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BR112022003878A2 - Composição curável para um filme encapsulante, filme encapsulante, e, módulo pv - Google Patents

Composição curável para um filme encapsulante, filme encapsulante, e, módulo pv

Info

Publication number
BR112022003878A2
BR112022003878A2 BR112022003878A BR112022003878A BR112022003878A2 BR 112022003878 A2 BR112022003878 A2 BR 112022003878A2 BR 112022003878 A BR112022003878 A BR 112022003878A BR 112022003878 A BR112022003878 A BR 112022003878A BR 112022003878 A2 BR112022003878 A2 BR 112022003878A2
Authority
BR
Brazil
Prior art keywords
encapsulating film
curable composition
module
polyolefin
encapsulating
Prior art date
Application number
BR112022003878A
Other languages
English (en)
Inventor
M Habersberger Brian
Chao He
Hong Yang
Weiming Ma
Yufeng Yang
Yuyan Li
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BR112022003878A2 publication Critical patent/BR112022003878A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photovoltaic Devices (AREA)

Abstract

composição curável para um filme encapsulante, filme encapsulante, e, módulo pv. a presente invenção refere-se a uma composição curável para um filme encapsulante, em que a composição curável compreende: (a) uma poliolefina; (b) uma alumina pirogênica; (c) um peróxido orgânico; (d) um agente de acoplamento de silano; (e) um coagente de reticulação; e, opcionalmente, (f) um componente aditivo que compreende um estabilizador de uv, em que a poliolefina tem uma resistividade de volume inferior a 4,0e+15 ohm.cm. a presente divulgação refere-se ainda a um filme encapsulante feito de tal composição curável e um módulo pv que contém tal filme encapsulante.
BR112022003878A 2019-08-30 2019-08-30 Composição curável para um filme encapsulante, filme encapsulante, e, módulo pv BR112022003878A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/103788 WO2021035713A1 (en) 2019-08-30 2019-08-30 Photovoltaic encapsulant films comprising fumed alumina

Publications (1)

Publication Number Publication Date
BR112022003878A2 true BR112022003878A2 (pt) 2022-05-24

Family

ID=74684416

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112022003878A BR112022003878A2 (pt) 2019-08-30 2019-08-30 Composição curável para um filme encapsulante, filme encapsulante, e, módulo pv

Country Status (7)

Country Link
US (1) US20220306831A1 (pt)
EP (1) EP4021968A4 (pt)
JP (1) JP7391187B2 (pt)
KR (1) KR20220056205A (pt)
CN (1) CN114514276A (pt)
BR (1) BR112022003878A2 (pt)
WO (1) WO2021035713A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7474594B2 (ja) * 2020-01-07 2024-04-25 ダイセルミライズ株式会社 プロピレン系樹脂組成物とその成形品
WO2024197770A1 (en) * 2023-03-31 2024-10-03 Dow Global Technologies Llc Photovoltaic encapsulation film composition with anti-pid performance

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1113915C (zh) * 1997-02-07 2003-07-09 埃克森美孚化学专利公司 支化烯烃共聚物的热塑性弹性体组合物
KR20140143430A (ko) * 2007-07-26 2014-12-16 헨켈 아게 운트 코. 카게아아 이미드 부분을 함유하는 알콜, 및 이로부터 제조된 반응성 올리고머
US20100069538A1 (en) * 2008-09-18 2010-03-18 Alliance For Sustainable Energy, Llc Olefin Compositions with Enhanced Adhesion and Light Stability
CN102947949A (zh) * 2010-04-22 2013-02-27 株式会社大赛璐 光半导体保护材料及其前体以及光半导体保护材料的制造方法
US20120009382A1 (en) * 2010-07-06 2012-01-12 Tosoh F-Tech, Inc. Guard substrate for optical electromotive force equipment, and its production process
US20130167926A1 (en) * 2010-09-21 2013-07-04 Debra H. Niemann Electronic Device Module Comprising Ethylene-Alpha Olefin Tapered Block Copolymers and Optional Vinyl Silane
FR2971625B1 (fr) * 2011-02-11 2013-02-15 Arkema France Encapsulant d'un module photovoltaique
CN104114592A (zh) * 2012-02-03 2014-10-22 陶氏环球技术有限责任公司 包括含硅烷的乙烯互聚物配方的膜和包括其的电子设备模块
JP5854473B2 (ja) * 2012-07-31 2016-02-09 三井化学株式会社 太陽電池封止材および太陽電池モジュール
ES2634023T3 (es) * 2013-04-22 2017-09-26 Dow Global Technologies Llc Dispositivos electrónicos que comprenden dos películas encapsulantes
JP5565520B1 (ja) * 2013-12-27 2014-08-06 東洋インキＳｃホールディングス株式会社 太陽電池封止材用樹脂組成物、太陽電池封止材および太陽電池モジュール
CN104263285A (zh) * 2014-09-19 2015-01-07 乐凯胶片股份有限公司 一种光伏组件用聚烯烃封装胶膜
KR102520483B1 (ko) * 2014-10-02 2023-04-12 다우 글로벌 테크놀로지스 엘엘씨 양호한 난연성을 갖는 고주파 용접가능한 에틸렌계 폴리머 조성물
BR112017008916B1 (pt) * 2014-10-30 2022-04-12 Dow Global Technologies Llc Módulo fotovoltaico
WO2016101988A1 (en) * 2014-12-22 2016-06-30 Abb Technology Ag Composite formulations for direct current insulation
JP2017120898A (ja) * 2015-12-24 2017-07-06 住友化学株式会社 太陽電池用封止シート
CN106129152B (zh) * 2016-08-17 2017-12-29 浙江正欣光电科技有限公司 光伏组件封装用poe复合背面材料
CN106206790B (zh) * 2016-08-17 2018-05-11 浙江正欣光电科技有限公司 光伏组件封装用poe复合膜
FR3055629B1 (fr) * 2016-09-08 2018-08-17 Arkema France Composition durcissable comprenant un polymere d'ethylene, un monoperoxycarbonate et un hydroperoxyde de t-alkyle
CN106750853A (zh) * 2016-11-29 2017-05-31 安徽双诚电线电缆有限公司 一种光伏发电用直流电缆绝缘材料及其制备方法
JP6984128B2 (ja) * 2016-12-29 2021-12-17 日本ポリエチレン株式会社 ポリエチレン樹脂の製造方法並びに当該方法により製造されたポリエチレン樹脂を用いた太陽電池封止材および太陽電池モジュール
TWI688596B (zh) * 2017-02-28 2020-03-21 美商陶氏全球科技有限責任公司 乙烯-α-烯烴共聚物-磷酸三烯丙酯組合物
US11459411B2 (en) * 2017-06-29 2022-10-04 Dow Global Technologies Llc Polyolefin composition
WO2019019988A1 (zh) * 2017-07-25 2019-01-31 杭州星庐科技有限公司 封装组合物及应用，及包含其的封装胶膜及其制备方法
WO2019084773A1 (en) * 2017-10-31 2019-05-09 Dow Global Technologies Llc Polyolefin compositions for photovoltaic encapsulant films
CN110016170B (zh) * 2018-01-10 2020-12-01 杭州福斯特应用材料股份有限公司 一种低水汽透过率聚烯烃弹性体胶膜及制备方法
CN108795124B (zh) * 2018-06-26 2020-10-16 乐凯胶片股份有限公司 一种光伏用聚烯烃封装胶膜
CN110105651B (zh) * 2019-06-03 2021-07-30 合肥工业大学 一种电线电缆绝缘层用导热绝缘聚乙烯复合材料
WO2021035709A1 (en) * 2019-08-30 2021-03-04 Dow Global Technologies Llc Polyolefin compositions having improved electrical properties
CN113667085B (zh) * 2021-08-12 2022-09-23 深圳市金志成塑胶科技有限公司 一种应用于汽车的耐冲击抗老化的反光塑胶

Also Published As

Publication number Publication date
EP4021968A4 (en) 2023-04-12
EP4021968A1 (en) 2022-07-06
CN114514276A (zh) 2022-05-17
US20220306831A1 (en) 2022-09-29
KR20220056205A (ko) 2022-05-04
JP7391187B2 (ja) 2023-12-04
WO2021035713A1 (en) 2021-03-04
JP2022552074A (ja) 2022-12-15

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B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]