CN104143578A - Solar energy backing plate and manufacturing method thereof - Google Patents
Solar energy backing plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN104143578A CN104143578A CN201410370957.5A CN201410370957A CN104143578A CN 104143578 A CN104143578 A CN 104143578A CN 201410370957 A CN201410370957 A CN 201410370957A CN 104143578 A CN104143578 A CN 104143578A
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- CN
- China
- Prior art keywords
- polyamide
- layer
- solar energy
- energy backboard
- adipamide
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- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000004952 Polyamide Substances 0.000 claims abstract description 56
- 229920002647 polyamide Polymers 0.000 claims abstract description 56
- -1 polypropylene Polymers 0.000 claims abstract description 55
- 239000004743 Polypropylene Substances 0.000 claims abstract description 36
- 229920001155 polypropylene Polymers 0.000 claims abstract description 35
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims abstract description 12
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 9
- 229920000098 polyolefin Polymers 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 92
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 81
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 claims description 30
- 239000012528 membrane Substances 0.000 claims description 20
- 229920002292 Nylon 6 Polymers 0.000 claims description 18
- 239000004698 Polyethylene Substances 0.000 claims description 14
- 229920000573 polyethylene Polymers 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 13
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 239000012760 heat stabilizer Substances 0.000 claims description 11
- 239000001361 adipic acid Substances 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000002924 oxiranes Chemical group 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- 235000011037 adipic acid Nutrition 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229920006351 engineering plastic Polymers 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 6
- 229920001179 medium density polyethylene Polymers 0.000 claims description 6
- 239000004701 medium-density polyethylene Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 229920001684 low density polyethylene Polymers 0.000 claims description 5
- 239000004702 low-density polyethylene Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 claims description 3
- BLDFSDCBQJUWFG-UHFFFAOYSA-N 2-(methylamino)-1,2-diphenylethanol Chemical compound C=1C=CC=CC=1C(NC)C(O)C1=CC=CC=C1 BLDFSDCBQJUWFG-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 229920000571 Nylon 11 Polymers 0.000 claims description 3
- 229920000299 Nylon 12 Polymers 0.000 claims description 3
- 229920003189 Nylon 4,6 Polymers 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 3
- 229920006152 PA1010 Polymers 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 150000001470 diamides Chemical class 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- 229920001903 high density polyethylene Polymers 0.000 claims description 3
- 239000004700 high-density polyethylene Substances 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920006396 polyamide 1012 Polymers 0.000 claims description 3
- 229920006394 polyamide 410 Polymers 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 235000012222 talc Nutrition 0.000 claims description 3
- 229920001897 terpolymer Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229920000092 linear low density polyethylene Polymers 0.000 claims 2
- 239000004707 linear low-density polyethylene Substances 0.000 claims 2
- 239000010408 film Substances 0.000 abstract description 13
- 238000003912 environmental pollution Methods 0.000 abstract description 10
- 230000032683 aging Effects 0.000 abstract description 9
- 230000007062 hydrolysis Effects 0.000 abstract description 7
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 7
- 229920002313 fluoropolymer Polymers 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 9
- 239000002985 plastic film Substances 0.000 description 9
- 229920006255 plastic film Polymers 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- HEJCZAMFVMNFLC-UHFFFAOYSA-N 10-oxo-10-(2,2,6,6-tetramethylpiperidin-4-yl)oxydecanoic acid Chemical class CC1(C)CC(OC(=O)CCCCCCCCC(O)=O)CC(C)(C)N1 HEJCZAMFVMNFLC-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000003636 chemical group Chemical group 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a solar energy backing plate and a manufacturing method of the solar energy backing plate. The solar energy backing plate comprises a base film layer, a weather-proof layer, a reflective layer and two bonding layers, wherein the weather-proof layer and the reflective layer are located on the two opposite sides of the base film layer and are respectively bonded to the two bonding layers on the base film layer. The base film layer is made of a polypropylene alloy, the weather-proof layer is made of a polyamide material, the surface of the weather-proof layer is provided with protrusive structures, so that heat radiation of the weather-proof layer is increased, the weather-proof layer is excellent in heat dissipating and cooling performance, the reflective layer is made of a polyolefin material, and the bonding layers are made of ethylene copolymers containing epoxy groups or an alloy of the ethylene copolymers. The polypropylene alloy layer is adopted for replacing a PET layer of a traditional backing plate and is higher in hydrolysis resistance and ageing resistance; polyamide is adopted for replacing a fluoroplastic thin film of the traditional backing plate, the cost is reduced, and environmental pollution can be reduced. The invention further discloses the manufacturing method of the solar energy backing plate.
Description
Technical field
The present invention relates to a kind of solar energy backboard and preparation method thereof.
Background technology
Solar energy backboard is positioned at the back side of solar panel, and cell piece is played to protection and supporting role, and protection photovoltaic module is not by erosions such as steam in 25 years even longer time, and it need have reliable insulating properties, water preventing ability, resistance to ag(e)ing.
Solar energy backboard mainly comprises weathering layer, structural reinforcing layer and reflector three-decker, and the back board structure of conventionally using at present has TPT structure and TPE structure, wherein T refers to the Tedlar film of E.I.Du Pont Company, composition is polyvinyl fluoride (PVF), P refers to PETG (PET) film, and E refers to ethylene-vinyl acetate resin (EVA) film.Therefore, TPT structure refers to PVF film+PET film+PVF membrane structure, and TPE structure refers to PVF film+PET film+eva film structure, bonding with adhesive between three-layer thin-film.Its typical production of the backboard of TPT structure business is European Isovolta company.The backboard of TPE structure is the patented product (seeing patent application W02004/091901A2) of the Madico company of the U.S..
Tradition backboard preparation technology multilayer polymer film solvent adhesive applies compound technology, preparation technology unreels for PET film roll first, by upper glue roller, one side of PET film is applied to solvent adhesive, then by baking oven to PET film drying, remove organic solvent, compound with fluoropolymer film again, such technique also needs to come again, an other side at PET film applies solvent adhesive again, afterwards dry and polyolefin film is combined with each other, pass through again under hot and humid condition slaking 72 hours, make thus backboard.Due to an organic solvent glue of this traditional handicraft, the volatilization of organic solvent can cause environmental pollution, the recovery of solvent is also brought to the increase of preparation cost.In addition, because needs are through twice gluing, dry and compound, and post-cure, backboard production efficiency is lower.
Tradition is used in backboard and is used fluorine plastic film as weathering layer, its resistance to long-term outdoor aging excellent performance, and still, fluorine plastic film itself with high costs, can limit its more massive application.In addition, the ageing-resistant performance of fluorine plastic film excellence is its advantage, is also its shortcoming simultaneously.That is exactly when following solar components is scrapped, these material requires recycle, and excellent corrosion-resistant, the ageing-resistant performance of fluorine plastic film itself, stop the ability of environment to its degradation treatment, and, form because solar energy backboard mostly is MULTILAYER COMPOSITE, due to its layers of material difference, reclaim reprocessing difficulty.In future, fluoroplastics pollute more difficult than present white pollution.In addition, the PET plastic film that the structural reinforcing layer of traditional backboard uses, its wet-heat resisting hydrolysis property is poor, in long-term hygrothermal environment uses, can embrittlement ftracture, and causes the deteriorated of solar cell properties or loses efficacy.
Solar cell is the device that light energy conversion is become to electric energy, in the process transforming, can produce heat energy, and the temperature of cell piece is raise.Temperature raises, and can cause the photoelectric conversion rate of solar cell to decline.Existing backboard product adopts increase metal or high thermal conductivity layer to increase its heat dispersion more.The patent that for example application number is 201310600822.9, by increasing aluminium alloy layer, increases the heat dispersion of backboard.Application number is 201180063061.7 patent, by increase dispel the heat China ink layer and metal level, increases the heat dispersion of backboard.The heat dispersion that improves backboard by increasing metal or high thermal conductivity layer, this all can increase manufacture craft and the cost of solar energy backboard undoubtedly.
Summary of the invention
The object of this invention is to provide a kind of solar energy backboard and preparation method thereof, it solves traditional solar energy backboard hydrolysis, the not good problem of ageing-resistant performance.
The present invention realizes like this, a kind of solar energy backboard, it comprises base membrane layer, is positioned at weathering layer and the reflector of the relative both sides of described base membrane layer, described weathering layer and described reflector is cohered respectively to the two-layer adhesive layer on described base membrane layer, and described base membrane layer is polypropylene alloy layer; Described weathering layer is polyamide material layer, and bulge-structure is contained on described weathering layer surface, to increase the thermal radiation of described solar energy backboard, makes described solar energy backboard have outstanding radiating and cooling performance; Described reflector is polyolefine material layer; Described adhesive layer is the alloy of the ethylene copolymer that contains epoxide group or itself and ethene copolymer.
As the further improvement of such scheme, described polyamide material layer comprises polyamide, stabilizer, antioxidant and inorganic material.Preferably, described polyamide is one or more the combination being selected from following component: polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 610, polyamide 612, polyamide 6 14, polyamide 6 13, polyamide 6 15, polyamide 6 16, polyamide 11, polyamide 12, polyamide 10, polyamide 912, polyamide 913, polyamide 914, polyamide 915, polyamide 6 16, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly terephthalic acid adipamide, poly terephthalic acid nonanedioyl amine, poly terephthalic acid decanediamide, poly terephthalic acid 12 diamides, adipic acid adipamide/terephthalic acid (TPA) adipamide copolyamide, terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, poly-adipic acid meta-xylene acid amides, terephthalic acid (TPA) adipamide/terephthalic acid (TPA) 2-methyl glutaryl amine, adipic acid adipamide/terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, polycaprolactam-terephthalic acid (TPA) adipamide.
As the further improvement of such scheme, described polypropylene alloy layer is the alloy of polypropylene or modified polypropene and engineering plastics; Described engineering plastics are polyamide or polyphenylene oxide; Described modified polypropene is formed by described polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, graft polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, heat stabilizer and inorganic filler blending and modifying; Described inorganic filler is selected from the one in calcium carbonate, titanium dioxide, barium sulfate, mica, talcum, kaolin, glass microballoon and glass fibre.
As the further improvement of such scheme, described polyolefine material layer is polyethylene alloy, described polyethylene comprises following composition: low density polyethylene, LLDPE LLDPE, medium density polyethylene MDPE, high density polyethylene, C2-C8 alkene grafted polyethylene or with the copolymer of ethene, maleic anhydride grafted polyethylene, silane grafted polyethylene.
As the further improvement of such scheme, described in contain epoxide group ethylene copolymer be the terpolymer of ethene, acrylate, glycidyl methacrylate.
As the further improvement of such scheme, described weathering layer surface has bulge-structure.Preferably, described bulge-structure is decorative pattern, and described decorative pattern is rhombus or ellipse, and the length of side of described rhombus or the mean value of the described oval-shaped line of apsides is 5-100 micron, and distribution density is 1 × 10
2～4 × 10
6individual/square centimeter, height of projection is 5-100 micron.
As the further improvement of such scheme, the thickness of described base membrane layer is 50-500 micron; The thickness of described weathering layer is 10-100 micron; The thickness in described reflector is 10-200 micron; The thickness of described adhesive layer is 10-200 micron.
The present invention also provides the preparation method of above-mentioned any solar energy backboard, and described solar energy backboard adopts multiple layer polymer co-extrusion mode one-step shaping.
As the further improvement of such scheme, in the time of moulding, on the weathering layer of solar energy backboard, impress projection structure with the surperficial chill roll with sunk structure.
The present invention adopts polypropylene alloy layer, replaces the PET polyester layer of traditional backboard, and its hydrolysis, ageing-resistant performance are more excellent; Adopt polyamide to replace the fluorine plastic film of traditional backboard, cost, can reduce environmental pollution simultaneously; In addition, adopt polymer multi-layer coextrusion process to substitute traditional backboard organic solvent glue and apply combination process, contribute to reduce backboard cost, increase production efficiency, avoid environmental pollution; Meanwhile, on backboard weathering layer, increase pattern structure, to increase its thermal radiation, make it have outstanding heat dispersion, can solve the problem that solar components heat radiation photovoltaic module transformation efficiency not enough and that cause declines, and the present invention does not need to increase preparation technology and cost.
Brief description of the drawings
The structural representation of the solar energy backboard that Fig. 1 provides for preferred embodiments of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1, the solar energy backboard that preferred embodiments of the present invention provides has special construction, and it comprises base membrane layer 1, is positioned at weathering layer 2 and the reflector 3 of the relative both sides of described base membrane layer 1, described weathering layer 2 is cohered respectively to the two-layer adhesive layer 4 on described base membrane layer 1 with described reflector 3.
Described base membrane layer 1 is polypropylene alloy layer, and described polypropylene alloy layer is the alloy of polypropylene or modified polypropene and engineering plastics.Described engineering plastics are polyamide or polyphenylene oxide; Described modified polypropene is formed by described polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, graft polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, heat stabilizer and inorganic filler blending and modifying; Described inorganic filler is selected from the one in calcium carbonate, titanium dioxide, barium sulfate, mica, talcum, kaolin, glass microballoon and glass fibre.
It is base membrane layer 1 that the present invention adopts polypropylene alloy layer, replaces the PET polyester layer of traditional backboard, and its hydrolysis, ageing-resistant performance are more excellent.
Described weathering layer 2 is polyamide material layer, and described polyamide material layer comprises polyamide, stabilizer, antioxidant and inorganic material.Described polyamide is one or more the combination being selected from following component: polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 610, polyamide 612, polyamide 6 14, polyamide 6 13, polyamide 6 15, polyamide 6 16, polyamide 11, polyamide 12, polyamide 10, polyamide 912, polyamide 913, polyamide 914, polyamide 915, polyamide 6 16, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly terephthalic acid adipamide, poly terephthalic acid nonanedioyl amine, poly terephthalic acid decanediamide, poly terephthalic acid 12 diamides, adipic acid adipamide/terephthalic acid (TPA) adipamide copolyamide, terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, poly-adipic acid meta-xylene acid amides, terephthalic acid (TPA) adipamide/terephthalic acid (TPA) 2-methyl glutaryl amine, adipic acid adipamide/terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, polycaprolactam-terephthalic acid (TPA) adipamide.
The present invention adopts polyamide to replace the fluorine plastic film of traditional backboard, and cost, can reduce environmental pollution simultaneously.
Described reflector 3 is polyolefine material layer, and described polyolefine material layer is polyethylene alloy.Described polyethylene comprises following composition: low density polyethylene, LLDPE LLDPE, medium density polyethylene MDPE, high density polyethylene, C2-C8 alkene grafted polyethylene or with the copolymer of ethene, maleic anhydride grafted polyethylene, silane grafted polyethylene.
Described adhesive layer 4 is the alloy of the ethylene copolymer that contains epoxide group or itself and ethene copolymer.The described ethylene copolymer that contains epoxide group can be the terpolymer of ethene, acrylate, glycidyl methacrylate.
The present invention adopts polymer multi-layer coextrusion process to replace the organic solvent glue of traditional TPE backboard to apply combination process in manufacturing process, and technique is simple, and cost is lower, one-step shaping.The problem of having avoided environmental pollution that traditional handicraft brings and energy consumption to increase.The chill roll that usable surface has a sunk structure in the time of moulding impresses projection structure on the weathering layer of solar energy backboard, and preparation technology is simple.
Described weathering layer 2 surfaces have special bulge-structure, to increase thermal radiation, make it have outstanding radiating and cooling performance.Described bulge-structure is decorative pattern, to increase its specific area.Described decorative pattern is rhombus or ellipse, and preferably, the length of side of described rhombus or the mean value of the described oval-shaped line of apsides are 5-100 micron, and distribution density is 1 × 10
2～4 × 10
6individual/square centimeter, height of projection is 5-100 micron.Again preferably, described decorative pattern is rhombus or ellipse, and the length of side of described rhombus or the mean value of the described oval-shaped line of apsides is 5-100 micron, and distribution density is 1 × 10
2～4 × 10
6individual/square centimeter, height of projection is 5-100 micron.
Solar energy backboard of the present invention, after its multilayer film is extruded by extrusion equipment, by upper and lower two steel riders (or rubber roll) cooling and shaping, by processing steel (glue) roller surface, can obtain having the roller of different concaveconvex structures or pattern structure, in the time that backboard is shaped, can obtain having the solar energy backboard of pattern structure like this, increase its specific area, heat sinking function is better.In preparation process, do not increase any operation, therefore can not increase technique and the cost of backboard.
The present invention is on existing backboard product basis, and after increase decorative pattern, its specific area will increase 1.1-2.8 doubly, and its heat conduction and thermal radiation are also by proportional increase, and photovoltaic module temperature reduces 2-10 DEG C, and the efficiency of photovoltaic module will improve 1-5 watt/square meter.
The thickness of described base membrane layer 1 is 50-500 micron; The thickness of described weathering layer 2 is 10-100 micron; The thickness in described reflector 3 is 10-200 micron; The thickness of described adhesive layer 4 is 10-200 micron.Be preferably: the thickness of described base membrane layer 1 is 150-250 micron; The thickness of described weathering layer 2 is 20-50 micron; The thickness in described reflector 3 is 20-100 micron; The thickness of described adhesive layer 4 is 20-50 micron.
In sum, the present invention adopts polypropylene alloy layer, replaces the PET polyester layer of traditional backboard, and its hydrolysis, ageing-resistant performance are more excellent; Adopt polyamide to replace the fluorine plastic film of traditional backboard, cost, can reduce environmental pollution simultaneously; In addition, adopt polymer multi-layer coextrusion process to substitute traditional backboard organic solvent glue and apply combination process, contribute to reduce backboard cost, increase production efficiency, avoid environmental pollution; Meanwhile, on backboard weathering layer, increase pattern structure, to increase its thermal radiation, make it have outstanding heat dispersion, can solve the problem that solar components heat radiation photovoltaic module transformation efficiency not enough and that cause declines, and the present invention does not need to increase preparation technology and cost.
Embodiment 1
As shown in Figure 1, a kind of solar energy backboard comprises compound successively weathering layer 2, adhesive layer 4, base membrane layer 1, adhesive layer 4, reflector 3.
Weathering layer 2 comprises polyamide (PA), stabilizer, antioxidant and inorganic material.The ethylene copolymer of adhesive layer 4 for containing epoxide group
pTW, for Dupont Chemical Group (China) Co., Ltd produces.Base membrane layer 1 is made up of modified polypropene.Modified polypropene is formed by HOPP (homopolymerization PP) and heat stabilizer blending and modifying.Reflector 3 is polyethylene alloy layers.Formed by polyethylene, uvioresistant stabilizer and inorganic Chinese white blending and modifying.More specifically, reflector 3 is mainly to be formed by low density polyethylene (LDPE) (LLDPE), ethylene propylene diene rubber (EPDM), uvioresistant stabilizer and titanium dioxide (TiO2) blending and modifying.
Tinuvin770 is two (2,2,6,6-tetramethyl-4-piperidyl) sebacates, and BASF joint-stock company produces.IrganoxB225 is the heat stabilizer that BASF joint-stock company produces.Comparative example 1 backboard is the FPE plate that Chinalco of Japanese Japan produces.
Embodiment 2
Each layer of structure be with embodiment 1, unique different be on weathering layer 2 impressions the length of side be that 20 microns, height of projection are that 20 microns, density are 5 × 10
5the Argyle of individual/square centimeter, to improve its heat dispersion.
Embodiment 3
Each layer of structure be with embodiment 1, unique different be on weathering layer 2 impressions the length of side be that 20 microns, height of projection are that 20 microns, density are 1 × 10
3the Argyle of individual/square centimeter, to improve its heat dispersion.
The power output of solar cell is obtained by the test of 3500SLP component tester, and the backboard temperature of solar cell has FLUKE572 infrared radiation thermometer to measure.
The present invention adopts polypropylene alloy layer, replaces the PET polyester layer of traditional backboard, and its hydrolysis, ageing-resistant performance are more excellent; Adopt polyamide to replace the fluorine plastic film of traditional backboard, cost, can reduce environmental pollution simultaneously; In addition, adopt polymer multi-layer coextrusion process to substitute traditional backboard organic solvent glue and apply combination process, contribute to reduce backboard cost, increase production efficiency, avoid environmental pollution; Meanwhile, on backboard weathering layer, increase pattern structure, to increase its thermal radiation, make it have outstanding heat dispersion, can solve the problem that solar components heat radiation photovoltaic module transformation efficiency not enough and that cause declines, and the present invention does not need to increase preparation technology and cost.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a solar energy backboard, it comprises base membrane layer, is positioned at weathering layer and the reflector of the relative both sides of described base membrane layer, described weathering layer and described reflector is cohered respectively to the two-layer adhesive layer on described base membrane layer, it is characterized in that: described base membrane layer is polypropylene alloy layer; Described weathering layer is polyamide material layer, and bulge-structure is contained on described weathering layer surface, to increase the thermal radiation of described solar energy backboard, makes described solar energy backboard have outstanding radiating and cooling performance; Described reflector is polyolefine material layer; Described adhesive layer is the alloy of the ethylene copolymer that contains epoxide group or itself and ethene copolymer.
2. solar energy backboard as claimed in claim 1, is characterized in that: described polyamide material layer comprises polyamide, stabilizer, antioxidant and inorganic material.
3. solar energy backboard as claimed in claim 2, is characterized in that: described polyamide is one or more the combination being selected from following component: polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 610, polyamide 612, polyamide 6 14, polyamide 6 13, polyamide 6 15, polyamide 6 16, polyamide 11, polyamide 12, polyamide 10, polyamide 912, polyamide 913, polyamide 914, polyamide 915, polyamide 6 16, polyamide 1010, polyamide 1012, polyamide 1013, polyamide 1014, polyamide 1210, polyamide 1212, polyamide 1213, polyamide 1214, poly terephthalic acid adipamide, poly terephthalic acid nonanedioyl amine, poly terephthalic acid decanediamide, poly terephthalic acid 12 diamides, adipic acid adipamide/terephthalic acid (TPA) adipamide copolyamide, terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, poly-adipic acid meta-xylene acid amides, terephthalic acid (TPA) adipamide/terephthalic acid (TPA) 2-methyl glutaryl amine, adipic acid adipamide/terephthalic acid (TPA) adipamide/M-phthalic acid adipamide copolyamide, polycaprolactam-terephthalic acid (TPA) adipamide.
4. solar energy backboard as claimed in claim 1, is characterized in that: described polypropylene alloy layer is the alloy of polypropylene or modified polypropene and engineering plastics; Described engineering plastics are polyamide or polyphenylene oxide; Described modified polypropene is formed by described polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, graft polypropylene and heat stabilizer blending and modifying, or is formed by described polypropylene, heat stabilizer and inorganic filler blending and modifying; Described inorganic filler is selected from the one in calcium carbonate, titanium dioxide, barium sulfate, mica, talcum, kaolin, glass microballoon and glass fibre.
5. solar energy backboard as claimed in claim 1, it is characterized in that: described polyolefine material layer is polyethylene alloy, described polyethylene comprises following composition: low density polyethylene, LLDPE LLDPE, medium density polyethylene MDPE, high density polyethylene, C2-C8 alkene grafted polyethylene or with the copolymer of ethene, maleic anhydride grafted polyethylene, silane grafted polyethylene.
6. solar energy backboard as claimed in claim 1, is characterized in that: described in contain epoxide group ethylene copolymer be the terpolymer of ethene, acrylate, glycidyl methacrylate.
7. solar energy backboard as claimed in claim 1, is characterized in that: described bulge-structure is decorative pattern, and described decorative pattern is rhombus or ellipse, and the length of side of described rhombus or the mean value of the described oval-shaped line of apsides is 5-100 micron, and distribution density is 1 × 10
2～4 × 10
6individual/square centimeter, height of projection is 5-100 micron.
8. solar energy backboard as claimed in claim 1, is characterized in that: the thickness of described base membrane layer is 50-500 micron; The thickness of described weathering layer is 10-100 micron; The thickness in described reflector is 10-200 micron; The thickness of described adhesive layer is 10-200 micron.
9. a preparation method for solar energy backboard as claimed in any of claims 1 to 8 in one of claims, is characterized in that: described solar energy backboard adopts multiple layer polymer co-extrusion mode one-step shaping.
10. the preparation method of solar energy backboard as claimed in claim 9, is characterized in that: in the time of moulding, impress projection structure with the surperficial chill roll with sunk structure on the weathering layer of solar energy backboard.
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| CN110299425A (en) * | 2019-06-26 | 2019-10-01 | 江苏康博光伏电力科技有限公司 | A kind of photovoltaic back of rapid cooling |
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| CN110993714A (en) * | 2019-12-07 | 2020-04-10 | 安徽亚科新能源科技有限公司 | Functional solar backboard and preparation method thereof |
| CN113471318A (en) * | 2021-07-01 | 2021-10-01 | 浙江中聚材料有限公司 | Solar backboard with high barrier property |
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Application publication date: 20141112 |