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BE688703A - - Google Patents

Info

Publication number
BE688703A
BE688703A BE688703DA BE688703A BE 688703 A BE688703 A BE 688703A BE 688703D A BE688703D A BE 688703DA BE 688703 A BE688703 A BE 688703A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE688703A publication Critical patent/BE688703A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
BE688703D 1965-10-23 1966-10-21 BE688703A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US502986A US3410774A (en) 1965-10-23 1965-10-23 Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece

Publications (1)

Publication Number Publication Date
BE688703A true BE688703A (xx) 1967-03-31

Family

ID=24000292

Family Applications (1)

Application Number Title Priority Date Filing Date
BE688703D BE688703A (xx) 1965-10-23 1966-10-21

Country Status (7)

Country Link
US (1) US3410774A (xx)
BE (1) BE688703A (xx)
CH (1) CH447760A (xx)
DE (1) DE1621599C2 (xx)
FR (1) FR1501165A (xx)
GB (1) GB1157989A (xx)
NL (1) NL154560B (xx)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3502562A (en) * 1967-04-19 1970-03-24 Corning Glass Works Multiple cathode sputtering fixture
US3507774A (en) * 1967-06-02 1970-04-21 Nat Res Corp Low energy sputtering apparatus for operation below one micron pressure
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system
US3708418A (en) * 1970-03-05 1973-01-02 Rca Corp Apparatus for etching of thin layers of material by ion bombardment
US3676317A (en) * 1970-10-23 1972-07-11 Stromberg Datagraphix Inc Sputter etching process
FR2128140B1 (xx) * 1971-03-05 1976-04-16 Alsthom Cgee
DE2117199C3 (de) * 1971-04-08 1974-08-22 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Herstellung geätzter Muster in dünnen Schichten mit definierten Kantenprofilen
US4157465A (en) * 1972-01-10 1979-06-05 Smiths Industries Limited Gas-lubricated bearings
US3897324A (en) * 1973-06-25 1975-07-29 Honeywell Inc Material deposition masking for microcircuit structures
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
JPS5582781A (en) * 1978-12-18 1980-06-21 Ibm Reactive ion etching lithography
US4277321A (en) * 1979-04-23 1981-07-07 Bell Telephone Laboratories, Incorporated Treating multilayer printed wiring boards
US4340461A (en) * 1980-09-10 1982-07-20 International Business Machines Corp. Modified RIE chamber for uniform silicon etching
US4391034A (en) * 1980-12-22 1983-07-05 Ibm Corporation Thermally compensated shadow mask
US4426274A (en) 1981-06-02 1984-01-17 International Business Machines Corporation Reactive ion etching apparatus with interlaced perforated anode
US4654118A (en) * 1986-03-17 1987-03-31 The United States Of America As Represented By The Secretary Of The Army Selectively etching microstructures in a glow discharge plasma
US4824544A (en) * 1987-10-29 1989-04-25 International Business Machines Corporation Large area cathode lift-off sputter deposition device
US5341980A (en) * 1990-02-19 1994-08-30 Hitachi, Ltd. Method of fabricating electronic circuit device and apparatus for performing the same method
CA2032763C (en) * 1990-12-20 2001-08-21 Mitel Corporation Prevention of via poisoning by glow discharge induced desorption
US5340015A (en) * 1993-03-22 1994-08-23 Westinghouse Electric Corp. Method for applying brazing filler metals
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition
US5527438A (en) * 1994-12-16 1996-06-18 Applied Materials, Inc. Cylindrical sputtering shield
JP3523405B2 (ja) 1996-01-26 2004-04-26 株式会社日立製作所 荷電ビーム処理によるパターン形成方法及び荷電ビーム処理装置
US6287977B1 (en) * 1998-07-31 2001-09-11 Applied Materials, Inc. Method and apparatus for forming improved metal interconnects
US6193855B1 (en) 1999-10-19 2001-02-27 Applied Materials, Inc. Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage
US6350353B2 (en) 1999-11-24 2002-02-26 Applied Materials, Inc. Alternate steps of IMP and sputtering process to improve sidewall coverage
US6344419B1 (en) 1999-12-03 2002-02-05 Applied Materials, Inc. Pulsed-mode RF bias for sidewall coverage improvement
US6554979B2 (en) 2000-06-05 2003-04-29 Applied Materials, Inc. Method and apparatus for bias deposition in a modulating electric field
US6521897B1 (en) * 2000-11-17 2003-02-18 The Regents Of The University Of California Ion beam collimating grid to reduce added defects
US6746591B2 (en) 2001-10-16 2004-06-08 Applied Materials Inc. ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature
EP1444727A4 (en) * 2001-10-22 2007-07-18 Unaxis Usa Inc PROCESS AND DEVICE FOR CORROSING THIN, DAMAGE-SENSITIVE LAYERS USING HIGH FREQUENCY PULSE PLASMA
JP4710774B2 (ja) * 2005-11-09 2011-06-29 株式会社日立製作所 研磨定盤の製造方法
US9779643B2 (en) 2012-02-15 2017-10-03 Microsoft Technology Licensing, Llc Imaging structure emitter configurations
US9578318B2 (en) 2012-03-14 2017-02-21 Microsoft Technology Licensing, Llc Imaging structure emitter calibration
US11068049B2 (en) 2012-03-23 2021-07-20 Microsoft Technology Licensing, Llc Light guide display and field of view
US9558590B2 (en) 2012-03-28 2017-01-31 Microsoft Technology Licensing, Llc Augmented reality light guide display
US10191515B2 (en) 2012-03-28 2019-01-29 Microsoft Technology Licensing, Llc Mobile device light guide display
US9717981B2 (en) 2012-04-05 2017-08-01 Microsoft Technology Licensing, Llc Augmented reality and physical games
US10502876B2 (en) 2012-05-22 2019-12-10 Microsoft Technology Licensing, Llc Waveguide optics focus elements
US10192358B2 (en) 2012-12-20 2019-01-29 Microsoft Technology Licensing, Llc Auto-stereoscopic augmented reality display
US10324733B2 (en) 2014-07-30 2019-06-18 Microsoft Technology Licensing, Llc Shutdown notifications
US20160035539A1 (en) * 2014-07-30 2016-02-04 Lauri SAINIEMI Microfabrication
US10592080B2 (en) 2014-07-31 2020-03-17 Microsoft Technology Licensing, Llc Assisted presentation of application windows
US9787576B2 (en) 2014-07-31 2017-10-10 Microsoft Technology Licensing, Llc Propagating routing awareness for autonomous networks
US10678412B2 (en) 2014-07-31 2020-06-09 Microsoft Technology Licensing, Llc Dynamic joint dividers for application windows
US10254942B2 (en) 2014-07-31 2019-04-09 Microsoft Technology Licensing, Llc Adaptive sizing and positioning of application windows
US9414417B2 (en) 2014-08-07 2016-08-09 Microsoft Technology Licensing, Llc Propagating communication awareness over a cellular network
US10317677B2 (en) 2015-02-09 2019-06-11 Microsoft Technology Licensing, Llc Display system
US9827209B2 (en) 2015-02-09 2017-11-28 Microsoft Technology Licensing, Llc Display system
US10018844B2 (en) 2015-02-09 2018-07-10 Microsoft Technology Licensing, Llc Wearable image display system
US11086216B2 (en) 2015-02-09 2021-08-10 Microsoft Technology Licensing, Llc Generating electronic components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2702274A (en) * 1951-04-02 1955-02-15 Rca Corp Method of making an electrode screen by cathode sputtering
US3087838A (en) * 1955-10-05 1963-04-30 Hupp Corp Methods of photoelectric cell manufacture
DE1083617B (de) * 1956-07-27 1960-06-15 Gen Motors Corp Verfahren zum Herstellen poroeser Oberflaechen auf chromierten Zylinderbuechsen von Verbrennungsmotoren
GB1054660A (xx) * 1963-09-16
US3361659A (en) * 1967-08-14 1968-01-02 Ibm Process of depositing thin films by cathode sputtering using a controlled grid

Also Published As

Publication number Publication date
DE1621599B1 (de) 1973-05-24
US3410774A (en) 1968-11-12
GB1157989A (en) 1969-07-09
CH447760A (de) 1967-11-30
FR1501165A (fr) 1967-11-10
NL6613583A (xx) 1967-04-24
DE1621599C2 (de) 1973-12-06
NL154560B (nl) 1977-09-15

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