CN104364940A - Protective device for an electronic component, electric circuit, electrochemical energy store, method for producing an electric circuit and use of a flexible sheath - Google Patents
Protective device for an electronic component, electric circuit, electrochemical energy store, method for producing an electric circuit and use of a flexible sheath Download PDFInfo
- Publication number
- CN104364940A CN104364940A CN201380030445.8A CN201380030445A CN104364940A CN 104364940 A CN104364940 A CN 104364940A CN 201380030445 A CN201380030445 A CN 201380030445A CN 104364940 A CN104364940 A CN 104364940A
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- Prior art keywords
- cap layer
- circuit
- electronic structure
- structure element
- contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/584—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
- H01M50/586—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The invention relates to a protective device for an electronic component (120). The electronic component (120) is provided for arrangement within a housing (106) enclosing an electrolyte medium (104) and belonging to an electrochemical energy store (100), and at least one contact (130) is provided in order to make electric contact with the electronic component (120). The protective device has an at least partially flexible sheath (140), which has a material which, in contact with the electrolyte medium (104) exhibits little chemical interaction or is free of interaction. Here, the sheath (140) is designed to sheath the electronic component (1020) in a fluid-tight manner. The at least one contact (130) can be led out of the sheath (140) in a fluid-tight manner.
Description
Technical field
The present invention relates to the purposes that a kind of protective device for electronic structure element, a kind of circuit, a kind of electrochemical energy accumulator, a kind of method for the manufacture of circuit and flexible cap layer are used as the protective device of electronic structure element.
Background technology
With in storage battery list pond, monitor running status in particular for the measurement of the voltage on the lithium ion battery of electric motor car, temperature etc., this carries out frequently by being placed in outside transducer.In the scope of the exploitation of the continuous propelling for battery, the measured value of the renewal in the inside in storage battery list pond, the accurate measurement of such as pressure or measurement are become more and more important.At this, be not be applicable to transducer, traditional packaging material, such as traditional moulding material, PCB(printed circuit board (PCB) without difficulty in the condition of inside, storage battery list pond), adhesive, gelatin and similar material.Adding due to possible and between the electrolyte in described storage battery list pond chemical reaction and entail dangers to stability test of inappropriate material.
Summary of the invention
Based on this background, introduce the protective device for electronic structure element be improved by a kind of described in independent claims, a kind of circuit, a kind of electrochemical energy accumulator, a kind of method for the manufacture of circuit of being improved and a kind of purposes that be improved, that flexible cap layer is used as the protective device of electronic structure element be improved be improved with the present invention.Favourable design from corresponding dependent claims and below specification obtain.
According to the embodiment of the present invention, electronic structure element prevents the interaction between the medium of surrounding by encapsulating cover, and described electronic structure element especially can be a part for the circuit of electricity or electronics.Described structural detail or described circuit itself can not covered or be had housing.If described structural detail or described circuit have housing, such as standard pack, such as molded housing or preforming housing, so described encapsulating cover just can form additional housing.Described structural detail or described circuit can be especially at the transducer that the inside of electrochemical energy accumulator uses, and described transducer such as has standard-sensor packaging.Encapsulating cover is according to the embodiment of the present invention made up of a kind of material, this material does not allow and the obvious interaction such as between electrolyte of such as battery, and this material especially also can with the mode of electric insulation make at least one for the electric conductor that contacts with described electronic structure element from described encapsulate cover pass.
The invention has the advantages that, can realize a kind of and inexpensive and reliably, in corrosive environment for the protection packaging of electronic structure element or circuit.Especially advise a kind of for electronic structure element or for such as transducer form, the packaging of the circuit of electronics, wherein said packaging can make people easily such as be joined in storage battery list pond by the circuit of described electronic structure element or electronics.Therefore, especially have the electronic structure element of the housing of traditional type, packaging or similar encapsulating cover or circuit can be equipped with suitably according to the embodiment of the present invention, for such as joining the protective device in storage battery list pond.Not only realize the stability test of described electrochemical battery thus, and realize the persistence of the circuit protected by means of described protective device.The salient point of described protective device be less, that can ignore or can not carry out and chemical reaction such as between the electrolyte of inside, storage battery list pond.Thus described protective device can represent about special medium chemically stable, for electronic structure element or the encapsulating cover for circuit, described encapsulating is covered with to be added in described medium.Such solution is not only very inexpensive, and such as also only make when being used as the encapsulating cover of transducer of inside battery such, generally the material be considered to battery is suitable for contact with the battery chemistries medicament of described battery.
A kind of protective device for electronic structure element; wherein said electronic structure element arrange for be arranged in electrochemical energy accumulator, the inside that comprises electrolytical housing and be provided with at least one for the contact with described electronic structure element electrical contact, this protective device has following characteristics:
The cap layer of at least part of flexibility, this cap layer has a kind of material, described material with described electrolytical contact in few of interaction or interact in chemical, wherein said cap layer surrounds described electronic structure element with being configured to Fluid Sealing, and at least one contact wherein said can be drawn Fluid Sealing from described cap layer.
The battery of the battery of described electrochemical energy accumulator can be a kind of especially form be electric current or electrochemical secondary cell, storage battery list pond or electric current or similar battery, it is configured to independent unit or is configured to the subelement of such as so-called battery pack or similar assembly.Described electrochemical energy accumulator such as can be arranged for electric motor car, hybrid electric vehicle or similar vehicles.The housing of described electrochemical energy accumulator can hermetically be sealed.In the inside of described housing, can hold or can hold or can arrange or can arrange electrode standard package or electrochemical reaction unit and described electrolyte.The material of the cap layer of described protective device can be chemically stable relative to described electrolyte in the scope exceeding the protection duration.At this, described cap layer, with described electrolytical contact in chemically few of interaction or do not have interactional material at least can form the outer surface of described cap layer.Can determine or can determine the described protection duration by the selection of the material for described cap layer.Described cap layer can be flexible completely, or such as on one or more fringe region, is rigidity and is flexible in other place.The fringe region of rigidity such as can produce in the following manner: two portion's sections of described cap layer are engaged with each other and are welded on top of one another together, such as.Described cap layer also can have the suture of rigidity.Described cap layer can be made up of the material of film-form.The housing of film-form can be formed thus by described cap layer.Because described cap layer at least constructs to local compliance, described cap layer may be out of shape due to the pressure oscillation of the inside of the housing at described electrochemical energy accumulator.
According to a kind of execution mode, described cap layer can have a connecting portion section, this connecting portion section be configured to can with portion's section Fluid Sealing of another section of described cap layer, with portion's section of described electronic structure element and as a supplement scheme or replacement scheme and circuit carrier be connected, described circuit carrier can settle described electronic structure element.Thus, portion's section of described cap layer is configured to the structure can carrying out the connection of Fluid Sealing each other.Scheme or replacement scheme as a supplement, described connecting portion section also can be configured to can with described electronic structure element and/or the structure that is connected of portion's section Fluid Sealing ground of circuit carrier.Such execution mode provides following advantage: the mode that can be able to adjust with many-side by applicable cases and design by means of described protective device to protect described electronic structure element, to prevent described electrolytical impact.In this case, at least one electronic structure element, the encapsulating of Fluid Sealing can carry out when being arranged to or not being arranged on described electronic structure element changeably by means of described cap layer.
Especially described cap layer can be made up of film or have film.Described film can be such as plastic film or metal forming.The film through coating can be related to.Such as described film can be the metal forming with plastic coat.In this case, described metal forming can one side or two-sided plastic coat.Such execution mode provides following advantage: described cap layer has the characteristic relative to electrolytical chemical stability, good form fit, good mechanical performance and electric insulation with less cost.In order to construct described cap layer, described film can be once folded, and described film, the edge that is placed on top of one another can be joined to one another.Also can carrying out deep-draw to described film, being shaped for making described cap layer.As an alternative, described cap layer can by two mounted on top and the part film be bonded together make.
Arrange for be arranged in electrochemical energy accumulator, the circuit of the inside that comprises electrolytical housing has following characteristics:
-at least one electronic structure element;
-at least one is for the contact with at least one electronic structure element electrical contact described; And
-protective device noted earlier; this protective device has cap layer; described cap layer Fluid Sealing ground surrounds at least one electronic structure element of described circuit; at least one contact of wherein said circuit is drawn with being fluid-tight from described cap layer, and forms the lockable mechanism of the machinery of at least one electronic structure element described relative to described protective device.
In conjunction with described circuit, can advantageously use protective device noted earlier.Especially protective device noted earlier can advantageously be used in conjunction with described circuit, for the protection of at least one electronic structure element of described circuit, to prevent the interaction of the chemistry between described electrolyte.Therefore, described circuit can be suitable for by means of described protective device and be suitable for joining in electrochemical energy accumulator.Described electronic structure element can be such as transducer, described transducer such as detect described electrochemical energy accumulator voltage, in the internal temperature or described electrochemical energy accumulator of described electrochemical energy accumulator inside press.By the lockable mechanism of described machinery, described electronic structure element can be fixed relative to described protective device.Such as described electronic structure element can be maintained on predetermined position in the inside of described protective device.In order to realize the lockable mechanism of described machinery, described contact can be configured to the element of rigidity.Such as described contact can be configured to described circuit, the projection of circuit carrier.According to a kind of execution mode, can arrange at least two contacts, described contact is drawn with being fluid-tight on side opposite each other from described cap layer.Described at least two contacts can be connected to each other in the internal rigid of described protective device.At least two contacts such as can represent for described electronic structure element, circuit carrier, opposed end portion section or projection.
According to a kind of execution mode, the cap layer of described protective device can be arranged at least one subregion of at least one electronic structure element described against ground.The cap layer of said protective device also can be arranged at least one subregion of described circuit against ground.Such execution mode provides following advantage: especially can improve measurement sensitiveness when described circuit is used as pressure sensor, if described cap layer or diaphragm be directly resisted against described component or electronic structure element at least one on the surface.
The cap layer of described protective device also can be loaded with fluid.Described fluid such as can comprise protective gas, oil or class quasi-fluid.The gap be between described cap layer and at least one electronic structure element described can be loaded with described fluid at this.In this case, the fluid be loaded into described in cap layer can be under defined pressure.Such execution mode provides following advantage: the cap layer that described fluid loads such as improves transmission situation pressure change be delivered on the sensor element that surrounds by means of described cap layer when described circuit is used as pressure sensor.
In addition, described circuit can have the circuit carrier of the form of circuit board or connecting frame.In this case, at least one electronic structure element described can be arranged on described circuit carrier, and at least one contact wherein said can be a part for described structural detail or described circuit carrier.At this, at least one portions section of described circuit carrier can be surrounded by means of the cap layer of described protective device.At least one electronic structure element described or component can be applied to can with described cap layer Fluid Sealing be connected or the circuit carrier engaged, on such as flexible circuit board.Described circuit carrier can pass described cap layer and guide to outside in order to carry out contacting, at least one contact of wherein said circuit can be arranged on the parts of outside extraction of described circuit carrier.At least one electronic structure element described or component can be applied on circuit carrier, such as circuit board.Described circuit carrier can such as by means of pasting, soldering or similar fashion and at least one metal, can with described cap layer Fluid Sealing to be connected or the electric conductor that engages contacts.Such as connecting frame or lead frame also so can be configured to circuit carrier, and the electric conductor making at least one directly come from described electronic structure element forms described setting for carrying out the electrical contact of electrical contact.Such execution mode provides following advantage: by means of described protective device, and the different execution mode of described circuit can be protected in a straightforward manner.At this, can combined circuit many-sided and use described protective device inexpensively.
According to a kind of execution mode, the cap layer of described protective device can be fixed on the fringe region of described circuit carrier.Such as described cap layer at least can be fixed on the opposed fringe region of two of described circuit carrier or be fixed on all fringe regions, is namely fixed on described circuit carrier by around ground.Thus, described cap layer such as can by means of be connected regularly with the edge conjunction of described circuit carrier.Described cap layer can so surround described circuit carrier, and described circuit carrier is clamped by described cap layer.In this way can the shape of cap layer of at least one partially flexible described given in advance.Described cap layer is fixed on this method on described circuit carrier and also in a predetermined manner described electronic structure element can be arranged in the inside of described cap layer.
Especially described circuit can be configured to the transducer detected the state parameter of described electrochemical energy accumulator.Described transducer can be configured to detect the state in described electrochemical energy accumulator inside or state parameter in this case.Described transducer or described circuit can have at least one sensor element.Such sensor element can be configured to such as detect the working temperature of described electrochemical energy accumulator or the interior pressure of described electrochemical energy accumulator.Described circuit can be configured to from described at least one sensor element receiving sensor data or measurement data.Such execution mode provides following advantage: by such as with measure electrochemical energy accumulator, e.g. particularly for the voltage of the inside of the lithium ion battery of electric motor car, this mode of temperature to running state monitoring, more accurate to measure and/or for the measured value of renewal, the measurement of such as pressure can be realized thus.
At this, the material of described cap layer can be at least flexible in portions section.Especially in order to detect the inner pressure of battery of described electrochemical energy accumulator by means of described circuit, advantageously, described cap layer is made up of the material of flexibility at least in part.
Electrochemical energy accumulator has following characteristics:
-housing, at internal placement electrochemical reaction unit and the electrolyte of this housing; And
-noted earlier, the circuit that is arranged in described enclosure interior.
In conjunction with described electrochemical energy accumulator, noted earlier, that there is protective device noted earlier circuit advantageously can be used.Especially circuit noted earlier can advantageously be used in conjunction with described electrochemical energy accumulator; for especially inside battery detect about described electrochemical energy accumulator, the sensing data of at least one state parameter; wherein said circuit is protected by the favourable design of described protective device, to prevent electrolytical impact.
A kind of for the manufacture of arrange for be arranged in electrochemical energy accumulator, the inside that comprises electrolytical housing, the method for circuit has following steps:
-provide at least one electronic structure element with at least one for the contact with at least one electronic structure element electrical contact described; And
-surround at least one electronic structure element described by means of the protective device with cap layer flexible at least partly in a fluid tight manner; described cap layer has a kind of material; described material with described electrolytical contact in few of interaction or interact in chemical, at least one contact wherein said is drawn with being fluid-tight from described cap layer.
By the execution of described method, can provide a kind of favourable, circuit noted earlier, this circuit has protective device noted earlier.In the step of surrounding, being such as connected of Fluid Sealing can be produced by means of thermal bonding or similar fashion between a connecting portion section and another section of described cap layer of described cap layer or between a connecting portion section and portion's section of described circuit of described cap layer at this.
Also advantageously flexible cap layer is used as the protective device of electronic structure element; described electronic structure element arrange for be arranged in electrochemical energy accumulator, the inside that comprises electrolytical housing; wherein said flexible cap layer has a kind of material, this material with described electrolytical contact among few of interaction or interact in chemical.Traditional circuit can be made when spending few to be in this way applicable to layout in battery container inside or operation.
Accompanying drawing explanation
By means of attached diagram plasticity, the present invention is explained in detail.In accompanying drawing:
Fig. 1 illustrates the schematic diagram of the electrochemical energy accumulator according to a kind of embodiment of the present invention;
Fig. 2 illustrates the schematic profile of the circuit according to embodiments of the invention to 4;
Fig. 5 illustrates the diagram of the electrochemical energy accumulator according to a kind of embodiment of the present invention;
Fig. 6 illustrates the flow chart of the method according to a kind of embodiment of the present invention; And
Fig. 7 and 8 illustrates the schematic profile of the circuit according to embodiments of the invention.
Below in preferred embodiment description of the present invention, for shown in different accompanying drawings and the element worked similarly uses identical or similar Reference numeral, save the repeat specification to these elements at this.
Embodiment
Fig. 1 shows the schematic diagram of the electrochemical energy accumulator 100 according to a kind of embodiment of the present invention.Described electrochemical energy accumulator 100 has electrochemical reaction unit 102, electrolyte 104 and housing 106 according to embodiment shown in Figure 1 of the present invention, holds two electrodes and the described electrolyte 104 of described electrochemical reaction unit 102, such as described electrochemical energy accumulator 100 in the internal placement of described housing 106 in other words.The electrochemical secondary cell of described electrochemical energy accumulator 100 can be such as form be lithium ion battery or similar battery.
Circuit 110 is contained in other words in the internal placement of the housing 106 of described electrochemical energy accumulator 100.Described circuit 110 can be such as the transducer detected at least one state parameter in the inside to described electrochemical energy accumulator 100.Described circuit 110 such as has electronic structure element 120 component, such as contact 130 and protective device in other words according to embodiment shown in Figure 1 of the present invention; wherein said contact 130 is in order to be connected electrically with at least one electronic structure element 120 electrical contact described, and wherein said protective device has cap layer 140 protects cap layer in other words or be made up of described cap layer.Described cap layer at least part of portion section constructs flexibly.Such as described cap layer by the material of film-form or can be made up of film.
Described cap layer 140 Fluid Sealing ground surrounds at least one electronic structure element 120 of described circuit 110.At least one contact 130 Fluid Sealing ground of described circuit 110 is drawn from described cap layer.Only illustrate in FIG, described contact 130 can connect electric conductor, thus realize described circuit 110 to be electrically connected to be on the inside of described electrochemical energy accumulator 100 or the holding wire of outside.Described cap layer 140 has a kind of material, and this material is few of interaction or interact in chemical among the contact of the electrolyte 104 with described electrochemical energy accumulator 100.
Fig. 2 shows the schematic profile of the circuit 110 according to a kind of embodiment of the present invention.Show a kind of circuit 110 at this, this circuit such as has electronic structure element 120 or component, such as in order to the contact 130 be connected electrically with the electrical contact of described electronic structure element 120, circuit carrier 225 that to protect the protective device of cap layer and form to be substrate circuit board in other words with cap layer 140 in other words.Described circuit 110 can be the circuit of Fig. 1.The form of the transducer that described circuit 110 can detect for the state parameter in the inside to the electrochemical energy accumulator in electrochemical energy accumulator, such as Fig. 1 exists.In addition, exemplary two the connecting portion sections 245 showing described cap layer 140, these two connecting portion sections are connected with described circuit carrier 225 and described contact 130 described cap layer 140 Fluid Sealing.
Described electronic structure element 120 is exemplarily arranged in described circuit carrier 225 in other words on described circuit board by means of two solder contacts.One of described solder contacts is electrically connected with described contact 130.Described contact 130 is configured to the guide passage of described circuit carrier 225 circuit board in other words according to embodiment shown in figure 2 of the present invention.Described contact 130 extend to from the structural detail region being wherein furnished with described electronic structure element 120 of described circuit carrier 225 described circuit carrier 225 for electric conductor being connected to the join domain described circuit 110.At this, described contact 130 is arranged on first first type surface illustrated up in fig. 2 of described circuit carrier 225.Even if not shown in fig. 2, described contact 130 also can be electrically connected with Connection Element or be configured to described Connection Element in described join domain.
Described cap layer 140 is connected with described circuit carrier 225 and described contact 130 in described connecting portion section 245 Fluid Sealing.The first connecting portion section in the connecting portion section 245 of described cap layer 140 is positioned on the first first type surface of described circuit carrier 225 on the first engaging zones of described circuit carrier 225 and contact 130 between described structural detail region and the join domain of described circuit carrier 225.The second connecting portion section in the connecting portion section 245 of described cap layer 140 is positioned on second first type surface opposed with the first first type surface of described circuit carrier 225 in the second engaging zones of described circuit carrier 225.At this, the first engaging zones and second engaging zones of described circuit carrier 225 are arranged exemplarily opposedly.Described cap layer 140 is like this in the cross section depicted in fig. 2 to be extended between its connecting portion section 245, thus surrounds a part for described electronic structure element 120 and described circuit carrier 225 and contact 130 at this by means of described cap layer 140.The described cap layer 140 of layout like this, thus except in described connecting portion section 245, can gap be left in described cap layer 140 and between described circuit carrier 225, described contact 130 and described electronic structure element 120.The described cap layer 140 of layout like this, makes the join domain of described circuit carrier 225 be arranged in outside the enclosing region of described cap layer 140.Described connecting portion section 245 forms the lockable mechanism of machinery between described circuit carrier 225 and described cap layer 140.
In other words; Fig. 2 shows the principle of the sensor packaging of protectiveness, in the connecting portion section 245 of described cap layer 140, between described cap layer 140 and described circuit carrier 225 and described contact 130, wherein such as established the connection of Fluid Sealing by stickup, thermal bonding or similar fashion.The encapsulating cover of described cap layer 140 can be such as form the be flexibility of film.Described circuit carrier 225 can be the substrate with electrical contact.
Fig. 3 shows the schematic profile of the circuit 110 according to a kind of embodiment of the present invention.Show a kind of circuit 110 at this, this circuit such as has electronic structure element 120 or component, such as two in order to the contact 130 be connected electrically with the electrical contact of described electronic structure element 120, circuit carrier 225 that to protect the protective device of cap layer and form to be connecting frame or so-called lead frame with cap layer 140 in other words.Described circuit 110 can be the circuit of Fig. 1.Described circuit 110 can exist for the form of the transducer detected the state parameter in the inside of the electrochemical energy accumulator of electrochemical energy accumulator, such as Fig. 1.In addition, exemplary four the connecting portion sections 245 showing described cap layer 140, these four connecting portion sections are bonded together described cap layer 140 Fluid Sealing and Fluid Sealing be connected with described contact 130.Described contact 130 is configured to the joint of described connecting frame or lead frame according to embodiment shown in Figure 3 of the present invention.Described contact 130 is electrically connected with described electronic structure element 120.Each contact in described two contacts 130 has a freely end contrary with connecting end portion, and in described connecting end portion, corresponding contact 130 is electrically connected with described electronic structure element 120.Each free end in the end freely of described two contacts 130 is arranged for electric conductor being connected to described circuit 110.
Described cap layer 140 is bonded together in described connecting portion section 245 with being fluid-tight, and Fluid Sealing ground is connected with described contact 130.Described cap layer 140 is configured to two-part structure according to embodiment shown in Figure 3 of the present invention.At this, each part of described cap layer 140 such as has two connecting portion sections 245.The first connecting portion section in the connecting portion section 245 of the Part I of described cap layer 140 is connected with the first connecting portion section in the connecting portion section 245 of the Part II of described cap layer 140 at the first junction Fluid Sealing.The first contact in described contact 130 extends through described first junction, makes the end freely of described first contact 130 be arranged in the outside of described cap layer 140.The second connecting portion section in the connecting portion section 245 of the Part I of described cap layer 140 is connected with the second connecting portion section in the connecting portion section 245 of the Part II of described cap layer 140 at the second junction Fluid Sealing.The second contact in described contact 130 extends through described second junction, makes the end freely of described second contact 130 be arranged in the outside of described cap layer 140.Described cap layer 140 is so arranged and is bonded together, thus surrounds a part for described electronic structure element 120 and described contact 130 by means of described cap layer 140.The described cap layer 140 of layout like this, thus except can gap be left between the external described cap layer 140 in described junction and described contact 130 and described electronic structure element 120.
In other words; Fig. 3 shows the principle of the sensor packaging of protectiveness, in the connecting portion section 245 of described cap layer 140, between described cap layer 140 and described circuit carrier 225 and described contact 130, wherein such as established the connection of Fluid Sealing by stickup, thermal bonding or similar fashion.The encapsulating cover of described cap layer 140 can be such as form the be flexibility of film.Described electronic structure element 120 and described circuit carrier 225 form the so-called first order level based on lead frame and pack (1st-level-Package), and wherein said contact 130 is joints (" leads ") of the special shaping be such as made up of copper of described packaging.
Fig. 4 shows the schematic profile of the circuit 110 according to a kind of embodiment of the present invention.Show a kind of circuit 110 at this, this circuit such as has electronic structure element 120 or component, such as in order to the contact 130 be connected electrically with the electrical contact of described electronic structure element 120, circuit carrier 225 that to protect the protective device of cap layer and form to be substrate circuit board in other words with cap layer 140 in other words.Described circuit 110 can be the circuit of Fig. 1.Described circuit 110 can exist for the form of the transducer detected the state parameter in the inside of the electrochemical energy accumulator of electrochemical energy accumulator, such as Fig. 1.In addition, exemplary two the connecting portion sections 245 showing described cap layer 140, these two connecting portion sections are connected with described circuit carrier 225 and described contact 130 described cap layer 140 Fluid Sealing.
Diagram in Fig. 4 and shown circuit 110 except following situation corresponding to the diagram of Fig. 2 or circuit: described circuit 110 has pressure sensor in the diagram, described cap layer 140 is resisted against on described electronic structure element 120 at least one section and the second connecting portion section in described connecting portion section 245 obtains expansion, make described cap layer 140 be positioned on the region of the expansion of described circuit carrier 225, this region exemplarily extends to its first first type surface from the second first type surface of described circuit carrier 225.
In other words; Fig. 4 shows the principle of the sensor packaging of protectiveness, in the connecting portion section 245 of described cap layer 140, wherein such as established the connection of Fluid Sealing at described cap layer 140 and described circuit carrier 225 and described contact 130 by stickup, thermal bonding or similar fashion.Described cap layer 140 or encapsulating are covered on this and closely abut on described electronic structure element 120 or sensor element, for being improved by direct pressure transmission in situation gapless between cap layer 140 and electronic structure element 120 or promoting the pressure transducer functionality of described circuit 110.Described cap layer 140 can be such as form be flexible film, flexible encapsulating cover.Described circuit carrier 225 can be the substrate with electrical contact.
Fig. 5 shows the diagram of the electrochemical energy accumulator 100 according to a kind of embodiment of the present invention.Described electrochemical energy accumulator 100 can be the electrochemical energy accumulator of Fig. 1.Show the housing 106 of described electrochemical energy accumulator 100 and two battery contacts 508 of described electrochemical energy accumulator 100 at this, described two battery contacts 508 extend out from described housing 106.Especially Fig. 5 shows the electrochemical energy accumulator 100 or battery that form is so-called bag-type battery, is usually solded into by simple thermal binding process in the housing 106 of the form of the metal forming with plastic coat for the electrode of described electrochemical reaction unit described bag-type battery and described electrolyte.Circuit, such as Fig. 1 can be arranged in the housing 106 of described electrochemical energy accumulator 100, even if this point is not shown in Figure 5 to the circuit of one of 4 equally.Thus for the circuit obtaining by means of described protective device protecting, advantageously about cost and material can use a kind of with Production Example as when covering for the housing or encapsulate of the lithium ion battery in mobile phone, so-called bag-type battery the similar technology of the technology that uses.
Fig. 6 shows a kind of flow chart of the method 600 for the manufacture of circuit according to a kind of embodiment of the present invention, this circuit arrange for be arranged in electrochemical energy accumulator, the inside that comprises electrolytical housing.Described method 600 has provides at least one electronic structure element and at least one step 610 for the contact with at least one electronic structure element electrical contact described.Described method 600 also has the step 620 of surrounding at least one electronic structure element described in a fluid tight manner by means of the protective device with cap layer; described cap layer has a kind of material, this material with described electrolytical contact among few of interaction or interact in chemical.At least one contact said is drawn with being fluid-tight from described cap layer.Circuit, such as Fig. 1 circuit to one of 4 advantageously can be manufactured by means of described method 600.The circuit manufactured by means of described method 600 can be advantageously arranged in electrochemical energy accumulator, the inside of the housing of the electrochemical energy accumulator of one of such as Fig. 1 and 5.
Fig. 7 shows the schematic profile of the circuit 110 according to a kind of embodiment of the present invention.Show a kind of circuit 110 at this, this circuit has electronic structure element 120 or component, the transducer be such as arranged on the circuit carrier 225 of tabular.The inside of the cap layer 140 of the protective device described described in one of described electronic structure element 120 and the described circuit carrier 225 portion's section it arranging described electronic structure element 120 is arranged in.Described cap layer 140 is configured to flexible encapsulating cover, is such as configured to film.Described electronic structure element 120 is arranged in portion's section of described circuit carrier 225, and this section has two opposed projections, and these two projections are drawn as contact 130 with being fluid-tight from described cap layer 140.Described contact 130 is a part for described circuit carrier 225 thus.Described contact 130 is for being mechanically locked at the inside of described cap layer 140 by described circuit carrier 225 or described electronic structure element 120.In addition, at least one contact in described contact 130 is used as the electrical contact with the electrical contact of described electronic structure element 120.According to shown embodiment, these two contacts 130 are configured to electrical contact, and there is at least one electric guide passage respectively, described guide passage on the surface of described the circuit carrier 225 or as an alternative directed joint giving the electricity of described electronic structure element 120 therein.Described circuit carrier 225 also can be called as the substrate with electrical contact at it generally.
Fig. 8 shows circuit 110 shown in Figure 7, the schematic vertical view according to a kind of embodiment of the present invention.Described cap layer 140 is illustrated pellucidly, thus can see portion's section that draw described electronic structure element 120 and described circuit carrier 225, that surrounded by cap layer.According to this embodiment, portion's section of described circuit carrier 225 is configured to rectangle, wherein in this section, arranges described electronic structure element 120.As an alternative, this section can have other shape, such as, can be circular or oval.Described portion section surround by described cap layer 140.According to this embodiment, described cap layer 140 is fixed on the edge of described circuit carrier 225.The edge of described cap layer 140 be fixed on portion's section of described circuit carrier 225 around outside edge on, described portion section arranges electronic structure element 120.Described cap layer 140 crosses described contact 130, and is fixed on described contact 130.Portion's section of described circuit carrier 225 or described circuit carrier 225 is clamped in the inside of described cap layer 140 thus, wherein in described portion section, arranges described electronic structure element 120.Relate to one " clamped " circuit carrier 225 thus, the film of described cap layer 140 this circuit carrier is not only closely abutted on described circuit carrier 225, and is again additionally connected with described circuit carrier 225.In this way, described circuit carrier 225 obtains fixing relative to described cap layer 140, or vice versa.
Only exemplarily have selected described and embodiment illustrated in the accompanying drawings.Different embodiments can be got up completely or about each feature combination with one another.A kind of embodiment also can be supplemented by the feature of another kind of embodiment.In addition, repeatedly can perform by method step of the present invention, or perform with the order different from described order.
Claims (12)
1. for the protective device of electronic structure element (120); wherein said electronic structure element (120) arranges the inside being used for housing (106) that be arranged in electrochemical energy accumulator (100), that comprise electrolyte (104); and be provided with at least one for the contact (130) with described electronic structure element (120) electrical contact, wherein said protective device has following characteristics:
At least cap layer (140) of local compliance, described cap layer has a kind of material, described material with the contact of described electrolyte (104) among few of interaction or interact in chemical, wherein said cap layer (140) surrounds described electronic structure element (120) with being configured to Fluid Sealing, and wherein said at least one contact (130) can be drawn on Fluid Sealing ground from described cap layer (140).
2. by protective device according to claim 1; wherein said cap layer (140) has connecting portion section (245); described connecting portion section is configured to another section (245) of described cap layer (140), be connected with portion's section of described electronic structure element (120) and/or with the section Fluid Sealing ground, portion of circuit carrier (225), described circuit carrier can be settled described electronic structure element (120).
3., by protective device in any one of the preceding claims wherein, wherein said cap layer (140) is made up of film.
4. circuit (110), described circuit arranges the inside being used for housing (106) that be arranged in electrochemical energy accumulator (100), that comprise electrolyte (104), and wherein said circuit (110) has following characteristics:
-at least one electronic structure element (120);
-at least one is for the contact (130) with the electrical contact of described at least one electronic structure element (120); And
-by protective device in any one of the preceding claims wherein; described protective device has cap layer (140); described cap layer Fluid Sealing ground surrounds at least one electronic structure element (120) of described circuit (110), and described at least one contact (130) Fluid Sealing ground of wherein said circuit (110) is drawn and forms the lockable mechanism of the machinery of at least one electronic structure element described relative to described protective device from described cap layer (140).
5., by circuit according to claim 4 (110), the cap layer (140) of wherein said protective device is arranged at least one subregion of described at least one electronic structure element (120) against ground.
6., by the circuit (110) according to any one of claim 4 to 5, wherein load the cap layer (140) of described protective device with fluid.
7. by the circuit (110) according to any one of claim 4 to 6, there is the circuit carrier (225) that form is circuit board or connecting frame, wherein said at least one electronic structure element (120) is arranged on described circuit carrier (225), wherein said at least one contact (130) be described structural detail (120) or the part of described circuit carrier (225).
8., by circuit according to claim 7 (110), the cap layer (140) of wherein said protective device is fixed on the fringe region of described circuit carrier (225).
9., by the circuit (110) according to any one of claim 4 to 8, wherein said circuit (110) is configured to the transducer detected the state parameter of described electrochemical energy accumulator (100).
10. electrochemical energy accumulator (100), has following characteristics:
-housing (106), at internal placement electrochemical reaction unit (102) and the electrolyte (104) of described housing; And
-by according to any one of claim 4 to 9, the circuit (110) of the inside that is arranged in described housing (106).
11. for the manufacture of the method (600) of circuit (110), and described circuit arranges the inside being used for housing (106) that be arranged in electrochemical energy accumulator (100), that comprise electrolyte (104), and described method (600) comprises the following steps:
-provide (610) at least one electronic structure element (120) and at least one is for the contact (130) with the electrical contact of described at least one electronic structure element (120); And
-surround (620) described at least one electronic structure element (120) by means of the protective device with cap layer (140) flexible at least partly in a fluid tight manner; described cap layer has a kind of material; described material with few of interaction or does not interact in chemical in the contact of described electrolyte (104), the extraction from described cap layer (140) of wherein said at least one contact (130) Fluid Sealing ground.
The purposes of 12. flexible cap layer (140); be used as the protective device of electronic structure element (120); described electronic structure element (120) arranges the inside being used for housing (106) that be arranged in electrochemical energy accumulator (100), that comprise electrolyte (104); wherein said flexible cap layer (140) has a kind of material, described material with the contact of described electrolyte (104) among few of interaction or interact in chemical.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012209709.0A DE102012209709B4 (en) | 2012-06-11 | 2012-06-11 | Protection device for an electronic component, electrical circuit, electrochemical energy store, method for producing an electrical circuit and use of a flexible sheath |
| DE102012209709.0 | 2012-06-11 | ||
| PCT/EP2013/058691 WO2013185971A1 (en) | 2012-06-11 | 2013-04-26 | Protective device for an electronic component, electric circuit, electrochemical energy store, method for producing an electric circuit and use of a flexible sheath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104364940A true CN104364940A (en) | 2015-02-18 |
| CN104364940B CN104364940B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380030445.8A Active CN104364940B (en) | 2012-06-11 | 2013-04-26 | Purposes for the protective device of electronic structure element, circuit, electrochemical energy accumulator, the method for manufacturing circuit and flexible cap layer |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN104364940B (en) |
| DE (1) | DE102012209709B4 (en) |
| WO (1) | WO2013185971A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014222853A1 (en) | 2014-11-10 | 2016-05-12 | Robert Bosch Gmbh | Protective device for an electronic component, sensor component and method for its production |
| DE102015201532A1 (en) * | 2015-01-29 | 2016-08-04 | Robert Bosch Gmbh | Separating membrane for creating a fluid-tight interior for an electrical component, electrical circuit, electrochemical energy storage and method for producing an electrical circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071826A2 (en) * | 2000-03-22 | 2001-09-27 | Sarnoff Corporation | Battery and circuitry assembly |
| US6593669B1 (en) * | 1996-05-07 | 2003-07-15 | Technopuce International | Rechargeable or non rechargeable smart battery cell and process for the production of such a cell |
| US20060043935A1 (en) * | 2004-08-24 | 2006-03-02 | Chang Sung K | Safety device for preventing overcharge of secondary batteries and secondary batteries therewith |
| WO2008048995A2 (en) * | 2006-10-17 | 2008-04-24 | Valence Technology, Inc. | Method and apparatus for monitoring and controlling an electrochemical cell |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010046307B4 (en) | 2010-09-15 | 2018-04-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electrochemical cell of a rechargeable battery |
-
2012
- 2012-06-11 DE DE102012209709.0A patent/DE102012209709B4/en active Active
-
2013
- 2013-04-26 CN CN201380030445.8A patent/CN104364940B/en active Active
- 2013-04-26 WO PCT/EP2013/058691 patent/WO2013185971A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593669B1 (en) * | 1996-05-07 | 2003-07-15 | Technopuce International | Rechargeable or non rechargeable smart battery cell and process for the production of such a cell |
| WO2001071826A2 (en) * | 2000-03-22 | 2001-09-27 | Sarnoff Corporation | Battery and circuitry assembly |
| US20060043935A1 (en) * | 2004-08-24 | 2006-03-02 | Chang Sung K | Safety device for preventing overcharge of secondary batteries and secondary batteries therewith |
| WO2008048995A2 (en) * | 2006-10-17 | 2008-04-24 | Valence Technology, Inc. | Method and apparatus for monitoring and controlling an electrochemical cell |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013185971A1 (en) | 2013-12-19 |
| DE102012209709B4 (en) | 2021-10-07 |
| DE102012209709A1 (en) | 2013-12-12 |
| CN104364940B (en) | 2019-02-12 |
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