CN104049321B - Optical communication device and its manufacture method - Google Patents
Optical communication device and its manufacture method Download PDFInfo
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- CN104049321B CN104049321B CN201310083163.6A CN201310083163A CN104049321B CN 104049321 B CN104049321 B CN 104049321B CN 201310083163 A CN201310083163 A CN 201310083163A CN 104049321 B CN104049321 B CN 104049321B
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- light
- packing element
- communication device
- optical
- controller
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- Optical Couplings Of Light Guides (AREA)
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Abstract
A kind of optical communication device, it includes a light-emitting component, one first controller, a processor, a receipts optical element, a second controller, a memory body, a planar optical waveguide.Optical communication device further comprises two reflecting elements, one first packing element, a light transmissive material, one second packing element.First packing element coats the light-emitting component, the first controller, processor, receipts optical element, second controller and the memory body.Planar optical waveguide is arranged at first packing element.The first packing element correspondence light-emitting component and the receipts optical element offer two light holes respectively.Planar optical waveguide corresponds to two light holes and offers two through holes respectively.Two reflecting elements correspond to be housed in pass through aperture respectively.Light transmissive material is filled in light hole and the through hole.Second packing element cladding planar optical waveguide, two reflecting elements and light transmissive material.The optical communication device volume is small.
Description
Technical field
The present invention relates to optical communication field, in particular it relates to a kind of optical communication device.
Background technology
Existing optical communication device generally comprises a circuit board, light-emitting component, receipts optical element, a plane light wave
Lead (planar light wave circuit, PLC) and two optical coupled shells.Light-emitting component and receive optical element interval
It is arranged on circuit board.Planar optical waveguide be formed on circuit board and be arranged at light-emitting component and receive optical element between.Two light
Learn coupling shell to be covered each by light-emitting component and receive on optical element, one of them optical coupled shell and light-emitting component and plane
Optical waveguide coupled one end coupling, another optical coupled shell is with receiving the other end coupling that optical element and planar optical waveguide are coupled
Close.However, due to two optical coupled shells be covered in light-emitting component and receive optical element on, planar optical waveguide usually require compared with
Thickness sets a bed course between planar optical waveguide and circuit board, and such as planar optical waveguide could be entered with two optical coupled shells
Row is optical coupled, so the volume of increase optical communication device.The volume of other optical coupled shell is also generally larger, same increase
The volume of optical communication device, is unfavorable for miniaturization.
The content of the invention
In view of this, it is necessary to which a kind of optical communication device for reducing volume is provided.
A kind of optical communication device, it includes a light-emitting component, one first controller, a processor, one receives optical element, one the
Two controllers, a memory body, a planar optical waveguide.First controller is electrically connected to the light-emitting component and the processing
Device.The second controller is electrically connected to the receipts optical element and the memory body.The light-emitting component includes a light-emitting area,
The receipts optical element includes one and receives smooth surface.The optical communication device further comprise two reflecting elements, one first packing element,
One light transmissive material, one second packing element.First packing element coat the light-emitting component, the first controller, processor,
Receive optical element, second controller and the memory body.The planar optical waveguide is arranged at first packing element.Described first
The packing element correspondence light-emitting area and the receipts smooth surface offer two light holes respectively.The planar optical waveguide is corresponded to respectively
Described two light holes offer two through holes.Described two reflecting elements correspond to be housed in described in one in through hole respectively.
The light transmissive material is filled in the light hole and the through hole.Second packing element coats the plane light wave
Lead, described two reflecting elements and the light transmissive material.
A kind of manufacture method of optical communication device described above, it comprises the following steps：
First controller is electrically connected to the light-emitting component and the processor, by second controller electricity
Property be connected to receipts optical element and the memory body, first packing element coats the hair by way of ejection formation
Optical element, the first controller, processor, receipts optical element, second controller and the memory body；
The planar optical waveguide is arranged at first packing element, in the planar light by way of laser lift-off
Waveguide opens up two through holes, is held while the mode of laser lift-off opens up two respectively in first packing element through described
The light hole of section, two light holes correspond respectively to light-emitting area and receive smooth surface；
First reflecting element and the second reflecting element are housed in the through hole；
Toward filling light transmissive material in two light holes and two through holes by way of ejection formation；
Second packing element coats the planar optical waveguide, first reflector by way of ejection formation
Part, second reflecting element and the light transmissive material, second packing element and the first packing element Joint.
Relative to prior art, because first packing element coats the light-emitting component, the first controller, processing
Device, receipts optical element, second controller and the memory body.Second packing element coats the planar optical waveguide, described two
Individual reflecting element and the light transmissive material, rather than set and be covered each by the optical coupled of the light-emitting component and the receipts optical element
Shell, therefore, optical communication device of the invention can greatly reduce volume, be conducive to miniaturization.
Brief description of the drawings
Fig. 1 is the schematic diagram for the optical communication device that embodiment of the present invention is provided.
Fig. 2 is the flow chart for the optical communication device producing method that embodiment of the present invention is provided.
Fig. 3-6 is the procedure chart of the optical communication device producing method in Fig. 2.
Main element symbol description
| Optical communication device | 100 |
| Light-emitting component | 10 |
| First controller | 20 |
| Processor | 30 |
| Receive optical element | 40 |
| Second controller | 50 |
| Memory body | 60 |
| First packing element | 70 |
| Planar optical waveguide | 80 |
| Second packing element | 90 |
| Light-emitting area | 101 |
| First light collecting part | 102 |
| Receive smooth surface | 401 |
| Second light collecting part | 402 |
| Loading end | 71 |
| Light hole | 710 |
| Through hole | 81 |
| First reflecting element | 85 |
| Second reflecting element | 86 |
| Colloid | 810 |
| First inclined-plane | 851 |
| Second inclined-plane | 861 |
| Light transmissive material | 87 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
As shown in figure 1, the optical communication device 100 provided for embodiment of the present invention, it includes a light-emitting component 10, one
First controller 20, a processor 30, one receive optical element 40, a second controller 50, a memory body 60, one first packing element
70th, a planar optical waveguide 80, two reflecting elements and one second packing elements 90.
The light-emitting component 10 includes forming hemispheric first light collecting part in a light-emitting area 101, the light-emitting area 101
102.First light collecting part 102 is formed in the light-emitting area 101 by dripping colloid.In other embodiments, it is described
First light collecting part 102 can also be obtained by being molded manufacture, then be bonded to the light-emitting area 101.The light-emitting component 10
For a laser diode (laser diode, LD).
First controller 20 is arranged between the light-emitting component 10 and the processor 30, and is electrically connected to institute
State light-emitting component 10 and the processor 30.
The receipts optical element 40 includes one and receives one hemispheric second light collecting part of formation in smooth surface 401, the receipts smooth surface 401
402.Second light collecting part 402 is formed in the receipts smooth surface 401 by dripping colloid.In other embodiments, it is described
Second light collecting part 402 can also be obtained by being molded manufacture, then be bonded to the receipts smooth surface 401.The receipts optical element 40
For a photodiode (photo diode, PD).
The second controller 50 is arranged between the receipts optical element 40 and the memory body 60, and is electrically connected to institute
State receipts optical element 40 and the memory body 60.
First packing element 70 coats the light-emitting component 10, the first controller 20, processor 30, receipts optical element
40th, second controller 50 and the memory body 60.In present embodiment, first packing element 70 is made of silicon materials.
First packing element 70 includes a loading end 71.The correspondence of first packing element 70 first light collecting part 102 and institute
State the second light collecting part 402 and offer two light holes 710 for running through the loading end 71 respectively.
The planar optical waveguide 80 is arranged at the loading end 71 of first packing element 70.The planar optical waveguide 80 is opened
Provided with two through holes 81.Two through holes 81 correspond to be connected with a light hole 710 respectively.
Described two reflecting elements are respectively one first reflecting element 85 and one second reflecting element 86.First reflection
The reflecting element 86 of element 85 and second is housed in the through hole 81, and is fixed on first cladding by colloid 810
The loading end 71 of element 70.First reflecting element 85 includes relatively described inclined first inclined-plane 851 of loading end 71.Institute
Stating the second reflecting element 86 includes relatively described inclined second inclined-plane 861 of loading end 71.The light-emitting component 10 it is luminous
Face 101 is faced towards first inclined-plane 851, first light collecting part 102 with first inclined-plane 851.Described first gathers
The central shaft in light portion 102 and first inclined-plane 851 are into 45 degree of angles.The receipts smooth surface 401 for receiving optical element 40 is towards described the
Two inclined-planes 861, second light collecting part 402 is faced with second inclined-plane 861.The central shaft of second light collecting part 402
With second inclined-plane 861 into 45 degree of angles.
The optical communication device 100 still further comprises a light transmissive material 87.The light transmissive material 87 is filled in two institutes
State in light hole 710 and two through holes 81.In present embodiment, the light transmissive material 87 is optical fiber covering material.
Second packing element 90 coats the planar optical waveguide 80, the second reflection described in first reflecting element 85
Element 86 and the light transmissive material 87.Second packing element 90 is mutually glued with first packing element 70.This embodiment party
In formula, second packing element 90 is also made of silicon materials.
In use, the processor 30 sends an excitation signal to the first controller 20, first controller 20 is received
A corresponding drive signal is produced after excitation signal and controls the light-emitting component 10 to send light from the light-emitting area 101.It is described
The light that light-emitting component 10 is sent is oblique by described in the directive of light transmissive material 87 first after being converged through first light collecting part 102
Face 851, subsequently into the planar optical waveguide 80, by the planar optical waveguide 80 spread out of after thrown by the light transmissive material 87
It is incident upon second inclined-plane 861, then second light collecting part 402 is reflexed to by second inclined-plane 861, finally by described the
Optical signal is transformed into electric signal and is sent to institute by the two light collecting parts 402 convergence projection receipts smooth surface 401, the receipts optical element 40
State second controller 50 and carry out such as enhanced processing, the memory body 60 stores the telecommunications after the second controller 50 is handled
Number.
In other embodiments, the first light collecting part 102 and the second light collecting part 402 can be also not provided with.
Referring to Fig. 2, being the flow chart of the manufacture method of optical communication device 100, it comprises the following steps：
Referring to Fig. 3, S101：First controller 20 is first arranged on the light-emitting component 10 and the processor 30
Between, and the light-emitting component 10 and the processor 30 are electrically connected to, the second controller 50 is arranged on the receipts light
Between element 40 and the memory body 60, and it is electrically connected to the receipts optical element 40 and the memory body 60, first bag
Cover element 70 and the light-emitting component 10, the first controller 20, processor 30, receipts optical element are coated by way of ejection formation
40th, second controller 50 and the memory body 60；
Referring to Fig. 4, S102：The planar optical waveguide 80 is arranged to the loading end 71 of first packing element 70,
Two through holes 81 are offered in the planar optical waveguide 80 by way of laser lift-off, while the mode of laser lift-off is in institute
State the first packing element 70 and offer two light holes 710 for running through the loading end 71, two 710 points of light holes respectively
Dui Yingyu not light-emitting area 101 and receipts smooth surface 401；
It please read Fig. 5, S103：The reflecting element 86 of first reflecting element 85 and second is housed in the through hole 81
It is interior, and it is fixed on by colloid 810 loading end 71 of first packing element 70；
It please read Fig. 6, S104：Toward two light holes 710 and two through holes 81 by way of ejection formation
Interior filling light transmissive material 87；
S105：Second packing element 90 coats the planar optical waveguide 80, described by way of ejection formation
Second reflecting element 86 and the light transmissive material 87 described in one reflecting element 85, second packing element 90 and the described first bag
The loading end 71 for covering element 70 is mutually glued.
Relative to prior art, because first packing element coats the light-emitting component, the first controller, processing
Device, receipts optical element, second controller and the memory body.Second packing element coats the planar optical waveguide, described two
Individual reflecting element and the light transmissive material, rather than set and be covered each by the optical coupled of the light-emitting component and the receipts optical element
Shell, therefore, optical communication device of the invention can greatly reduce volume, be conducive to miniaturization.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (10)
1. a kind of optical communication device, it includes a light-emitting component, one first controller, a processor, a receipts optical element, one second
Controller, a memory body, a planar optical waveguide, first controller are electrically connected to the light-emitting component and the processing
Device, the second controller is electrically connected to the receipts optical element and the memory body, and the light-emitting component includes a light-emitting area,
The receipts optical element includes one and receives smooth surface, it is characterised in that：The optical communication device further comprises two reflecting elements, one
One packing element, a light transmissive material, one second packing element, first packing element coat the light-emitting component, the first control
Device processed, processor, receipts optical element, second controller and the memory body, first packing element includes a loading end, described
Planar optical waveguide is arranged at the loading end of first packing element, the first packing element correspondence light-emitting area and
The receipts smooth surface offers two light holes respectively, and the planar optical waveguide corresponds to described two light holes and offers two respectively
Through hole, described two reflecting elements correspond to be housed in described in one in through hole respectively, and the light transmissive material is filled in described logical
In unthreaded hole and the through hole, second packing element coats the planar optical waveguide, described two reflecting elements and described
Light transmissive material.
2. optical communication device as claimed in claim 1, it is characterised in that：First packing element, which includes a loading end, to be used for
Second packing element is carried, the loading end is mutually glued with second packing element, described two reflecting element difference
For one first reflecting element and one second reflecting element, first reflecting element and the second reflecting element are housed in described pass through
In perforation, and it is fixed on by colloid the loading end of first packing element.
3. optical communication device as claimed in claim 2, it is characterised in that：One hemispheric first is formed in the light-emitting area to gather
Hemispheric second light collecting part is formed in light portion, the receipts smooth surface, first reflecting element includes a relatively described carrying
Inclined first inclined-plane in face, second reflecting element includes relatively described inclined second inclined-plane of loading end, described luminous
The light-emitting area of element is faced towards first inclined-plane, first light collecting part with first inclined-plane, the receipts optical element
Receipts smooth surface towards second inclined-plane, second light collecting part is faced with second inclined-plane.
4. optical communication device as claimed in claim 3, it is characterised in that：The central shaft of first light collecting part and described first
Inclined-plane is into 45 degree of angles, and the central shaft of second light collecting part and second inclined-plane are into 45 degree of angles.
5. optical communication device as claimed in claim 1, it is characterised in that：The light transmissive material is optical fiber covering material.
6. optical communication device as claimed in claim 1, it is characterised in that：The light-emitting component is a laser diode, described
Receipts optical element is a photodiode.
7. optical communication device as claimed in claim 1, it is characterised in that：First and second packing element uses silicon materials
It is made.
8. a kind of manufacture method of optical communication device as described in claim any one of 1-7, it comprises the following steps：
First controller is electrically connected to the light-emitting component and the processor, the second controller is electrically connected
The receipts optical element and the memory body are connected to, first packing element coats the luminous member by way of ejection formation
Part, the first controller, processor, receipts optical element, second controller and the memory body；
The planar optical waveguide is arranged to the loading end of first packing element, in institute by way of laser lift-off
State planar optical waveguide and open up two through holes, passed through while the mode of laser lift-off opens up two respectively in first packing element
The light hole of the loading end is worn, two light holes correspond respectively to light-emitting area and receive smooth surface；
First reflecting element and the second reflecting element are housed in the through hole；
Toward filling light transmissive material in two light holes and two through holes by way of ejection formation；
Second packing element coats the planar optical waveguide, first reflecting element, institute by way of ejection formation
State the second reflecting element and the light transmissive material, second packing element and the first packing element Joint.
9. the manufacture method of optical communication device as claimed in claim 8, it is characterised in that：First reflecting element and second
Reflecting element is fixed on the loading end of first packing element by colloid.
10. the manufacture method of optical communication device as claimed in claim 8, it is characterised in that：Second packing element and institute
State the first packing element Joint by way of glued.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310083163.6A CN104049321B (en) | 2013-03-15 | 2013-03-15 | Optical communication device and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310083163.6A CN104049321B (en) | 2013-03-15 | 2013-03-15 | Optical communication device and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104049321A CN104049321A (en) | 2014-09-17 |
| CN104049321B true CN104049321B (en) | 2017-09-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310083163.6A Expired - Fee Related CN104049321B (en) | 2013-03-15 | 2013-03-15 | Optical communication device and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104049321B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656401A (en) * | 2002-05-28 | 2005-08-17 | 松下电工株式会社 | Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
| CN101266325A (en) * | 2007-03-15 | 2008-09-17 | 日立电线株式会社 | Optical system connection structure, optical component, and optical communication module |
| CN102023347A (en) * | 2009-09-11 | 2011-04-20 | 株式会社藤仓 | Optical path change member and holding member body |
| JP5758657B2 (en) * | 2011-03-16 | 2015-08-05 | 株式会社エンプラス | Lens array and optical module having the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI497142B (en) * | 2011-01-26 | 2015-08-21 | Hon Hai Prec Ind Co Ltd | Optical fiber connector |
-
2013
- 2013-03-15 CN CN201310083163.6A patent/CN104049321B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656401A (en) * | 2002-05-28 | 2005-08-17 | 松下电工株式会社 | Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
| CN101266325A (en) * | 2007-03-15 | 2008-09-17 | 日立电线株式会社 | Optical system connection structure, optical component, and optical communication module |
| CN102023347A (en) * | 2009-09-11 | 2011-04-20 | 株式会社藤仓 | Optical path change member and holding member body |
| JP5758657B2 (en) * | 2011-03-16 | 2015-08-05 | 株式会社エンプラス | Lens array and optical module having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104049321A (en) | 2014-09-17 |
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Effective date of registration: 20170517 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
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Granted publication date: 20170915 Termination date: 20180315 |