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BRPI0920736A2 - módulo de placa e método de fabricação do mesmo. - Google Patents

módulo de placa e método de fabricação do mesmo.

Info

Publication number
BRPI0920736A2
BRPI0920736A2 BRPI0920736A BRPI0920736A BRPI0920736A2 BR PI0920736 A2 BRPI0920736 A2 BR PI0920736A2 BR PI0920736 A BRPI0920736 A BR PI0920736A BR PI0920736 A BRPI0920736 A BR PI0920736A BR PI0920736 A2 BRPI0920736 A2 BR PI0920736A2
Authority
BR
Brazil
Prior art keywords
manufacture
board module
board
module
Prior art date
Application number
BRPI0920736A
Other languages
English (en)
Inventor
Gen Nagaoka
Ichiro Umekawa
Motoji Shiota
Yasuhiro Hida
Yukio Shimizu
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI0920736A2 publication Critical patent/BRPI0920736A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
BRPI0920736A 2008-09-29 2009-06-02 módulo de placa e método de fabricação do mesmo. BRPI0920736A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008251554 2008-09-29
PCT/JP2009/060092 WO2010035551A1 (ja) 2008-09-29 2009-06-02 基板モジュールおよびその製造方法

Publications (1)

Publication Number Publication Date
BRPI0920736A2 true BRPI0920736A2 (pt) 2015-12-29

Family

ID=42059559

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0920736A BRPI0920736A2 (pt) 2008-09-29 2009-06-02 módulo de placa e método de fabricação do mesmo.

Country Status (7)

Country Link
US (1) US8450753B2 (pt)
EP (1) EP2326155A4 (pt)
JP (1) JP5008767B2 (pt)
CN (1) CN102113423B (pt)
BR (1) BRPI0920736A2 (pt)
RU (1) RU2454843C1 (pt)
WO (1) WO2010035551A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
JP6170288B2 (ja) * 2012-09-11 2017-07-26 富士フイルム株式会社 転写材料、静電容量型入力装置の製造方法および静電容量型入力装置、並びに、これを備えた画像表示装置
KR101989824B1 (ko) * 2012-12-07 2019-06-17 삼성전자주식회사 디스플레이 모듈
KR102196093B1 (ko) * 2014-02-04 2020-12-31 삼성디스플레이 주식회사 표시장치
GB2525605B (en) * 2014-04-28 2018-10-24 Flexenable Ltd Method of bonding flexible printed circuits
RU2581155C1 (ru) * 2014-12-10 2016-04-20 федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет"Московский институт электронной техники" Способ изготовления электронного узла
KR102255030B1 (ko) 2015-01-08 2021-05-25 삼성디스플레이 주식회사 표시 장치
RU2571880C1 (ru) * 2015-01-30 2015-12-27 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" Способ монтажа микроэлектронных компонентов
US20160313838A1 (en) * 2015-04-21 2016-10-27 Lg Display Co., Ltd. Touch Screen Integrated Display Device
JP2017094580A (ja) * 2015-11-24 2017-06-01 セイコーエプソン株式会社 配線構造、ｍｅｍｓデバイス、液体噴射ヘッド、液体噴射装置、ｍｅｍｓデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法
JP6517130B2 (ja) * 2015-11-24 2019-05-22 デクセリアルズ株式会社 リペア方法、及び接続方法
JP6945276B2 (ja) * 2016-03-31 2021-10-06 デクセリアルズ株式会社 異方性導電接続構造体
WO2017203580A1 (ja) * 2016-05-23 2017-11-30 堺ディスプレイプロダクト株式会社 表示装置
CN106847871B (zh) * 2017-03-22 2020-06-16 武汉华星光电技术有限公司 Oled显示面板及其显示装置
US10420222B2 (en) * 2017-04-20 2019-09-17 Palo Alto Research Center Incorporated Method for bonding discrete devices using anisotropic conductive film
US20200219423A1 (en) * 2017-09-27 2020-07-09 Sharp Kabushiki Kaisha Flexible display device and method of manufacturing flexible display device
RU190134U1 (ru) * 2019-03-25 2019-06-21 Акционерное общество "Научно-исследовательский институт газоразрядных приборов "Плазма" (АО "ПЛАЗМА") Жидкокристаллический видеомодуль
US11579497B2 (en) * 2020-02-07 2023-02-14 Sharp Kabushiki Kaisha Substrate for display device and display device
KR20230064691A (ko) * 2021-11-03 2023-05-11 삼성디스플레이 주식회사 표시 장치

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JP3092880B2 (ja) 1992-05-12 2000-09-25 シャープ株式会社 パネルの実装方法
JP3571825B2 (ja) 1995-10-06 2004-09-29 シチズン時計株式会社 液晶表示装置
JP3663931B2 (ja) 1998-08-25 2005-06-22 セイコーエプソン株式会社 圧着方法、圧着装置及び液晶表示装置の製造方法
JP2000332373A (ja) 1999-05-20 2000-11-30 Matsushita Electric Ind Co Ltd 電子部品実装体およびその製造方法
JP3798220B2 (ja) 2000-04-07 2006-07-19 シャープ株式会社 半導体装置およびそれを用いる液晶モジュール
JP3756418B2 (ja) * 2001-02-28 2006-03-15 株式会社日立製作所 液晶表示装置及びその製造方法
US6724511B2 (en) 2001-11-16 2004-04-20 Thin Film Electronics Asa Matrix-addressable optoelectronic apparatus and electrode means in the same
NO316632B1 (no) * 2001-11-16 2004-03-15 Thin Film Electronics Asa Matriseadresserbart optoelektronisk apparat og elektrodeanordning i samme
JP3910527B2 (ja) * 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
US7139060B2 (en) * 2004-01-27 2006-11-21 Au Optronics Corporation Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
JP2006235295A (ja) * 2005-02-25 2006-09-07 Citizen Watch Co Ltd 液晶表示パネル
CN100573839C (zh) * 2005-04-14 2009-12-23 松下电器产业株式会社 电子电路装置及其制造方法
JP2007156288A (ja) 2005-12-08 2007-06-21 Epson Imaging Devices Corp 電気光学装置、実装構造体、電子機器及び電気光学装置の製造方法
TWI354846B (en) * 2007-01-26 2011-12-21 Au Optronics Corp Adhesive structure and method for manufacturing th
CN101574022B (zh) 2007-02-22 2011-04-20 夏普株式会社 电子电路装置及其制造方法以及显示装置
US8421979B2 (en) * 2008-07-28 2013-04-16 Sharp Kabushiki Kaisha Display panel and display device including the same
US20110169791A1 (en) * 2008-09-29 2011-07-14 Sharp Kabushiki Kaisha Display device
US20110169792A1 (en) * 2008-09-29 2011-07-14 Sharp Kabushiki Kaisha Display panel
US20100220072A1 (en) * 2009-01-22 2010-09-02 Sitronix Technology Corp. Modulized touch panel
WO2011040081A1 (ja) * 2009-09-30 2011-04-07 シャープ株式会社 基板モジュールおよびその製造方法

Also Published As

Publication number Publication date
JPWO2010035551A1 (ja) 2012-02-23
CN102113423B (zh) 2013-07-03
RU2454843C1 (ru) 2012-06-27
EP2326155A1 (en) 2011-05-25
CN102113423A (zh) 2011-06-29
US8450753B2 (en) 2013-05-28
WO2010035551A1 (ja) 2010-04-01
US20110169022A1 (en) 2011-07-14
JP5008767B2 (ja) 2012-08-22
EP2326155A4 (en) 2012-01-11

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2384 DE 13-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.