CN104227219A - Diffusion welding method - Google Patents
Diffusion welding method Download PDFInfo
- Publication number
- CN104227219A CN104227219A CN201410342246.7A CN201410342246A CN104227219A CN 104227219 A CN104227219 A CN 104227219A CN 201410342246 A CN201410342246 A CN 201410342246A CN 104227219 A CN104227219 A CN 104227219A
- Authority
- CN
- China
- Prior art keywords
- copper
- welding
- diffusion
- aluminum
- welding method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention belongs to the technical field of metal welding and particularly relates to a diffusion welding method. The method disclosed by the invention comprises the following concrete steps: providing aluminum and copper; processing a copper welding face to form grooves; forming a diffusion impervious layer on the welding face; welding the aluminum and the copper by adopting a hot isostatic pressing method. According to the method disclosed by the invention, large-area diffusion welding on the aluminum and the copper is realized by utilizing the diffusion impervious layer to obtain a high-strength weldment; the diffusion impervious layers are respectively formed on an aluminum welding face and the copper welding face, and thus, an aluminum and copper intermetallic compound can be effectively prevented from being produced, and therefore higher welding strength is obtained; large-area welding on the aluminum and the copper can be realized by adopting the hot isostatic pressing method, and stable and consistent welding quality is obtained; when the aluminum serves as a transition layer for welding the copper and other metals, one-step welding can be realized, processing steps are reduced, the processing cycle is shortened, and the production cost is reduced.
Description
Technical field
The invention belongs to metal welding techniques field, particularly a kind of diffusion welding method.
Background technology
Target material assembly in semicon industry is welded to form by target and backboard usually.Target mostly is high pure metal and processes, cost is higher, and be much difficult to weld because material property difference is comparatively large between target material with backboard, therefore need to add transition zone between target and backboard, while buffering target and back veneer material performance gap, reduce target material assembly cost.Copper relies on excellent electrical and thermal conductivity performance to become conventional back veneer material, and the hardness of aluminium is low, plasticity is good, cheap, is excellent buffer layer material.
At present, the welding of target material assembly adopts high temperature insostatic pressing (HIP) mode usually, is especially added with the target material assembly of transition zone, only has and can realize single step welding by high temperature insostatic pressing (HIP), reduce unnecessary process, save production cost.Aluminium and copper are difficult to obtain the weld seam of high strength owing to easily producing brittle intermetallic thing, existing copper aluminium welding manner is not suitable for the welding of target material assembly due to process limitation.Therefore, a kind of welding method must be found, be applicable to the large area hot isostatic press welding of aluminium and copper, prevent the generation of aluminum bronze intermetallic compound, obtain high-intensity welding assembly.
Summary of the invention
The object of this invention is to provide a kind of welding method, solve aluminium and the low problem of copper diffusion welding strength.
For solving the problem, the invention provides a kind of diffusion welding method, its concrete steps are as follows:
(1) aluminium and copper are provided;
(2) aluminium solder side or processed groove copper solder side on prepare diffusion impervious layer;
(3) high temperature insostatic pressing (HIP) method is adopted to be welded with copper by aluminium.
Described aluminium is pure aluminum or aluminum alloy.
Described copper is fine copper or copper alloy.
Described groove shapes is circular arc, V-arrangement, rectangle or inverted trapezoidal.
Described diffusion impervious layer is nickel dam or nickel alloy layer.
The preparation method of described diffusion impervious layer is sputtering, vacuum evaporation, chemical plating, plating or spraying.
The thickness of described diffusion impervious layer is 0.01 μm ~ 1000 μm.
The temperature of described high temperature insostatic pressing (HIP) method is 200 DEG C ~ 600 DEG C, and pressure is 50MPa ~ 150MPa, and temperature retention time is 0.5 ~ 10 hour.
Beneficial effect of the present invention is:
(1) on the solder side of aluminium and copper, form the generation that diffusion impervious layer effectively can stop aluminum bronze intermetallic compound, obtain higher weld strength; (2) adopt high temperature insostatic pressing (HIP) method can realize the large-area welding of aluminum bronze, obtain the welding quality of stable and consistent; (3) when aluminium welds as realizing a step during transition zone of copper with other metal solder, reduce processing step, shorten the process-cycle, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the process chart of aluminium of the present invention and copper Diffusion Welding;
Fig. 2 to Fig. 5 is the schematic diagram of the embodiment of the present invention 1 aluminium and copper diffusion welding method;
Fig. 6 is aluminum bronze weld interface place SEM photo in embodiment 1;
Fig. 7 is aluminum bronze weld interface place SEM photo in comparative example 1;
Number in the figure: 20-aluminium; 200-aluminium solder side; 21-copper; 210-brazing junction; 22-diffusion impervious layer.
Detailed description of the invention
The invention provides a kind of diffusion welding method, below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Embodiment 1
Fig. 1 is the process chart of aluminium of the present invention and copper Diffusion Welding.As shown in Figure 1, perform step S101, aluminium and copper are provided;
Perform step S102, the solder side of aluminium or copper forms diffusion impervious layer;
Perform step S103, adopting high temperature insostatic pressing (HIP) method that aluminium and copper are carried out Diffusion Welding, is diffusion impervious layer between the two solder side.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.
Fig. 2 to Fig. 5 is the embodiment schematic diagram that aluminium of the present invention and brazing connect.As shown in Figure 2, provide aluminium 20, material is specifically as follows fine aluminium or aluminum series alloy, the sheet material that can have any shape.As a preferred embodiment, the material of aluminium 20 selects the trade mark 1050 commercial-purity aluminium, and shape is circular, diameter 420mm, thickness 2mm.
As shown in Figure 3, provide copper 21, the material of described copper 21 can be fine copper or copper series alloy.The solder side 210 of copper 21 is processed to form a series of equally distributed groove, and because this technology is those skilled in the art institute man-hour, therefore not to repeat here.As a preferred embodiment, copper 21 selects Jackson's alloy, and shape is circular, and diameter 420mm, thickness 10mm, process a series of equally distributed v-depression in brazing junction 210.
As shown in Figure 4, aluminium solder side 200 or brazing junction 210 prepare diffusion impervious layer 22.The method preparing diffusion impervious layer 22 has multiple, and specifically can adopt the techniques such as sputtering, vacuum evaporation, chemical plating, plating or spraying, material is specially nickel dam or nickel alloy layer.As a preferred embodiment, in the reeded brazing junction 210 of processing, sputtering sedimentation nickel metal layer is as diffusion impervious layer, sputtering technology have film forming thickness evenly, the advantage such as strong adhesion, film thickness monitoring be accurate.The thickness of described diffusion impervious layer can be 0.01 μm ~ 1000 μm, and the present embodiment selects thickness to be 1 μm.
As shown in Figure 5, carry out hot isostatic press welding, aluminium 20 and copper 21 are carried out Diffusion Welding.Welding temperature can be selected in 200 DEG C ~ 600 DEG C, and pressure remains on 50MPa ~ 150MPa, temperature retention time 0.5 ~ 10 hour, and hot isostatic press welding parameter selected by the present embodiment is 490 DEG C, pressure 100MPa, is incubated 3 hours.Those skilled in the art are in common knowledge in order to go for concrete hot isostatic press welding process, repeat no more.
Carry out strength test to described embodiment after whole implementing procedure completes, gained tensile strength values reaches 108MPa.Weld seam sem analysis is carried out to embodiment sample, as shown in Figure 6, goes out not have intermetallic compound to generate at aluminum bronze weld interface, microcosmic ensure that the reliability of welding quality.
Although the present invention announces as above with preferred embodiment; but restriction is not formed to the present invention; any person skilled in the art all can make certain variation and amendment in spirit of the present invention and scope, and the scope that therefore protection scope of the present invention should define with claim of the present invention is as the criterion.
Comparative example 1
Select the trade mark 1050 commercial-purity aluminium, shape is circular, diameter 420mm, thickness 2mm; Select Jackson's alloy, shape is circular, and diameter 420mm, thickness 10mm, brazing junction 210 processes a series of equally distributed v-depression, and in hot isostatic press welding technique same as the previously described embodiments, temperature 490 DEG C, pressure 100MPa, is incubated 3 hours.
Carry out weld strength test to comparative example after completing welding, gained tensile strength values is 28MPa.Carry out weld seam sem analysis to sample, as shown in Figure 7, aluminum bronze solder side generates compound between three-layer metal, thickness reaches 29 μm, has had a strong impact on weld strength.
Claims (8)
1. a diffusion welding method, is characterized in that, concrete steps are as follows:
(1) aluminium and copper are provided;
(2) aluminium solder side or processed groove copper solder side on prepare diffusion impervious layer;
(3) high temperature insostatic pressing (HIP) method is adopted to be welded with copper by aluminium.
2. a kind of diffusion welding method according to claim 1, is characterized in that: described aluminium is pure aluminum or aluminum alloy.
3. a kind of diffusion welding method according to claim 1, is characterized in that: described copper is fine copper or copper alloy.
4. a kind of diffusion welding method according to claim 1, is characterized in that: described groove shapes is circular arc, V-arrangement, rectangle or inverted trapezoidal.
5. a kind of diffusion welding method according to claim 1, is characterized in that: described diffusion impervious layer is nickel dam or nickel alloy layer.
6. a kind of diffusion welding method according to claim 1, is characterized in that: the preparation method of described diffusion impervious layer is sputtering, vacuum evaporation, chemical plating, plating or spraying.
7. a kind of diffusion welding method according to claim 1, is characterized in that: the thickness of described diffusion impervious layer is 0.01 μm ~ 1000 μm.
8. a kind of diffusion welding method according to claim 1, is characterized in that: the temperature of described high temperature insostatic pressing (HIP) method is 200 DEG C ~ 600 DEG C, and pressure is 50MPa ~ 150MPa, and temperature retention time is 0.5 ~ 10 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410342246.7A CN104227219A (en) | 2014-07-17 | 2014-07-17 | Diffusion welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410342246.7A CN104227219A (en) | 2014-07-17 | 2014-07-17 | Diffusion welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104227219A true CN104227219A (en) | 2014-12-24 |
Family
ID=52216600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410342246.7A Pending CN104227219A (en) | 2014-07-17 | 2014-07-17 | Diffusion welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104227219A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526676A (en) * | 2018-03-28 | 2018-09-14 | 西北工业大学 | Hot isostatic pressing diffusion connection TiAl alloy and Ti2The method of AlNb alloy annular parts |
| CN109628798A (en) * | 2019-01-21 | 2019-04-16 | 苏州东方模具科技股份有限公司 | Glass mold bimetallic mouth mold and preparation method thereof |
| CN111299797A (en) * | 2020-03-13 | 2020-06-19 | 天津金键航天设备有限公司 | Diffusion welding method for aluminum or aluminum alloy and high-hardness metal or alloy and product |
| CN112067643A (en) * | 2020-09-08 | 2020-12-11 | 宁波江丰电子材料股份有限公司 | Sample preparation method for SEM detection of welding diffusion layer of high-purity aluminum target assembly |
| CN113278932A (en) * | 2020-12-30 | 2021-08-20 | 有研亿金新材料有限公司 | One-step forming preparation method of diffusion welding type AlSc alloy target material |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
| WO2004024972A2 (en) * | 2002-09-13 | 2004-03-25 | Tosoh Smd, Inc. | Systems and methods for a target and backing plate assembly |
| CN102059421A (en) * | 2010-12-09 | 2011-05-18 | 宁波江丰电子材料有限公司 | Ti target material and Al backboard welding method |
| CN102437135A (en) * | 2011-12-19 | 2012-05-02 | 南通富士通微电子股份有限公司 | Wafer-level columnar bump packaging structure |
| CN103343321A (en) * | 2012-03-12 | 2013-10-09 | 有研亿金新材料股份有限公司 | Method of manufacturing sputtering target |
| CN103521910A (en) * | 2012-07-05 | 2014-01-22 | 宁波江丰电子材料有限公司 | Method for target material component welding |
-
2014
- 2014-07-17 CN CN201410342246.7A patent/CN104227219A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
| WO2004024972A2 (en) * | 2002-09-13 | 2004-03-25 | Tosoh Smd, Inc. | Systems and methods for a target and backing plate assembly |
| CN102059421A (en) * | 2010-12-09 | 2011-05-18 | 宁波江丰电子材料有限公司 | Ti target material and Al backboard welding method |
| CN102437135A (en) * | 2011-12-19 | 2012-05-02 | 南通富士通微电子股份有限公司 | Wafer-level columnar bump packaging structure |
| CN103343321A (en) * | 2012-03-12 | 2013-10-09 | 有研亿金新材料股份有限公司 | Method of manufacturing sputtering target |
| CN103521910A (en) * | 2012-07-05 | 2014-01-22 | 宁波江丰电子材料有限公司 | Method for target material component welding |
Non-Patent Citations (1)
| Title |
|---|
| 孟胶东等: "Al-Cu双金属复合结构的扩散连接试验研究", 《材料工程》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526676A (en) * | 2018-03-28 | 2018-09-14 | 西北工业大学 | Hot isostatic pressing diffusion connection TiAl alloy and Ti2The method of AlNb alloy annular parts |
| CN109628798A (en) * | 2019-01-21 | 2019-04-16 | 苏州东方模具科技股份有限公司 | Glass mold bimetallic mouth mold and preparation method thereof |
| CN111299797A (en) * | 2020-03-13 | 2020-06-19 | 天津金键航天设备有限公司 | Diffusion welding method for aluminum or aluminum alloy and high-hardness metal or alloy and product |
| CN111299797B (en) * | 2020-03-13 | 2021-12-14 | 天津金键航天设备有限公司 | Diffusion welding method for aluminum or aluminum alloy and high-hardness metal or alloy and product |
| CN112067643A (en) * | 2020-09-08 | 2020-12-11 | 宁波江丰电子材料股份有限公司 | Sample preparation method for SEM detection of welding diffusion layer of high-purity aluminum target assembly |
| CN113278932A (en) * | 2020-12-30 | 2021-08-20 | 有研亿金新材料有限公司 | One-step forming preparation method of diffusion welding type AlSc alloy target material |
| CN113278932B (en) * | 2020-12-30 | 2022-06-17 | 有研亿金新材料有限公司 | One-step forming preparation method of diffusion welding type AlSc alloy target material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104259644B (en) | A kind of welding method of tungsten-titanium alloy target | |
| CN102554455B (en) | Diffusion welding method for tungsten-titanium alloy target and copper alloy back plate | |
| CN104227219A (en) | Diffusion welding method | |
| WO2015085650A1 (en) | Method for diffusion welding w-ti alloy target material assembly | |
| KR101528373B1 (en) | A sputter target assembly having a controlled solder thickness | |
| JP5297378B2 (en) | Sputtering target assembly and method of manufacturing the same | |
| CN104690417A (en) | Welding method for nickel or nickel alloy target and back panel | |
| JP2012132065A (en) | Cylindrical sputtering target and method for manufacturing the same | |
| CN112475796B (en) | Welding method of target assembly | |
| TWI498435B (en) | Sputter target assembly having a low-temperature high-strength bond | |
| CN104625389A (en) | Welding method of aluminum alloy sputtering target material for integrated circuit package material | |
| CN202922105U (en) | Connecting structure of target and back plate | |
| CN104646817A (en) | Connection method of aluminum target material as sputtering target material and aluminum alloy backboard | |
| US10600719B2 (en) | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | |
| CN102009238A (en) | Molybdenum target welding method | |
| TWI504767B (en) | Sputtering target - support plate joint and its manufacturing method | |
| WO2012066764A1 (en) | Backing plate, target assembly, and sputtering target | |
| CN107321812B (en) | Preparation method of composite metal sheet with spliced and combined structure and composite metal sheet | |
| CN202825019U (en) | Cobalt target with high intensity | |
| CN203700498U (en) | Structure of high-performance sputtering target assembly | |
| CN102430865B (en) | Welding method of target material and back plate and target material component formed thereby | |
| CN105220121A (en) | A kind of target material assembly and preparation method thereof | |
| CN112676782B (en) | Method for assembling titanium target and copper back plate | |
| CN102059519A (en) | Method for preparing back plate and back plate structure | |
| JP6051492B2 (en) | Diffusion bonding sputtering target assembly manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141224 |