductor Wafer Cooling Device of present embodiment the structure described in execution mode 1 ~ 3.
< effect >
The semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, has the mounting surface of mounting semiconductor wafer 10; Cooling pipe 2, is configured in pallet 1, flows through the coolant cooled the semiconductor wafer 10 loaded in mounting surface; And hold-down ring 4, the peripheral part of the semiconductor wafer 10 that mounting surface loads is abutted from the opposition side of mounting surface, semiconductor wafer 10 is pressed into mounting surface.Thus, the adhesion of the mounting surface of semiconductor wafer 10 and pallet 1 improves, and therefore whole of semiconductor wafer 10 is cooled uniformly across pallet 1, obtains the effect that the temperature inequality in wafer face diminishes.
(execution mode 5)
Fig. 7 is the structure chart of the semiconductor Wafer Cooling Device of execution mode 5.Fig. 7 (a) is the plane graph of semiconductor Wafer Cooling Device, and Fig. 7 (b), (c) are the C-C profiles of Fig. 7 (a).In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 (with reference to Fig. 1) in its mounting surface.As shown in Fig. 7 (a), in the semiconductor Wafer Cooling Device of present embodiment, the inside of pallet 1 becomes hollow shape.
In other words, in pallet 1, mounting surface is provided with the cooling pipe 6 of planar, by the coolant of the such as cooling water that flows through in cooling pipe 6 etc., carries out the cooling of semiconductor wafer 10.If the words of common cooling pipe, have directly over the part of pipeline in pallet 1 and do not have to produce temperature difference directly over the part of pipeline (pipeline enclosure), but by arranging the cooling pipe 6 of planar like this, the whole face of pallet 1 is cooled equably, can suppress the temperature difference in wafer face.
In Fig. 7 (b), illustrate the situation having the cooling pipe 6 that 1 planar is only set, but as shown in Fig. 7 (c), adopt and also can close to the 1st cooling pipe 6a of mounting surface side and 2 Rotating fields of the 2nd cooling pipe 6b that arrange in the side contrary with mounting surface relative to the 1st cooling pipe 6a.By make in cooling pipe 6a, 6b coolant flow path direction on the contrary towards, the upstream side of cooling pipe 6a, 6b and the temperature difference in downstream are relaxed, and can suppress the temperature difference between wafer.
Further, the semiconductor Wafer Cooling Device by the coolant flow path direction switch unit of execution mode 6 described later being applied to Fig. 7 (b), the temperature difference between wafer can be suppressed further.
< variation >
Fig. 8 is the plane graph of the structure of the variation of the semiconductor Wafer Cooling Device representing present embodiment.In variation, the outflow path that feed path cooling pipe 6 being imported to coolant and the coolant that have passed cooling pipe 6 externally flow out is arranged multiple respectively.Illustrate in fig. 8 and have the situation being provided with 3 paths respectively.By making the feed path of coolant and outflow path along separate routes for multiple like this, thus coolant is prevented to be trapped in cooling pipe 6.
< effect >
The semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, has the mounting surface of mounting semiconductor wafer 10; And cooling pipe 6, arrange in planar throughout mounting surface in pallet 1, flow through the coolant cooled the semiconductor wafer 10 loaded in mounting surface, therefore the whole face of pallet 1 is cooled equably, can suppress the temperature difference in wafer face.
In addition, cooling pipe 6 is made to possess the 1st cooling pipe 6a arranged in mounting surface side and the 2nd cooling pipe 6b arranged in the opposition side with mounting surface relative to the 1st cooling pipe 6a, if make coolant flow through in mutually opposite direction in the 1st, the 2nd cooling pipe 6a, 6b, the upstream side of cooling pipe 6a, 6b and the temperature difference in downstream are relaxed, and can suppress the temperature difference between wafer.
And then, by possessing multiple feed path coolant being imported cooling pipe 6 and the multiple outflow paths making coolant externally flow out from cooling pipe 6, thus prevent coolant to be trapped in cooling pipe 6.
(execution mode 6)
Fig. 9 is the structure chart of the semiconductor Wafer Cooling Device of present embodiment.In the semiconductor Wafer Cooling Device of present embodiment, in pallet 1, load multiple semiconductor wafer 10 in its mounting surface.Be formed with cooling pipe 2 in the inside of pallet 1, by the coolant of the such as cooling water that flows through in cooling pipe 2 etc., carry out the cooling of semiconductor wafer 10.Such as, cooling pipe 2 as shown in Figure 9, is 1 cooling pipe configuring to lapel shape (snakelike configuration) between the two ends of pallet 1.
And then, possess the coolant flow path direction switch unit of the flow direction of the coolant switched in cooling pipe 2 in the present embodiment.Fig. 9 represents an example of coolant flow path direction switch unit, and the feed path of cooling pipe 2 and outflow path link to link pipeline 9a, feed path and outflow path are linked to link pipeline 9b at the upstream side linking pipeline 9a.Pipeline valve 8b, 8a are set respectively at link pipeline 9a, 9b, between link pipeline 9a, 9b, are respectively arranged with pipeline valve 7a, 7b in feed path and outflow path each.It is more than the structure of coolant flow path direction switch unit.
As opening conduits valve 7a, 7b and closing duct valve 8a, 8b time, coolant is flow through in solid arrow direction in the drawings, as closing duct valve 7a, 7b and opening conduits valve 8a, 8b time, coolant is flow through in dotted arrow direction in the drawings.By switching coolant flow path direction like this aptly, the temperature difference produced in upstream side and downstream of coolant stream can be relaxed.The temperature difference between wafer can be suppressed thus.
Further, the coolant flow path direction switch unit of present embodiment can be applied to the semiconductor Wafer Cooling Device of execution mode 1,2,4,5, the effect of the temperature difference suppressed between wafer can be obtained.
< effect >
The semiconductor Wafer Cooling Device of present embodiment possesses: pallet 1, has the mounting surface of mounting semiconductor wafer 10; Cooling pipe 2, is configured in pallet 1, flows through the coolant cooled the semiconductor wafer 10 loaded in mounting surface; And coolant flow path direction switch unit, the flow direction of the coolant in cooling pipe 2 is switched.Thereby, it is possible to relax the temperature difference produced in upstream side and downstream of coolant, suppress the temperature difference between wafer.
(other)
Above, describe the present invention for various embodiment, but also these embodiments can be combined aptly and implement the present invention.
Description of reference numerals
1 pallet; 1a screw; 2,2a, 2b, 6,6a, 6b cooling pipe; 3 vacuum pipes; 4 hold-down rings; 5 knurled nuts; 7a, 7b, 8a, 8b pipeline valve; 9a, 9b link pipeline; 10 semiconductor wafers.
Claims (3)
1. a semiconductor Wafer Cooling Device, wherein, possesses:
Pallet, it has the mounting surface of mounting semiconductor wafer;
Cooling pipe, is configured in described pallet, flows through the coolant cooled the described semiconductor wafer loaded in described mounting surface; And
Vacuum pipe, has opening in described mounting surface and is arranged on described pallet, adsorbs the described semiconductor wafer loaded in described mounting surface,
Described cooling pipe is a pair cooling pipe that described coolant flows through at mutual rightabout,
Each of described cooling pipe is the structure be connected in parallel by multiple lateral,
The lateral forming the described cooling pipe of a side alternately configures with the lateral of the described cooling pipe forming the opposing party in the face parallel with described mounting surface.
2. a semiconductor Wafer Cooling Device, wherein, possesses:
Pallet, it has the mounting surface of mounting semiconductor wafer; And
A pair cooling pipe, is configured in described pallet, flows through the coolant cooled the described semiconductor wafer loaded in described mounting surface at mutual rightabout,
Each of described cooling pipe is the structure be connected in parallel by multiple lateral,
The lateral forming the described cooling pipe of a side alternately configures with the lateral of the described cooling pipe forming the opposing party in the face parallel with described mounting surface.
3. semiconductor Wafer Cooling Device according to claim 1 and 2, wherein, also possess: hold-down ring, the peripheral part of the described semiconductor wafer that described mounting surface loads is abutted from the opposition side of described mounting surface, described semiconductor wafer is pressed into described mounting surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010182728A JP5535003B2 (en) | 2010-08-18 | 2010-08-18 | Semiconductor wafer cooling system |
| JP2010-182728 | 2010-08-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101809113A Division CN102376527A (en) | 2010-08-18 | 2011-06-30 | Semiconductor Wafer Cooling Device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104362113A true CN104362113A (en) | 2015-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410488398.8A Pending CN104362113A (en) | 2010-08-18 | 2011-06-30 | Semiconductor wafer cooling apparatus |
| CN2011101809113A Pending CN102376527A (en) | 2010-08-18 | 2011-06-30 | Semiconductor Wafer Cooling Device |
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| JP2018125461A (en) * | 2017-02-02 | 2018-08-09 | 東京エレクトロン株式会社 | Workpiece processing device |
| JP7330017B2 (en) * | 2019-08-22 | 2023-08-21 | 東京エレクトロン株式会社 | HEAT MEDIUM CIRCUIT SYSTEM AND HEAT MEDIUM CIRCUIT SYSTEM CONTROL METHOD |
| CN112917108B (en) * | 2021-03-15 | 2022-05-27 | 宁波江丰电子材料股份有限公司 | Cooling disc body and processing method and application thereof |
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- 2011-06-30 CN CN2011101809113A patent/CN102376527A/en active Pending
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| KR101294114B1 (en) | 2013-08-08 |
| JP5535003B2 (en) | 2014-07-02 |
| DE102011079806B4 (en) | 2022-01-13 |
| DE102011079806A1 (en) | 2012-02-23 |
| CN102376527A (en) | 2012-03-14 |
| KR20120022619A (en) | 2012-03-12 |
| JP2012043916A (en) | 2012-03-01 |
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