CN104070715A - Graphene heat conduction and soaking film - Google Patents
Graphene heat conduction and soaking film Download PDFInfo
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- CN104070715A CN104070715A CN201410254450.3A CN201410254450A CN104070715A CN 104070715 A CN104070715 A CN 104070715A CN 201410254450 A CN201410254450 A CN 201410254450A CN 104070715 A CN104070715 A CN 104070715A
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Abstract
The invention discloses a graphene heat conduction and soaking film which is formed by compounding a graphene film and a conventional heat conduction and soaking film. Graphene is combined with common heat conduction materials, so that the heat conduction and soaking effect of the composite film is intensified to form the heat conduction and soaking effect for at least twice. The soaking effect of the film provided by the invention is far greater than that of an existing general heat conduction film made of common heat conduction materials.
Description
Technical field
The present invention relates to the equal hotting mask of a kind of Graphene heat conduction.
Background technology
Electronic device all can produce certain heat when work, and the temperature of device work is raise, and forms hot localised points, has a strong impact on service efficiency and the life-span of device.At present, Heat Conduction Material is all widely used in various industrial circles, but due to the restriction of thermal conductivity, the equal thermal effect of heat conduction is unsatisfactory, has limited the design of device or system.Especially in microelectronic industry, design of electronic circuits integrated, trend toward miniaturization is more and more obvious, the requirement of the equal hot material of high-performance heat conduction is also more and more higher, demand is also increasing.But mostly the equal hot material of traditional heat conduction is take metal or graphite, as basic material, manufacture, can not meet electronic industry for the demand of heat conduction soaking at present.
Graphene thermal conductivity factor is up to 5300 W/m*K, higher than CNT and diamond (Nature Materials 10,569 – 581 (2011) doi:10.1038/nmat3064), far above conventional Heat Conduction Material (copper, aluminium, silver etc.), under normal temperature, its electron mobility surpasses 15000 cm2/Vs, and resistivity about 10-6 Ω cm is only lower than copper or silver, it is the material of resistivity minimum in the world at present.
Summary of the invention
The object of the present invention is to provide the equal hotting mask of a kind of Graphene heat conduction.
The technical solution used in the present invention is:
The equal hotting mask of Graphene heat conduction, the equal hotting mask of this heat conduction is by the formation that is combined with each other of graphene film and the equal hotting mask of conventional heat conduction.
In the equal hotting mask of described heat conduction, the thickness of graphene film is the Graphene of 1-10 layer atomic thickness.
In the equal hotting mask of described heat conduction, if total number of plies of film is greater than 2 layers, the equal hotting mask alternative arrangement of graphene film and conventional heat conduction arranges.
Described complex method is: adjacent two layers film is directly attached to together; Or adjacent two layers film is bonded together by glue-line.
Described graphene film is the graphene film that thickness is less than 10 atomic layers.
Described graphene film is what by chemical vapour deposition technique, prepare.
The described equal hotting mask of conventional heat conduction is that thickness is less than that nickel foil, thickness that silver foil, thickness that aluminium foil, thickness that Copper Foil, thickness that natural stone ink film, thickness that artificial stone ink film, the thickness of 100 microns is less than 100 microns is less than 60 microns is less than 100 microns is less than 100 microns is less than 100 microns are less than the Graphene of 10 atomic layers, the alloy film of at least two kinds of formation in above material, be coated with a kind of in the film of above material.
Described glue-line is the glue-line of at least one formation in heat-sensitive glue, light-sensitive emulsion, pressure sensitive adhesive, double faced adhesive tape.
The invention has the beneficial effects as follows: Graphene and conventional Heat Conduction Material are combined, strengthen the equal thermal effect of heat conduction of laminated film, form at least twice equal thermal effect (the compound product of the conventional heat conducting film of one deck graphene film and one deck), the equal thermal effect of product of the present invention is far above the heat conducting film of existing general Heat Conduction Material.
The specific embodiment
The equal hotting mask of Graphene heat conduction, the equal hotting mask of this heat conduction is by the formation that is combined with each other of graphene film and the equal hotting mask of conventional heat conduction.
In the equal hotting mask of described heat conduction, graphene film thickness is not more than 10 atomic layer level thickness; Preferably, the thickness of graphene film is 3 ~ 10 layers of carbon atom thickness.
In the equal hotting mask of described heat conduction, if total number of plies of film is greater than 2 layers, the equal hotting mask alternative arrangement of graphene film and conventional heat conduction arranges.
Described complex method is: adjacent two layers film is directly attached to together; Or adjacent two layers film is bonded together by glue-line.
Described graphene film is the graphene film that thickness is less than 10 atomic layers.
Described graphene film is what by chemical vapour deposition technique, prepare.
The described equal hotting mask of conventional heat conduction is that thickness is less than that nickel foil, thickness that silver foil, thickness that aluminium foil, thickness that Copper Foil, thickness that natural stone ink film, thickness that artificial stone ink film, the thickness of 100 microns is less than 100 microns is less than 60 microns is less than 100 microns is less than 100 microns is less than 100 microns are less than the Graphene of 10 atomic layers, the alloy film of at least two kinds of formation in above material, be coated with a kind of in the film of above material; Preferably, for thickness is less than at least one in the nickel foil that silver foil, thickness that aluminium foil, thickness that Copper Foil, thickness that natural stone ink film, thickness that artificial stone ink film, the thickness of 100 microns is less than 100 microns is less than 60 microns is less than 100 microns is less than 100 microns is less than 100 microns.
Described glue-line is the glue-line of at least one formation in heat-sensitive glue, light-sensitive emulsion, pressure sensitive adhesive, double faced adhesive tape.
Below in conjunction with specific embodiment, the present invention is described further:
embodiment 1:
Thickness is less than graphene film that the artificial stone ink film of 100 microns and thickness is less than 10 atomic layers by the mode directly attaching, and is about to graphene film and is directly attached on artificial stone ink film, forms the equal hotting mask of Graphene heat conduction of the present invention.
If during the artificial stone ink film direct contact heat source in the equal hotting mask of this heat conduction, the heat that thermal source distributes is by plane aspect (the being defined as XY in-plane) transmission of artificial stone ink film, form equal thermal effect for the first time, then by Z direction (perpendicular to the direction of XY plane), be transferred to graphene film, on graphene film in-plane, form soaking for the second time, finally reach and strengthen soaking heat-conducting effect.
If during the graphene film direct contact heat source in the equal hotting mask of this heat conduction, the heat that thermal source distributes is by plane aspect (the being defined as XY in-plane) transmission of graphene film, form equal thermal effect for the first time, then by Z direction (perpendicular to the direction of XY plane), be transferred to artificial stone ink film, in Delanium membrane plane direction, form soaking for the second time, finally reach and strengthen soaking heat-conducting effect.
embodiment 2:
Artificial stone ink film is replaced with to the natural stone ink film that thickness is less than 100 microns, and remainder is identical with embodiment 1.
embodiment 3:
Artificial stone ink film is replaced with to the Copper Foil that thickness is less than 60 microns, and remainder is identical with embodiment 1.
embodiment 4:
Artificial stone ink film is replaced with to the aluminium foil that thickness is less than 100 microns, and remainder is identical with embodiment 1.
embodiment 5:
By double faced adhesive tape, thickness is less than to the graphene film that the artificial stone ink film of 100 microns and thickness is less than 10 atomic layers and is bonded together, form the equal hotting mask of Graphene heat conduction of the present invention.
If during the artificial stone ink film direct contact heat source in the equal hotting mask of this heat conduction, the heat that thermal source distributes is by plane aspect (the being defined as XY in-plane) transmission of artificial stone ink film, form equal thermal effect for the first time, then along Z direction (perpendicular to the direction of XY plane), transmit, through layers of two-sided, heat forms soaking for the second time in graphene film plane, finally reaches and strengthens soaking heat-conducting effect.
If during the graphene film direct contact heat source in the equal hotting mask of this heat conduction, the heat that thermal source distributes is by plane aspect (the being defined as XY in-plane) transmission of graphene film, form equal thermal effect for the first time, then by Z direction (perpendicular to the direction of XY plane) transmission, through layers of two-sided, heat forms soaking for the second time on Delanium membrane plane, finally reaches and strengthens soaking heat-conducting effect.
embodiment 6:
Artificial stone ink film is replaced with to the natural stone ink film that thickness is less than 100 microns, and remainder is identical with embodiment 5.
embodiment 7:
Artificial stone ink film is replaced with to the Copper Foil that thickness is less than 60 microns, and remainder is identical with embodiment 5.
embodiment 8:
Artificial stone ink film is replaced with to the aluminium foil that thickness is less than 100 microns, and remainder is identical with embodiment 5.
embodiment 9:
The Graphene that Copper Foil (thickness is less than 100 microns) tow sides are all grown and had the number of plies to be less than 10 layers by chemical gas-phase method, then together with the graphene film (thickness is less than 100 microns) that this Copper Foil and thickness are less than 10 atomic layer level thickness is glued to by double faced adhesive tape.
embodiment 10:
The graphene film that two layers of thickness is less than to 10 atomic layers is glued to together by double faced adhesive tape.
embodiment 11:
Thickness is less than to the graphene film that the natural stone ink film of 100 microns and thickness is less than 10 atomic layers to be bonded together by pressure sensitive adhesive.
Claims (8)
1. the equal hotting mask of Graphene heat conduction, is characterized in that: the equal hotting mask of this heat conduction is by the formation that is combined with each other of graphene film and the equal hotting mask of conventional heat conduction.
2. the equal hotting mask of a kind of Graphene heat conduction according to claim 1, is characterized in that: in the equal hotting mask of described heat conduction, the thickness of graphene film is the Graphene of 1-10 layer atomic thickness.
3. the equal hotting mask of a kind of Graphene heat conduction according to claim 2, is characterized in that: in the equal hotting mask of described heat conduction, if total number of plies of film is greater than 2 layers, the equal hotting mask alternative arrangement of graphene film and conventional heat conduction arranges.
4. the equal hotting mask of a kind of Graphene heat conduction according to claim 3, is characterized in that: described complex method is: adjacent two layers film is directly attached to together; Or adjacent two layers film is bonded together by glue-line.
5. the equal hotting mask of a kind of Graphene heat conduction according to claim 4, is characterized in that: described graphene film is the graphene film that thickness is less than 10 atomic layers.
6. the equal hotting mask of a kind of Graphene heat conduction according to claim 4, is characterized in that: described graphene film is what by chemical vapour deposition technique, prepare.
7. the equal hotting mask of a kind of Graphene heat conduction according to claim 1, is characterized in that: the described equal hotting mask of conventional heat conduction is that thickness is less than that nickel foil, thickness that silver foil, thickness that aluminium foil, thickness that Copper Foil, thickness that natural stone ink film, thickness that artificial stone ink film, the thickness of 100 microns is less than 100 microns is less than 60 microns is less than 100 microns is less than 100 microns is less than 100 microns are less than the Graphene of 10 atomic layers, the alloy film of at least two kinds of formation in above material, be coated with a kind of in the film of above material.
8. the equal hotting mask of a kind of Graphene heat conduction according to claim 4, is characterized in that: described glue-line is the glue-line of at least one formation in heat-sensitive glue, light-sensitive emulsion, pressure sensitive adhesive, double faced adhesive tape.
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| CN201410254450.3A CN104070715A (en) | 2014-06-10 | 2014-06-10 | Graphene heat conduction and soaking film |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011756A (en) * | 2016-05-17 | 2016-10-12 | 青岛昊天川崎碳材料技术有限公司 | Metal olefinic carbon heat conduction film and preparation method thereof |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
| CN109575885A (en) * | 2018-11-28 | 2019-04-05 | 宁波墨西新材料有限公司 | Graphene heat conducting film and preparation method thereof |
| CN111674115A (en) * | 2020-07-09 | 2020-09-18 | 苏州鸿凌达电子科技有限公司 | Artificial graphite flake high-orientation arranged heat conducting sheet and preparation method thereof |
| CN113307658A (en) * | 2021-06-16 | 2021-08-27 | 安徽科昂纳米科技有限公司 | Preparation method of graphite-aerogel double-layer heat-equalizing film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548353A (en) * | 2010-12-31 | 2012-07-04 | 上海杰远环保科技有限公司 | Stack-up type membrane heat dissipation structure and realization method thereof |
| CN102867793A (en) * | 2012-08-14 | 2013-01-09 | 日月光半导体制造股份有限公司 | Thermal interface material and semiconductor packaging structure |
| CN202727433U (en) * | 2011-11-16 | 2013-02-13 | 常州碳元科技发展有限公司 | Radiation material with graphite film and graphene composition structure |
| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
| CN103625029A (en) * | 2013-11-25 | 2014-03-12 | 许子寒 | Graphene heat-conducting device |
-
2014
- 2014-06-10 CN CN201410254450.3A patent/CN104070715A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548353A (en) * | 2010-12-31 | 2012-07-04 | 上海杰远环保科技有限公司 | Stack-up type membrane heat dissipation structure and realization method thereof |
| CN202727433U (en) * | 2011-11-16 | 2013-02-13 | 常州碳元科技发展有限公司 | Radiation material with graphite film and graphene composition structure |
| CN102867793A (en) * | 2012-08-14 | 2013-01-09 | 日月光半导体制造股份有限公司 | Thermal interface material and semiconductor packaging structure |
| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
| CN103625029A (en) * | 2013-11-25 | 2014-03-12 | 许子寒 | Graphene heat-conducting device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011756A (en) * | 2016-05-17 | 2016-10-12 | 青岛昊天川崎碳材料技术有限公司 | Metal olefinic carbon heat conduction film and preparation method thereof |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
| CN106113731B (en) * | 2016-06-23 | 2019-03-01 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
| CN109575885A (en) * | 2018-11-28 | 2019-04-05 | 宁波墨西新材料有限公司 | Graphene heat conducting film and preparation method thereof |
| CN111674115A (en) * | 2020-07-09 | 2020-09-18 | 苏州鸿凌达电子科技有限公司 | Artificial graphite flake high-orientation arranged heat conducting sheet and preparation method thereof |
| CN113307658A (en) * | 2021-06-16 | 2021-08-27 | 安徽科昂纳米科技有限公司 | Preparation method of graphite-aerogel double-layer heat-equalizing film |
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