CA2216759A1 - Optoelectronic component - Google Patents
Optoelectronic component Download PDFInfo
- Publication number
- CA2216759A1 CA2216759A1 CA002216759A CA2216759A CA2216759A1 CA 2216759 A1 CA2216759 A1 CA 2216759A1 CA 002216759 A CA002216759 A CA 002216759A CA 2216759 A CA2216759 A CA 2216759A CA 2216759 A1 CA2216759 A1 CA 2216759A1
- Authority
- CA
- Canada
- Prior art keywords
- optoelectronic component
- optical
- component
- socket
- optoelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
An optoelectronic module is proposed which can be coupled both optically and electrically in a simple manner. It consists of an SMD package for the electrical connection and a socket mating with an MT
plug for the optical connection. The SMD package is adapted to the MT plug. It contains a socket which contains the optical/electrical interface and which is positively fixed in the package.
plug for the optical connection. The SMD package is adapted to the MT plug. It contains a socket which contains the optical/electrical interface and which is positively fixed in the package.
Description
CA 022167~9 1997-10-16 Optoelectronic Component This invention relates to an optoelectronic component having at least one electrical connection and at least one optical connection.
Such components are increasingly needed in large numbers in optical communications systems.
Accordingly, the technical problem to be solved by the invention is to design such an optoelectronic component in such a way that it can be manu~actured and assembled e~ficiently and at low cost.
According to the invention, this technical problem is solved by forming the at least one electrical connection by means o~ external contacts on an SMD
package and the at least one optical connection by means o~ a socket which is compatible with an MT plug.
Such an optoelectronic component can be manu~actured at low cost and is easy to assemble.
Advantageous details of the invention are recited in claims 2 to 9.
The invention will be now explained in more detail with re~erence to the accompanying drawings, in which:
Fig. 1 shows a top view o~ an embodiment o~ the optoelectronic component according to the invention;
CA 022167~9 1997-10-16 Fig. 2 shows a longitudinal section of the component o~ Fig. 1;
Fig. 3 shows details of the component in a perspective view;
Fig. 4 shows a longitudinal section of the socket; and Fig. 5 shows a top view of the socket.
In the embodiment shown in Fig. 1, the optoelectronic component is assumed to include an optoelectronic interface, i.e., the component can be coupled to an optical fiber whose optical signals are converted in the component to electric signals.
As can be seen in Fig. 1, the component has a housing 1 which is provided with external contacts 2. The housing shown is implemented in SMD technology, i.e., it can be placed on a plane printed-circuit board and the external contacts 2 can be soldered to conductive tracks on the printed-circuit board. Connected to the ends (not shown in Fig. 1) of the external contacts 2 which project into the housing 1 is a printed-circuit board 3 which contains an electronic circuit 4 (Fig.
Such components are increasingly needed in large numbers in optical communications systems.
Accordingly, the technical problem to be solved by the invention is to design such an optoelectronic component in such a way that it can be manu~actured and assembled e~ficiently and at low cost.
According to the invention, this technical problem is solved by forming the at least one electrical connection by means o~ external contacts on an SMD
package and the at least one optical connection by means o~ a socket which is compatible with an MT plug.
Such an optoelectronic component can be manu~actured at low cost and is easy to assemble.
Advantageous details of the invention are recited in claims 2 to 9.
The invention will be now explained in more detail with re~erence to the accompanying drawings, in which:
Fig. 1 shows a top view o~ an embodiment o~ the optoelectronic component according to the invention;
CA 022167~9 1997-10-16 Fig. 2 shows a longitudinal section of the component o~ Fig. 1;
Fig. 3 shows details of the component in a perspective view;
Fig. 4 shows a longitudinal section of the socket; and Fig. 5 shows a top view of the socket.
In the embodiment shown in Fig. 1, the optoelectronic component is assumed to include an optoelectronic interface, i.e., the component can be coupled to an optical fiber whose optical signals are converted in the component to electric signals.
As can be seen in Fig. 1, the component has a housing 1 which is provided with external contacts 2. The housing shown is implemented in SMD technology, i.e., it can be placed on a plane printed-circuit board and the external contacts 2 can be soldered to conductive tracks on the printed-circuit board. Connected to the ends (not shown in Fig. 1) of the external contacts 2 which project into the housing 1 is a printed-circuit board 3 which contains an electronic circuit 4 (Fig.
2) necessary for the operation of the optical component.
Part of the inner ends of the external contacts 2 may also be connected to a thermally highly conductive plate or the like and serve to transfer the heat away from a device disposed above the plate.
CA 022167~9 1997-10-16 . ~
Fixed in the housing 1 is a socket 5 which contains the end portion of an optical fiber 6. The socket 5 is the mate of an MT plug. MT plugs are known. They are offered, for example, by EUROPTICS Ltd., Whiston, Merseyside L35 IRZ, England. MT plugs are designed to couple at least one optical fiber to another device which also contains an optical fiber. To this end, the optical fiber is fixed in a bore of the MT plug in such a way that its end is flush with the external surface of the MT plug. For precise alignment of the MT plug, the latter has two guide pins at the external surface at which the optical fiber ends.
The optical fiber 6 terminates at an optical component 7, e.g., a laser diode, in which the optical signal transmitted by the optical fiber is converted to an electric signal.
In Fig. 2, parts identical to parts shown in Fig. 1 are designated by like reference numerals. It can be seen that the plug 5 has a substrate 8 fixed therein on which the end portion of the optical fiber 6 is held in place and which supports the optical component 7 as well as the electrical components necessary for the operation of the optical component.
In Fig. 3, the substrate 8 with the optical component 7 disposed thereon and the optical fiber 6 coupled to the optical component is shown in greater detail. The optical fiber 6 is firmly confined in the substrate 8 in a V-groove, for example. The substrate 8 is inserted into and fixed in a recess 9 in the socket 5 such that the free end of the optical fiber 6 lies in a bore 11 extending from the recess 9 to the end face CA 022167~9 1997-10-16 10 of the socket 5, and that the end is flush with the end face 10. Further bores 12 ending at the end face 10 of the socket 5 serve to receive the guide pins of the MT plug.
The end of the socket 5 remote from the end face 10 is provided, at the sides and below, with steps 13 corresponding to recesses 14 in the housing 1. These serve to positively fix the socket 5 in the housing 1.
The socket 5 may additionally be bonded to the housing 1. It is also possible to only bond the socket 5 to the housing.
Figs. 4 and 5 show details of the socket 5. They show the shape of the recess 9 in which the substrate 8 is fixed. A step 15 is provided for limiting the longitudinal motion of the substrate 8. The bore 11 for receiving the optical fiber and the shape of the step 13 are also clearly visible.
Part of the inner ends of the external contacts 2 may also be connected to a thermally highly conductive plate or the like and serve to transfer the heat away from a device disposed above the plate.
CA 022167~9 1997-10-16 . ~
Fixed in the housing 1 is a socket 5 which contains the end portion of an optical fiber 6. The socket 5 is the mate of an MT plug. MT plugs are known. They are offered, for example, by EUROPTICS Ltd., Whiston, Merseyside L35 IRZ, England. MT plugs are designed to couple at least one optical fiber to another device which also contains an optical fiber. To this end, the optical fiber is fixed in a bore of the MT plug in such a way that its end is flush with the external surface of the MT plug. For precise alignment of the MT plug, the latter has two guide pins at the external surface at which the optical fiber ends.
The optical fiber 6 terminates at an optical component 7, e.g., a laser diode, in which the optical signal transmitted by the optical fiber is converted to an electric signal.
In Fig. 2, parts identical to parts shown in Fig. 1 are designated by like reference numerals. It can be seen that the plug 5 has a substrate 8 fixed therein on which the end portion of the optical fiber 6 is held in place and which supports the optical component 7 as well as the electrical components necessary for the operation of the optical component.
In Fig. 3, the substrate 8 with the optical component 7 disposed thereon and the optical fiber 6 coupled to the optical component is shown in greater detail. The optical fiber 6 is firmly confined in the substrate 8 in a V-groove, for example. The substrate 8 is inserted into and fixed in a recess 9 in the socket 5 such that the free end of the optical fiber 6 lies in a bore 11 extending from the recess 9 to the end face CA 022167~9 1997-10-16 10 of the socket 5, and that the end is flush with the end face 10. Further bores 12 ending at the end face 10 of the socket 5 serve to receive the guide pins of the MT plug.
The end of the socket 5 remote from the end face 10 is provided, at the sides and below, with steps 13 corresponding to recesses 14 in the housing 1. These serve to positively fix the socket 5 in the housing 1.
The socket 5 may additionally be bonded to the housing 1. It is also possible to only bond the socket 5 to the housing.
Figs. 4 and 5 show details of the socket 5. They show the shape of the recess 9 in which the substrate 8 is fixed. A step 15 is provided for limiting the longitudinal motion of the substrate 8. The bore 11 for receiving the optical fiber and the shape of the step 13 are also clearly visible.
Claims (9)
1. An optoelectronic component having at least one electrical connection and at least one optical connection, c h a r a c t e r i z e d i n that the at least one electrical connection is formed by external contacts (2) on an SMD package (1), and that the at least one optical connection is formed by a socket (5) which is compatible with an MT plug.
2. An optoelectronic component as claimed in claim 1, characterized in that the external contacts (2) are implemented in SO technology (SO = small outline).
3. An optoelectronic component as claimed in claim 1, characterized in that the external contacts (2) are implemented in BGA technology (BGA = ball grid array).
4. An optoelectronic component as claimed in claim 1 and in claim 2 or 3, characterized in that the socket (5) is a molded part which is positively and/or nonpositively fixed in the package (1).
5. An optoelectronic component as claimed in claim 4, characterized in that the socket (5) contains a substrate (8) which supports optoelectronic converters and/or passive optical components.
6. An optoelectronic component as claimed in claim 5, characterized in that the socket connector (5) is provided with a recess (9) containing the substrate (8), which comprises an optoelectronic interface.
7. An optoelectronic component as claimed in claim 6, characterized in that the optoelectronic interface consists of at least one optical fiber (6) coupled to an optical component (7).
8. An optoelectronic component as claimed in claim 7, characterized in that the end of the optical fiber (6) remote from the coupling point is contained in a bore (11) provided in the molded part (10) between the recess (9) and an end face of the molded part (10).
9. An optoelectronic component as claimed in claim 8, characterized in that the package (1) contains a printed circuit board (3) which supports the electronic circuit required to operate the optical component (7).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19643072A DE19643072A1 (en) | 1996-10-18 | 1996-10-18 | Optoelectronic component for optical communications |
| DE19643072.0 | 1996-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2216759A1 true CA2216759A1 (en) | 1998-04-18 |
Family
ID=7809143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002216759A Abandoned CA2216759A1 (en) | 1996-10-18 | 1997-10-16 | Optoelectronic component |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR19980032936A (en) |
| CN (1) | CN1181634A (en) |
| CA (1) | CA2216759A1 (en) |
| DE (1) | DE19643072A1 (en) |
| TW (1) | TW376589B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102722006A (en) * | 2012-05-25 | 2012-10-10 | 华为技术有限公司 | Small pluggable module of optical fiber connector |
| US9746628B2 (en) | 2011-11-30 | 2017-08-29 | 3M Innovative Properties Company | Active optical cable assembly including optical fiber movement control |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29717271U1 (en) * | 1997-09-26 | 1997-11-06 | Phoenix Contact Gmbh & Co., 32825 Blomberg | Connection device with plug connections |
| EP1111420A3 (en) * | 1999-12-20 | 2001-09-19 | Talltec Sensors S.A. | Optical connector device |
| DE10034865B4 (en) * | 2000-07-18 | 2006-06-01 | Infineon Technologies Ag | Opto-electronic surface-mountable module |
| FR2815138B1 (en) * | 2000-10-05 | 2003-01-31 | Cit Alcatel | LOW STRESS INTERNAL STRUCTURE FOR OPTOELECTRICAL BOX |
| CN111223849A (en) * | 2020-01-13 | 2020-06-02 | 中国电子科技集团公司第四十四研究所 | Multi-channel integrated refrigeration single photon avalanche photodiode device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199093A (en) * | 1990-05-22 | 1993-03-30 | Bicc Plc. | Multi-part optical fibre connectors |
| EP0582992B1 (en) * | 1992-08-11 | 1998-06-03 | Sumitomo Electric Industries, Ltd | Optical module with improved grounding of an optical element |
| US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
-
1996
- 1996-10-18 DE DE19643072A patent/DE19643072A1/en not_active Withdrawn
-
1997
- 1997-10-09 TW TW086114885A patent/TW376589B/en active
- 1997-10-16 CA CA002216759A patent/CA2216759A1/en not_active Abandoned
- 1997-10-17 CN CN97120614A patent/CN1181634A/en active Pending
- 1997-10-17 KR KR1019970053377A patent/KR19980032936A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9746628B2 (en) | 2011-11-30 | 2017-08-29 | 3M Innovative Properties Company | Active optical cable assembly including optical fiber movement control |
| CN102722006A (en) * | 2012-05-25 | 2012-10-10 | 华为技术有限公司 | Small pluggable module of optical fiber connector |
| CN102722006B (en) * | 2012-05-25 | 2014-06-11 | 华为技术有限公司 | Small pluggable module of optical fiber connector |
Also Published As
| Publication number | Publication date |
|---|---|
| TW376589B (en) | 1999-12-11 |
| CN1181634A (en) | 1998-05-13 |
| KR19980032936A (en) | 1998-07-25 |
| DE19643072A1 (en) | 1998-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |