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CN104332510A - Subwavelength plasmonic microcavity light coupling structure for promoting photoelectric detector response - Google Patents

Subwavelength plasmonic microcavity light coupling structure for promoting photoelectric detector response Download PDF

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CN104332510A
CN104332510A CN201410546873.2A CN201410546873A CN104332510A CN 104332510 A CN104332510 A CN 104332510A CN 201410546873 A CN201410546873 A CN 201410546873A CN 104332510 A CN104332510 A CN 104332510A
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microcavity
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coupling structure
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李倩
李志锋
陆卫
陈效双
李宁
陈平平
李天信
王文娟
甄红楼
王少伟
景友亮
廖开升
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Shanghai Institute of Technical Physics of CAS
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    • HELECTRICITY
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Abstract

本发明公开了一种提升光电探测器响应率的亚波长等离激元微腔耦合结构,通过等离激元微腔对入射光的传播方向和光场分布进行调制,使入射光被限制在微腔中传播,减小了光的逃逸,提高了光子的利用率。入射光场被集聚在微腔中使得强度得到极大的增强,通过在微腔中夹持光电转换材料能够形成高响应率的光电探测器。该耦合结构由上层周期性金属条块形成的金属光栅层、光电转换激活层和下层金属反射层组成。本发明的优点是:利用上层金属光栅与下层金属反射层之间等离激元共振所形成的电磁波近场耦合微腔的模式选择效应,使得进入到微腔的光子沿横向传播并形成驻波,既集聚了光场能量又增加了等效光吸收的长度,使得探测器响应率得到极大地提升。

The invention discloses a sub-wavelength plasmon microcavity coupling structure that improves the responsivity of a photodetector. The propagation direction and light field distribution of incident light are modulated by the plasmon microcavity, so that the incident light is limited to a micro Propagation in the cavity reduces the escape of light and improves the utilization rate of photons. The incident light field is concentrated in the microcavity so that the intensity is greatly enhanced, and a photodetector with high responsivity can be formed by clamping the photoelectric conversion material in the microcavity. The coupling structure is composed of a metal grating layer formed by periodic metal strips on the upper layer, a photoelectric conversion active layer and a lower metal reflective layer. The advantage of the present invention is: using the mode selection effect of the electromagnetic wave near-field coupling microcavity formed by the plasmon resonance between the upper metal grating and the lower metal reflective layer, the photons entering the microcavity propagate along the lateral direction and form a standing wave , which not only gathers the energy of the light field but also increases the length of the equivalent light absorption, so that the detector responsivity is greatly improved.

Description

提升光电探测器光响应的亚波长等离激元微腔光耦合结构Sub-wavelength plasmonic microcavity optical coupling structure for enhancing photodetector photoresponse

技术领域technical field

本发明涉及半导体光电探测器,具体是指光电探测能力得到提升的集成在像元上的采用亚波长等离激元微腔耦合结构的光电探测器。The invention relates to a semiconductor photodetector, in particular to a photodetector integrated on a picture element and adopting a sub-wavelength plasmon microcavity coupling structure with improved photodetection capability.

背景技术Background technique

半导体光电探测器是通过半导体材料吸收入射光子形成电子或者空穴跃迁之后改变其导电状态,形成光生载流子诱导的光电流或者光电压来实现对光的探测。一般的光电探测器能够直接接收入射光照射完成光电探测。然而,不断提高光电探测器的性能是人们始终追求的目标。光电探测器的优值因子为探测率,其值直接反映了探测器的性能。探测率直接正比于光响应率,因此,提高光电探测器的光响应率将直接提高器件的探测率。Semiconductor photodetectors realize the detection of light by absorbing incident photons to form electrons or hole transitions and then changing their conductive state to form photocurrent or photovoltage induced by photogenerated carriers. General photodetectors can directly receive incident light to complete photoelectric detection. However, continuously improving the performance of photodetectors is the goal that people are always pursuing. The figure of merit of a photodetector is the detectivity, and its value directly reflects the performance of the detector. The detectivity is directly proportional to the photoresponsivity, therefore, increasing the photoresponsivity of the photodetector will directly increase the detectivity of the device.

提高响应率的途径除了改善光电转换材料自身的光电转换效率之外,还能够通过改善光耦合的效率来实现。光耦合的改善提高了入射光子的利用率,使得能够被收集到的入射光子都尽可能多地参与到光生载流子的激发过程中,相应地,能够提高光电探测器的响应率。In addition to improving the photoelectric conversion efficiency of the photoelectric conversion material itself, the way to improve the responsivity can also be achieved by improving the efficiency of light coupling. The improvement of optical coupling improves the utilization rate of incident photons, so that as many incident photons as possible can be collected to participate in the excitation process of photogenerated carriers, correspondingly, the responsivity of photodetectors can be improved.

普通的未采用光耦合结构的光电探测器受限于光电转换材料的有效转换面积(如p-n结的结区厚度或者光导激活层厚度)和光生载流子的有效输运长度(扩散长度和寿命),使得入射光子的利用率较低,相当一部分入射光子并未参与到光电转换的过程而是逃逸出探测器。本发明通过设计一种亚波长等离激元微腔耦合结构,能够将入射光子限制在微腔之中,从而抑制了入射光子的逃逸,提高入射光子的利用率,同时通过光场模式设计能够将光子能量进行集聚,能够使光电探测器的光响应率得到极大地提高。Ordinary photodetectors that do not use an optical coupling structure are limited by the effective conversion area of photoelectric conversion materials (such as the thickness of the junction region of the p-n junction or the thickness of the photoconductive active layer) and the effective transport length of photogenerated carriers (diffusion length and lifetime ), so that the utilization rate of incident photons is low, and a considerable part of incident photons does not participate in the process of photoelectric conversion but escapes from the detector. By designing a sub-wavelength plasmon microcavity coupling structure, the present invention can confine the incident photons in the microcavity, thereby suppressing the escape of the incident photons and improving the utilization rate of the incident photons. Concentrating the photon energy can greatly improve the photoresponsivity of the photodetector.

发明内容Contents of the invention

本发明的目的是提出一种用于提升光电探测器光响应的采用亚波长等离激元微腔进行光耦合的结构。The purpose of the present invention is to propose a structure for improving the photoresponse of a photodetector using a subwavelength plasmon microcavity for photocoupling.

本发明采用的亚波长等离激元微腔进行光耦合的结构,其结构为以入射光经过先后为序依次是:上层金属条块形成的金属光栅层1,光电转换激活层2,下层金属反射层3。The sub-wavelength plasmonic microcavity used in the present invention is a structure for optical coupling. The structure is in order of the incident light passing through: the metal grating layer 1 formed by the upper metal strip, the photoelectric conversion active layer 2, and the lower metal grating layer. reflective layer3.

所说的金属光栅层1在一维周期性重复的情况下,为周期为p、线宽为s、厚度为h1的一维周期排列的金属线条光栅;在二维周期性重复的情况下,为两个方向上周期均为p、线宽均为s、厚度为h1的二维周期排列的金属方块形光栅。其材质包括但不限于高导电性的金或者银。为了改善其黏附性,在其与光电转换激活层2之间附加一层厚度为5~30纳米的黏性金属,其材质包括但不限于钛。其周期p、线宽s和厚度h1由理论计算得到的优化结果决定,优化计算的目标是使入射光波能够与金属中电子集体振荡形成的等离激元的局域表面模式(Localized Surface Plasmon,LSP)发生共振耦合,在共振模式的诱导下进入耦合微腔中,形成横向的驻波腔模模式。有限差分时域(Finite DifferenceTime Domain,FDTD)理论计算给出以下金属光栅的尺寸参数设计范围:①条纹宽度s的数值为探测波长的十分之一到十分之十之间。对于共振耦合模式,金属条纹宽度s与探测波长λ之间满足s=kλ/2n关系,其中k为共振级数,n为光电转换激活层2中激活材料的折射率,一般值为3-5,取决于光电转换材料的种类,并与层2的厚度相关。对于k=1,s最小为探测波长的十分之一。在共振级数k>2n时,s最大可到一个探测波长。但k>6后,共振耦合效果将逐渐减弱至接近消失。因此s的最大值不超过探测波长的十分之十。②周期p的数值为探测波长的十分之一到十分之三十。这是因为周期p必须大于条纹宽度s,所以必须大于探测波长的十分之一。但在条纹宽度s不变情况下,增加周期即等同于增加狭缝宽度。当狭缝宽度大于条纹宽度两倍时,理论计算表明共振耦合效果将逐渐减弱到几乎消失。因此周期p的数值最大不超过探测波长的十分之三十。③金属光栅层1的厚度h1的值不小于以微米为单位的探测波长的平方根的0.0096倍。这是因为共振耦合条件要求金属光栅层1的上、下表面电磁场之间无相互作用,即要求厚度h1的值不小于2倍的趋肤深度。在光电探测波段,理论给出的电磁波在金属中的趋肤深度d~0.0048·λ1/2In the case of one-dimensional periodic repetition, the metal grating layer 1 is a metal line grating arranged periodically in one dimension with a period of p, a line width of s, and a thickness of h1; in the case of two-dimensional periodic repetition, It is a two-dimensional periodic metal grating with a period of p in both directions, a line width of s, and a thickness of h1. Its material includes but not limited to highly conductive gold or silver. In order to improve its adhesion, a layer of adhesive metal with a thickness of 5-30 nanometers is added between it and the photoelectric conversion active layer 2 , and its material includes but not limited to titanium. Its period p, line width s, and thickness h1 are determined by the optimization results obtained from theoretical calculations. The goal of the optimization calculations is to enable the incident light wave to collectively oscillate with the electrons in the metal to form the localized surface mode of the plasmon (Localized Surface Plasmon, LSP) undergoes resonant coupling, and enters the coupled microcavity under the induction of the resonant mode, forming a transverse standing wave cavity mode. Finite Difference Time Domain (FDTD) theoretical calculations give the following design ranges for the size parameters of metal gratings: ①The value of the stripe width s is between one-tenth and ten-tenths of the detection wavelength. For the resonant coupling mode, the relationship between the metal stripe width s and the detection wavelength λ satisfies s=kλ/2n, where k is the resonance order, n is the refractive index of the active material in the photoelectric conversion active layer 2, and the general value is 3-5 , depends on the type of photoelectric conversion material and is related to the thickness of layer 2. For k=1, s is at least one tenth of the detection wavelength. When the resonance order k>2n, s can reach a detection wavelength at most. But when k>6, the resonance coupling effect will gradually weaken to almost disappear. Therefore the maximum value of s does not exceed ten tenths of the detection wavelength. ② The value of the period p is one-tenth to thirty-tenths of the detection wavelength. This is because the period p must be greater than the fringe width s, and therefore must be greater than one-tenth of the detection wavelength. But when the stripe width s remains unchanged, increasing the period is equivalent to increasing the slit width. When the slit width is greater than twice the stripe width, theoretical calculations show that the resonant coupling effect will gradually weaken to almost disappear. The value of the period p therefore does not exceed thirty-tenths of the detection wavelength at most. ③ The value of the thickness h1 of the metal grating layer 1 is not less than 0.0096 times the square root of the detection wavelength in microns. This is because the resonant coupling condition requires that there is no interaction between the electromagnetic fields on the upper and lower surfaces of the metal grating layer 1, that is, the value of the thickness h1 is required to be not less than twice the skin depth. In the photoelectric detection band, the theoretically given skin depth of electromagnetic waves in metals is d ~ 0.0048·λ 1/2 .

所说的光电转换激活层2是指能够吸收入射光并产生光生载流子的半导体光电薄膜材料,由外延生长技术生长在衬底之上,并且通过衬底剥离技术获得的光电转换激活薄膜。在光照下该薄膜中处于基态的载流子吸收光子跃迁到激发态上,形成光生载流子,并通过上、下金属电极之间的电场将光生载流子输运到外电路中,形成光电转换的信号。其厚度h2由理论计算得到的优化结果决定,优化计算的目标是使耦合进入耦合微腔结构中的电磁波所形成的横向驻波模式达到最强。按照等离激元微腔近场耦合要求,h2必须小于所探测入射光的等效光波长,即真空中的光波长除以该层物质的折射率。对于折射率的最小取值为3时,h2应不大于探测波长的三分之一。The photoelectric conversion active layer 2 refers to a semiconductor photoelectric thin film material capable of absorbing incident light and generating photogenerated carriers, which is grown on the substrate by epitaxial growth technology and obtained by substrate lift-off technology. Under the light, the carriers in the ground state in the film absorb photons and transition to the excited state to form photo-generated carriers, and transport the photo-generated carriers to the external circuit through the electric field between the upper and lower metal electrodes to form Photoelectrically converted signal. Its thickness h2 is determined by the optimization result obtained by theoretical calculation, and the goal of the optimization calculation is to make the transverse standing wave mode formed by the electromagnetic wave coupled into the coupled microcavity structure the strongest. According to the near-field coupling requirements of the plasmonic microcavity, h2 must be smaller than the equivalent light wavelength of the detected incident light, that is, the light wavelength in vacuum divided by the refractive index of the layer material. When the minimum value of the refractive index is 3, h2 should not be greater than one-third of the detection wavelength.

所说的下层金属反射层3是指厚度为h3的一层完整的金属层,h3的值必须大于探测光在金属中的趋肤深度,即以微米为单位的探测波长的平方根的0.0048倍。此时的金属层可作为电磁波的反射层。其材质包括但不限于高导电性的金或者银。为了改善其黏附性,可在其与光电转换激活层2之间附加一层厚度为5~30纳米的黏性金属,其材质包括但不限于钛。The lower metal reflective layer 3 refers to a complete metal layer with a thickness of h3. The value of h3 must be greater than the skin depth of the probe light in the metal, that is, 0.0048 times the square root of the probe wavelength in microns. The metal layer at this time can serve as a reflective layer for electromagnetic waves. Its material includes but not limited to highly conductive gold or silver. In order to improve its adhesion, a layer of adhesive metal with a thickness of 5-30 nanometers can be added between it and the photoelectric conversion active layer 2 , and its material includes but not limited to titanium.

本发明基于的工作原理是:针对特定的光电探测波长所设计的金属光栅呈周期排列,且其周期小于所探测光的波长,使得光栅金属中电子的集体振荡所形成的等离激元能够与入射光发生共振耦合。上层金属光栅与下层金属反射层共同作用,对光场的分布形成了新的调制,使得耦合进入微腔中光波沿横向传播,并形成驻波形式的腔模。其传播方向由自由空间中的垂直于探测器平面的z方向转变成为沿着探测器平面的x方向传播,并由光电转换激活层2吸收之后转变成为电信号。该耦合方式使得微腔中的光子几乎不能逃逸,除了小部分在金属界面形成热损耗之外,大部分的光子将被光电转换材料吸收,使得光子的利用率得到极大地提高,相应地提高光电探测器的响应率。The working principle of the present invention is: the metal grating designed for a specific photodetection wavelength is arranged periodically, and its period is smaller than the wavelength of the detected light, so that the plasmons formed by the collective oscillation of electrons in the grating metal can be compared with The incident light is resonantly coupled. The upper metal grating and the lower metal reflective layer work together to form a new modulation on the distribution of the light field, so that the light wave coupled into the microcavity propagates along the transverse direction and forms a cavity mode in the form of a standing wave. Its propagation direction changes from the z direction perpendicular to the detector plane in free space to the x direction along the detector plane, and is absorbed by the photoelectric conversion active layer 2 and converted into an electrical signal. This coupling method makes the photons in the microcavity almost unable to escape. Except for a small part of the heat loss at the metal interface, most of the photons will be absorbed by the photoelectric conversion material, which greatly improves the utilization rate of photons and correspondingly improves the photoelectricity. The response rate of the detector.

本发明的优点在于:The advantages of the present invention are:

1在光电探测器的光电耦合结构中提出一种全新的设计,利用上层金属光栅与下层金属反射层之间等离激元共振所形成的电磁波近场耦合微腔的模式选择效应,使得能够进入到微腔的光子以那些能够与探测波长形成共振的光子为主。1 A new design is proposed in the photoelectric coupling structure of the photodetector, which uses the mode selection effect of the electromagnetic wave near-field coupling microcavity formed by the plasmon resonance between the upper metal grating and the lower metal reflective layer, so that it can enter Photons to the microcavity are dominated by those capable of resonating with the probe wavelength.

2进入到微腔中的光子其电矢量方向在微腔模式的调制下由x方向改变为z方向,传播方向由z方向改变为x方向(一维情形)或x-y方向(二维情形),既能够被各向同性吸收特性的光电材料吸收,也能够被量子跃迁选择定则制约下只对z方向电场有吸收的量子阱子带跃迁吸收,并形成光电转换过程。采用本发明的耦合方式能够极大地提高光电探测器的响应率。在本发明的实施例中能够实现量子阱光电探测器的响应率提高160倍,具有极高的增强能力。2 The electric vector direction of the photons entering the microcavity is changed from the x direction to the z direction under the modulation of the microcavity mode, and the propagation direction is changed from the z direction to the x direction (one-dimensional case) or x-y direction (two-dimensional case), It can not only be absorbed by photoelectric materials with isotropic absorption characteristics, but also be absorbed by quantum well subband transitions that only absorb electric fields in the z direction under the constraints of quantum transition selection rules, and form a photoelectric conversion process. Adopting the coupling method of the present invention can greatly improve the responsivity of the photodetector. In the embodiment of the present invention, the responsivity of the quantum well photodetector can be increased by 160 times, which has a very high enhancement capability.

附图说明Description of drawings

图1是本发明的亚波长等离激元微腔耦合结构剖面结构示意图。图中1:上层金属条块形成的金属光栅层,2:光电转换激活层,3:下层金属反射层。FIG. 1 is a schematic cross-sectional structure diagram of a subwavelength plasmonic microcavity coupling structure of the present invention. In the figure 1: the metal grating layer formed by the upper metal strips, 2: the photoelectric conversion active layer, 3: the lower metal reflective layer.

图2是本发明的亚波长等离激元微腔耦合结构的金属光栅一维重复时的光电探测器像元三维结构示意图。图中1:上层金属线条形成的金属光栅层,2:光电转换激活层,3:下层金属反射层。Fig. 2 is a schematic diagram of the three-dimensional structure of the photodetector pixel when the metal grating of the subwavelength plasmon microcavity coupling structure of the present invention repeats in one dimension. In the figure 1: the metal grating layer formed by the upper metal lines, 2: the photoelectric conversion active layer, 3: the lower metal reflective layer.

图3是本发明的亚波长等离激元微腔耦合结构的金属光栅二维重复时的光电探测器像元三维结构示意图。图中1:上层金属方块形成的二维金属光栅层,2:光电转换激活层,3:下层金属反射层。3 is a schematic diagram of the three-dimensional structure of the photodetector pixel when the metal grating of the subwavelength plasmonic microcavity coupling structure of the present invention repeats two-dimensionally. In the figure 1: the two-dimensional metal grating layer formed by the upper metal square, 2: the photoelectric conversion active layer, 3: the lower metal reflective layer.

图4是本发明实施例一中利用有限差分时域方法计算得到的亚波长等离激元微腔耦合结构中单位周期情况下传播方向沿x方向、电矢量沿z方向的局域表面等离激元(LSP)模式的横向光场功率分布。在入射光到达光栅之前的总光功率取为单位值1的情况下,在图中白色虚线方框所示的区域内积分的平均光功率达到8,体现出极大的光场增强能力。积分区域只取微腔中的白框部分区域是考虑到作为光电转换器件,其结构中不可避免地必须包含有不具备光电转换功能的电极层,用于与金属电极形成欧姆接触并将光生载流子输出到金属电极上。白色虚线方框区域给出的是扣除了电极层之后的有效光电转换区域。图中1:上层金属光栅层,2:光电转换激活层,3:下层金属反射层。Fig. 4 is the local surface plasmon of the propagation direction along the x direction and the electric vector along the z direction in the subwavelength plasmon microcavity coupling structure calculated by using the finite difference time domain method in the first embodiment of the present invention. Transverse optical field power distribution of a polariton (LSP) mode. When the total optical power before the incident light reaches the grating is taken as a unit value of 1, the integrated average optical power in the area indicated by the white dashed box in the figure reaches 8, which shows a great light field enhancement capability. The integration area only takes the part of the white frame in the microcavity because it is considered that as a photoelectric conversion device, its structure must inevitably include an electrode layer that does not have a photoelectric conversion function, which is used to form an ohmic contact with the metal electrode and load the light. The current flow is output to the metal electrode. The white dotted box area shows the effective photoelectric conversion area after deducting the electrode layer. In the figure 1: upper metal grating layer, 2: photoelectric conversion active layer, 3: lower metal reflective layer.

图5是本发明实施例一中量子阱探测器响应率的比值曲线。比值计算时的分子部分是在亚波长等离激元微腔结构中的量子阱探测器实际测量得到的响应率随波长的变化关系,分母部分是同一晶片上的量子阱外延材料按45度磨角耦合方式测量得到的响应率随波长变化关系曲线。由于不受光栅等耦合结构对光电探测响应形状的调制,45度磨角结构所获得的响应光谱被认为是反映量子阱材料自身量子结构的吸收特性。图5的响应率比值曲线的物理意义在于,由于采用同一晶片上的外延光电吸收材料,用微腔结构的响应光谱除以量子阱自身的响应光谱,得到的是微腔结构中光场的模式强度随波长的变化关系,即光场模式分布,反映出光场在亚波长等离激元微腔结构中的集聚和增强。由图5可以看到,在波长位于15.5微米附近,增强可达160倍。由此,光电探测的响应率能够得到大幅度的提高。Fig. 5 is a ratio curve of the responsivity of the quantum well detector in Embodiment 1 of the present invention. The numerator part of the ratio calculation is the relationship between the responsivity and the wavelength actually measured by the quantum well detector in the subwavelength plasmonic microcavity structure, and the denominator part is the quantum well epitaxy material on the same wafer ground at 45 degrees. The relationship curve of responsivity versus wavelength measured by angular coupling. Since the response shape of photodetection is not modulated by coupling structures such as gratings, the response spectrum obtained by the 45-degree grinding angle structure is considered to reflect the absorption characteristics of the quantum well material's own quantum structure. The physical significance of the responsivity ratio curve in Figure 5 is that since the epitaxial photoelectric absorbing material on the same wafer is used, the response spectrum of the microcavity structure is divided by the response spectrum of the quantum well itself to obtain the mode of the light field in the microcavity structure The variation of intensity with wavelength, that is, the mode distribution of the light field, reflects the concentration and enhancement of the light field in the subwavelength plasmonic microcavity structure. It can be seen from Figure 5 that the enhancement can reach 160 times when the wavelength is near 15.5 microns. Thus, the responsivity of photodetection can be greatly improved.

具体实施方式Detailed ways

下面以光电转换材料为GaAs/AlxGal-xAs量子阱的亚波长等离激元微腔耦合结构为例,结合附图对本发明的具体实施方式作进一步的详细说明。Taking the sub-wavelength plasmon microcavity coupling structure in which the photoelectric conversion material is GaAs/ AlxGalxAs quantum wells as an example, the specific implementation of the present invention will be further described in detail in conjunction with the accompanying drawings.

见图1、图2和图3。本发明所涉及的提升光电探测器光响应的亚波长等离激元微腔耦合结构,包括:金属光栅层1,是周期为p、线宽为s、厚度为h1的周期排列的金属光栅,按一维(图2)或者二维(图3)周期性排列。本实施例中采用的金属为金。为了改善其黏附性,在其与光电转换激活层2之间附加了一层金属钛。金属光栅层1的周期p、线宽s和厚度h1通过有限差分时域(FDTD)方法计算决定,得到周期p的数值为探测波长的十分之一到十分之三十,线宽s的数值为以微米为单位的探测波长的十分之一到十分之十之间,厚度h1的值不小于以微米为单位的探测波长的平方根的0.0096倍。金属光栅层1通过薄膜淀积方法制备得到,并通过光刻和腐蚀形成光栅图形。See Figure 1, Figure 2 and Figure 3. The sub-wavelength plasmon microcavity coupling structure for improving the photoresponse of photodetectors involved in the present invention includes: a metal grating layer 1, which is a metal grating periodically arranged with a period of p, a line width of s, and a thickness of h1, Periodically arranged in one-dimensional (Figure 2) or two-dimensional (Figure 3). The metal used in this embodiment is gold. In order to improve its adhesion, a layer of metal titanium is added between it and the photoelectric conversion active layer 2 . The period p, line width s and thickness h1 of the metal grating layer 1 are calculated and determined by the finite difference time domain (FDTD) method. The value is between one-tenth and ten-tenths of the detection wavelength in microns, and the value of the thickness h1 is not less than 0.0096 times the square root of the detection wavelength in microns. The metal grating layer 1 is prepared by thin film deposition, and a grating pattern is formed by photolithography and etching.

光电转换激活层2,是指能够吸收入射光并产生光生载流子的半导体薄膜材料,可以是由单个或多个量子阱夹持在势垒层中形成的量子阱材料,也可以是由光电吸收半导体材料形成的p-n结。在光照下处于基态的载流子吸收光子跃迁到激发态上,形成光生载流子,并通过上、下金属电极将光生载流子输运到外电路中,形成光电转换的信号。光电转换激活层厚度h2由FDTD理论计算得到的优化结果决定,优化计算的目标是使耦合进入亚波长等离激元微腔中的电磁波所形成的横向驻波模式达到最强。按照等离激元微腔近场耦合要求,h2必须小于所探测入射光的等效光波长,即真空中的光波长除以该层物质的折射率。该光电转换激活层可由分子束外延(MBE)、金属有机化学汽相外延(MOCVD)或者其它薄膜外延方法制备在衬底上,之后通过衬底剥离的方法形成单独的外延层薄膜。The photoelectric conversion active layer 2 refers to a semiconductor thin film material capable of absorbing incident light and generating photogenerated carriers. It can be a quantum well material sandwiched by a single or multiple quantum wells in a barrier layer, or it can be made of a photoelectric A p-n junction formed by absorbing semiconductor materials. Under the light, the carriers in the ground state absorb photons and transition to the excited state to form photo-generated carriers, and transport the photo-generated carriers to the external circuit through the upper and lower metal electrodes to form photoelectric conversion signals. The thickness h2 of the photoelectric conversion active layer is determined by the optimization results obtained from FDTD theoretical calculations. The goal of the optimization calculations is to maximize the transverse standing wave mode formed by the electromagnetic wave coupled into the subwavelength plasmonic microcavity. According to the near-field coupling requirements of the plasmonic microcavity, h2 must be smaller than the equivalent light wavelength of the detected incident light, that is, the light wavelength in vacuum divided by the refractive index of the layer material. The photoelectric conversion active layer can be prepared on the substrate by molecular beam epitaxy (MBE), metal organic chemical vapor phase epitaxy (MOCVD) or other thin film epitaxy methods, and then a separate epitaxial layer film is formed by substrate lift-off method.

下层金属反射层3,是厚度h3不小于探测光波在金属中趋肤深度的一层完整金属层,即厚度h3不小于以微米为单位的探测波长的平方根的0.0048倍。该层金属反射层通过薄膜淀积方法制备得到。The lower metal reflective layer 3 is a complete metal layer with a thickness h3 not less than the skin depth of the detection light wave in the metal, that is, the thickness h3 is not less than 0.0048 times the square root of the detection wavelength in microns. The metal reflective layer is prepared by thin film deposition method.

在上述尺寸范围内,严格的FDTD理论计算表明,由于金属周期性光栅与金属反射层的共同耦合作用,对入射光形成耦合共振调制,使得入射光能够进入到厚度远小于波长尺度的耦合微腔中,其传播方向由垂直于探测器表面的z方向改变成平行于探测器表面的x方向或者x-y方向,并且形成了横向振荡的柱波。微腔中电磁波的电矢量沿z方向,既能够被量子阱子带跃迁吸收,也能够被其它各向同性的光电转换材料吸收。In the above size range, strict FDTD theoretical calculations show that due to the common coupling effect of the metal periodic grating and the metal reflective layer, the incident light is coupled and resonantly modulated, so that the incident light can enter the coupling microcavity whose thickness is much smaller than the wavelength scale. In , its propagation direction changes from the z direction perpendicular to the detector surface to the x direction or x-y direction parallel to the detector surface, and a transversely oscillating column wave is formed. The electric vector of the electromagnetic wave in the microcavity is along the z direction, which can be absorbed not only by quantum well subband transitions, but also by other isotropic photoelectric conversion materials.

本实施例采用的耦合结构的探测像元台面面积为230×200μm2,该面积可根据实际需要进行调整。本实施例中亚波长等离激元微腔耦合结构的制作过程可按照发明专利(专利号:201110082811.7,专利名称:用于光电功能器件的金属波导微腔光耦合结构的工艺制程)中的步骤方法来实现,也可通过其它微加工工艺过程实现。The detection pixel table area of the coupling structure used in this embodiment is 230×200 μm 2 , which can be adjusted according to actual needs. The manufacturing process of the sub-wavelength plasmonic microcavity coupling structure in this embodiment can follow the steps in the invention patent (patent number: 201110082811.7, patent name: process for metal waveguide microcavity optical coupling structure for optoelectronic functional devices) method, and can also be realized through other micromachining processes.

本实施例采用响应波长范围在10-16微米的GaAs/AlxGal-xAs量子阱作为光电转换激活材料,通过三个采用不同尺寸参数的耦合结构实施例来证明本发明的可行性和有效性。其中厚度尺寸参数h1、h2和h3固定不变,改变上层金属光栅的周期p、线宽s和黏性金属的厚度。This embodiment uses GaAs/ AlxGalxAs quantum wells with a response wavelength range of 10-16 microns as the photoelectric conversion active material, and proves the feasibility and effectiveness of the present invention through three coupling structure embodiments using different size parameters . The thickness dimension parameters h1, h2 and h3 are fixed, and the period p, line width s and thickness of the viscous metal grating are changed.

对于厚度尺寸参数h1,本实施例中取为0.1微米,满足不小于以微米为单位的探测波长的平方根的0.0096倍的条件。The thickness dimension parameter h1 is taken as 0.1 micron in this embodiment, which satisfies the condition that it is not less than 0.0096 times the square root of the detection wavelength in micron.

对于厚度尺寸参数h2,在本发明实施例中以入射光方向为上,则该层由从下到上的5个子层组成,分别是:子层厚度为490纳米的n型掺杂GaAs下电极层,掺杂浓度为5.0×1017cm-3;子层厚度为100纳米的AlxGal-xAs下势垒层,其中x=0.15;子层厚度为7纳米的n型掺杂GaAs势阱层,掺杂浓度为2.0×1017cm-3;子层厚度为100纳米的AlxGal-xAs上势垒层,其中x=0.15;子层厚度为190纳米的n型掺杂GaAs上电极层,掺杂浓度为5.0×1017cm-3。5个子层的总厚度构成h2,其值为887纳米,即0.887微米。该数值满足厚度小于等效波长的条件(对于本实施例中探测波长范围在10-16微米时,取量子阱折射率为3.3,则等效波长为3-4.5微米)。For the thickness dimension parameter h2, in the embodiment of the present invention, the direction of the incident light is taken as the upper direction, then the layer consists of 5 sub-layers from bottom to top, which are respectively: the n-type doped GaAs lower electrode with a sub-layer thickness of 490 nanometers layer, with a doping concentration of 5.0×10 17 cm -3 ; an Al x Ga lx As lower barrier layer with a sublayer thickness of 100 nanometers, where x=0.15; an n-type doped GaAs potential well with a sublayer thickness of 7 nanometers layer with a doping concentration of 2.0×10 17 cm -3 ; an Al x Ga lx As upper barrier layer with a sublayer thickness of 100 nm, where x=0.15; an n-type doped GaAs upper electrode with a sublayer thickness of 190 nm layer with a doping concentration of 5.0×10 17 cm -3 . The total thickness of the 5 sublayers constitutes h2, which has a value of 887 nanometers, or 0.887 micrometers. This value satisfies the condition that the thickness is smaller than the equivalent wavelength (for the detection wavelength range of 10-16 microns in this embodiment, if the refractive index of the quantum well is 3.3, the equivalent wavelength is 3-4.5 microns).

对于厚度尺寸参数h3,本实施例中取为0.1微米,满足不小于以微米为单位的探测波长的平方根的0.0048倍的条件。The thickness dimension parameter h3 is taken as 0.1 micron in this embodiment, which satisfies the condition that it is not less than 0.0048 times the square root of the detection wavelength in micron.

实施例一:上层金属为一维光栅,线宽s取为5.5微米,周期p取为9.6微米,黏性金属钛厚度为20纳米。Embodiment 1: The upper metal is a one-dimensional grating, the line width s is 5.5 microns, the period p is 9.6 microns, and the thickness of the viscous titanium metal is 20 nanometers.

实施例二:上层金属为一维光栅,线宽s取为1.36微米,为探测波长的十分之一。周期p取为2.6微米,满足大于线宽s的条件。黏性金属钛厚度为5纳米。Embodiment 2: The upper metal layer is a one-dimensional grating, and the line width s is taken as 1.36 microns, which is one-tenth of the detection wavelength. The period p is taken as 2.6 microns, which satisfies the condition of being greater than the line width s. The sticky metal titanium is 5 nanometers thick.

实施例三:上层金属为一维光栅,线宽s取为13.6微米,为探测波长的十分之十。周期p取为40微米,为探测波长的十分之三十。黏性金属钛厚度为30纳米。Embodiment 3: The upper metal layer is a one-dimensional grating, and the line width s is taken as 13.6 microns, which is ten tenths of the detection wavelength. The period p is taken as 40 microns, which is thirty-tenths of the detection wavelength. The sticky metal titanium is 30 nanometers thick.

实施例四:上层金属为二维方块光栅,线宽s取为5.5微米,周期p取为10.6微米,黏性金属钛厚度为20纳米。Embodiment 4: The upper metal is a two-dimensional square grating, the line width s is 5.5 microns, the period p is 10.6 microns, and the thickness of the viscous metal titanium is 20 nanometers.

上述四个实施例获得的结果相近,附图4和5中给出了实施例一的计算和测试结果。The results obtained in the above four embodiments are similar, and the calculation and test results of the first embodiment are shown in accompanying drawings 4 and 5 .

图4给出了本发明实施例一中由FDTD计算得到的波长为15.5微米的入射光在单位周期的亚波长等离激元微腔内部沿z方向的光场电矢量分布,并且给出了取入射光功率为单位值1时在有效光电转换厚度范围(如图中白色虚框所示)内的光功率增强倍数的积分平均值。可以明显看到,沿z方向入射的入射光在进入微腔之后被微腔等离激元调制,传播方向改变为沿x方向。由于等离激元微腔中的双层金属区域与单层金属区域之间存在着整体等效介电函数的突变,其界面处形成阻抗的失配。对于光波而言就形成了等效的突变界面,因此在双层金属区域两端的界面对于光波形成反射界面,构成一个F-P共振腔[具体见文献Y.Todorov,et al.,Strong Light-Matter Coupling in SubwavelengthMetal-Dielectric Microcavities at Terahertz Frequencies,Physical Review Letters102,186402(2009)]。光波在F-P共振腔中来回反射形成驻波,一方面集聚了光场的能量,另一方面使得光波在来回振荡的过程中不断地被光电转换材料吸收,极大地增加了光子的利用率。光场能量主要集聚在光栅金属层之下的双层金属的微腔范围内,最高的功率增加倍数可达到32。而整个光电转换材料范围内(图4中白色虚线框的范围)的增加倍数的积分平均值为8。Fig. 4 shows the distribution of the electric vector of the light field along the z direction inside the sub-wavelength plasmonic microcavity of the sub-wavelength plasmonic microcavity with a wavelength of 15.5 microns calculated by FDTD in the first embodiment of the present invention, and provides Take the integral average value of the optical power enhancement factor within the effective photoelectric conversion thickness range (as shown by the white dashed box in the figure) when the incident optical power is the unit value 1. It can be clearly seen that the incident light incident along the z direction is modulated by the microcavity plasmons after entering the microcavity, and the propagation direction is changed to be along the x direction. Because there is a sudden change in the overall equivalent dielectric function between the double-layer metal region and the single-layer metal region in the plasmonic microcavity, an impedance mismatch is formed at the interface. For light waves, an equivalent abrupt interface is formed, so the interfaces at both ends of the double-layer metal region form reflection interfaces for light waves, forming an F-P resonant cavity [see Y. Todorov, et al., Strong Light-Matter Coupling for details. in Subwavelength Metal-Dielectric Microcavities at Terahertz Frequencies, Physical Review Letters 102, 186402 (2009)]. The light wave is reflected back and forth in the F-P resonant cavity to form a standing wave. On the one hand, it gathers the energy of the light field, and on the other hand, the light wave is continuously absorbed by the photoelectric conversion material during the back and forth oscillation process, which greatly increases the utilization rate of photons. The energy of the light field is mainly concentrated in the microcavity range of the double-layer metal under the metal layer of the grating, and the highest power increase factor can reach 32. However, the integral average value of the increase factor within the entire range of the photoelectric conversion material (the range of the white dotted line box in FIG. 4 ) is 8.

图5是本发明实施例一中实际测量得到的量子阱探测器响应率的比值曲线。比值的分子部分是在亚波长等离激元微腔结构中的量子阱探测器实际测量得到的响应率随波长的变化关系,分母部分是同一晶片上的量子阱外延材料按45度磨角耦合方式测量得到的响应率随波长变化关系曲线。由于不受光栅等耦合结构对光电探测响应形状的调制,45度磨角结构所获得的响应光谱被认为是反映量子阱材料自身量子结构的吸收特性[具体见文献B.F.Levine,Quantum-well infrared photodetectors,Journal of Applied Physics 74(8),R1(1993)]。图5的响应率比值曲线的物理意义在于,由于采用同一晶片上的外延光电吸收材料,用微腔结构的响应光谱除以量子阱自身的响应光谱,得到的是光场模式强度随波长的变化关系,即微腔结构中光场的模式分布,反映出光场在亚波长等离激元微腔结构中的集聚和增强。由图5可以看到,在波长位于15.5微米处探测器的响应率提升了大约160倍,意味着量子阱的等效吸收长度延长了160倍,因为对比的是来自于同一晶片上的量子阱材料,两者的吸收系数和载流子输运长度相同。考虑到光场集聚8倍的效应,则实际等效吸收长度的增加值为20倍。光场集聚和等效吸收长度的增加这两种效应的叠加,极大地提高了光电响应器件的响应率,反映出本发明的亚波长等离激元微腔耦合结构对于提升光电响应率的有效性。Fig. 5 is a ratio curve of the responsivity of the quantum well detector actually measured in the first embodiment of the present invention. The numerator part of the ratio is the actual measurement of the responsivity of the quantum well detector in the subwavelength plasmonic microcavity structure as a function of wavelength, and the denominator part is the coupling of the quantum well epitaxial material on the same wafer at a grinding angle of 45 degrees. The relationship curve of responsivity versus wavelength measured by the method. Since the response shape of the photodetector is not modulated by the coupling structure such as a grating, the response spectrum obtained by the 45-degree grinding angle structure is considered to reflect the absorption characteristics of the quantum well material’s own quantum structure [see B.F.Levine, Quantum-well infrared photodetectors for details. , Journal of Applied Physics 74(8), R1(1993)]. The physical significance of the responsivity ratio curve in Figure 5 is that since the epitaxial photoelectric absorbing material on the same wafer is used, the response spectrum of the microcavity structure is divided by the response spectrum of the quantum well itself to obtain the change of the intensity of the light field mode with the wavelength The relationship, that is, the mode distribution of the light field in the microcavity structure, reflects the concentration and enhancement of the light field in the subwavelength plasmonic microcavity structure. It can be seen from Figure 5 that the responsivity of the detector at a wavelength of 15.5 microns is increased by about 160 times, which means that the equivalent absorption length of the quantum well is extended by 160 times, because the comparison is from the quantum well on the same wafer material, both have the same absorption coefficient and carrier transport length. Considering the 8-fold effect of light field concentration, the increase in the actual equivalent absorption length is 20 times. The superposition of these two effects, the light field concentration and the increase of the equivalent absorption length, greatly improves the responsivity of the photoelectric response device, reflecting the effectiveness of the sub-wavelength plasmonic microcavity coupling structure of the present invention in improving the photoelectric responsivity. sex.

Claims (3)

1. one kind promotes the subwavelength plasmon microcavity optical coupling structure of photodetector photoresponse, structure is pass through successively for sequence is the metal grating layer (1) that upper strata metal stick is formed successively with incident light, opto-electronic conversion active coating (2) and lower metal reflector (3), is characterized in that:
The metal grating layer (1) that described upper strata metal stick is formed, when One Dimension Periodic repeats, is the metal wire grating that the cycle is p, live width is s, thickness is h1 One Dimension Periodic arranges; When two-dimensional and periodic repeats, be the metal squares shape grating of the two-dimension periodic arrangement that the cycle in both direction is p, live width is s, thickness is h1, this layer of material includes but not limited to gold or the silver of high conductivity; The numerical value of the period p of the metal grating layer (1) that upper strata metal stick is formed is 30/10 to ten/10ths of detection wavelength, the numerical value of live width s be detection wavelength 10/10 to ten/10ths between, the value of thickness h 1 is not less than subduplicate 0.0096 times of the detection wavelength in units of micron;
Described opto-electronic conversion active coating (2) grows for utilizing epitaxially grown method the single or multiple lift semiconductor optoelectronic converting function material formed on backing material and by substrate desquamation technique, composite material includes but not limited to GaAs and AlGaAs, Si, Ge, HgCdTe, GaN, InGaAs, InAlAs and InP or InGaAs and GaAs, and the numerical value of its thickness h 2 is not more than 1/3rd of detection wavelength;
Described lower metal reflector (3) refers to that thickness is the metal level that one deck of h3 is complete, and the value of h3 is not less than subduplicate 0.0048 times of the detection wavelength in units of micron, and its material includes but not limited to gold or the silver of high conductivity.
2. a kind of subwavelength plasmon microcavity optical coupling structure promoting photodetector photoresponse according to claim 1, it is characterized in that: the stickiness metal level being attached with the adhesion improving the metal grating layer (1) that upper strata metal stick is formed between the metal grating layer (1) and opto-electronic conversion active coating (2) of described upper strata metal stick formation, its thickness is 5 ~ 30 nanometers, and material includes but not limited to titanium.
3. a kind of subwavelength plasmon microcavity optical coupling structure promoting photodetector photoresponse according to claim 1, it is characterized in that: between described opto-electronic conversion active coating (2) and lower metal reflector (3), be attached with the stickiness metal level improving lower metal reflector (3) adhesion, its thickness is the stickiness metal of 5 ~ 30 nanometers, and its material includes but not limited to titanium.
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* Cited by examiner, † Cited by third party
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CN105181130A (en) * 2015-07-03 2015-12-23 中国电子科技集团公司信息科学研究院 Detector and manufacturing method thereof
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2510997Y (en) * 2001-11-27 2002-09-11 北京邮电大学 High-speed and high-sensitivity resonant-cavity reinforced photoelectric detector
CN102221406A (en) * 2011-05-24 2011-10-19 中国科学院上海技术物理研究所 Monolithic integrated InGaAs near-infrared detector for sub-wavelength micro-polarization grating
CN102305959A (en) * 2011-09-05 2012-01-04 上海交通大学 Focusing system having grating structure
CN103762220A (en) * 2014-01-17 2014-04-30 中国科学院上海技术物理研究所 High-linearity degree-of-polarization quantum-well infrared detector with plasmon micro-cavity coupled structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2510997Y (en) * 2001-11-27 2002-09-11 北京邮电大学 High-speed and high-sensitivity resonant-cavity reinforced photoelectric detector
CN102221406A (en) * 2011-05-24 2011-10-19 中国科学院上海技术物理研究所 Monolithic integrated InGaAs near-infrared detector for sub-wavelength micro-polarization grating
CN102305959A (en) * 2011-09-05 2012-01-04 上海交通大学 Focusing system having grating structure
CN103762220A (en) * 2014-01-17 2014-04-30 中国科学院上海技术物理研究所 High-linearity degree-of-polarization quantum-well infrared detector with plasmon micro-cavity coupled structure

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