BE1031101B1 - Heat exchange technology - Google Patents

Abstract

Aspects of the invention relate to a device (100) and a system (500) for heat exchange. A heat exchanger (200) is included, designed to dissipate heat from at least one electrical and/or electronic module (350). Furthermore, a receiving device (300) for receiving at least one electrical and/or electronic module (350) is included. At least one heat-absorbing component (220) of the heat exchanger (200) takes up a first volume (222) in a first state (246), and the heat-absorbing component (220) of the heat exchanger takes up a second volume (224) in a second state (247), wherein the second volume is larger than the first volume. The at least one heat-absorbing component (220) of the heat exchanger (200) in the second state (247) has a thermal contact (226) with a surface of the at least one accommodateable electrical and/or electronic module (350) for dissipating heat.

Description

Heat exchange technology

The invention relates to a technique for heat exchange. In particular, the

Invention a device for heat exchange and a system for

Heat exchange, in which waste heat is dissipated from electrical and/or electronic components, thus preventing overheating of the components.

When operating electrical and/or electronic modules, a considerable amount of

amount of waste heat. This waste heat heats the components involved and

components, so that their operating temperature is exceeded. Accordingly, cooling is essential to ensure the proper operation of the components and

assembly. With moderate heating, this often results in a

Air cooling is used to circulate the components and assemblies to be cooled, often with the support of fans or similar. Such

Applications are, for example, personal computers or similar

facilities known.

However, the heat dissipation performance achieved in this way is often not sufficient for modules, especially in the field of power electronics and high-performance computers. For example, charging stations for electrically powered vehicles typically provide a charging capacity of 100 kW (kilowatts) and more, where the waste heat generated can only be dissipated with the much more efficient

Liquid cooling can be transported away. This means that when large amounts of

Liquid-cooled modules are used to reduce the amount of waste heat, which are directly connected to the main heat generators in terms of heat output and

Heat exchangers adapted to the shape of the module absorb the waste heat. The individual modules are to be connected to the cooling circuit of the system, which also

Cooling components. To avoid leaks in the modules and in the entire system, which in the above-mentioned application area not only

Since these cooling systems not only cause short circuits but also represent a significant risk potential and a significant amount of damage, high-quality cooling components must be provided, which must be designed specifically for the modules at least in the area of the modules. Accordingly, such solutions are expensive to purchase and complex to maintain and operate.

In other words, power electronics modules and

Computer circuits generate heat due to power loss during operation, which is transferred to a cooling medium in the internally installed heat sink as a heat exchanger. This waste heat is then transported out of the closed outer casing through the built-in circuit and the heat is transferred by means of a second

heat exchanger to the ambient air or river and groundwater.

However, the following disadvantages occur:

Inside the modules, a heat sink is installed which is filled with a pressurized liquid. There are several sealing surfaces which must be permanently sealed. Furthermore, the heat sink must be enclosed

Liquid must be insulated from the electronics. In addition, the connection points for the cooling on the housing, the plugs and mating plugs for pipes and hoses are relatively expensive, as they have to be plugged and unplugged under pressure without the

Liquid escapes from the cooling system. In addition, the installed

Heat sinks can be complex and expensive, as milling, threading and

Seals are required. Corrosion-resistant and at the same time heat-conducting materials must be used. If a heat sink is installed inside the

module, it takes up a corresponding volume. The housing of the module must be larger to accommodate this additional volume.

Another limiting factor is that the surface of the heat sink, which is available for contacting the lossy components and assemblies, is much smaller than the surface of the module's housing.

Alternatively, cooling plates (also known as "cool plates") can

Contact the module mechanically for cooling, for example by screwing it on. For this purpose, the internal structure of the modules must be designed in such a way that the lossy

Components and assemblies in the module transfer waste heat to the surface of the

housing. The cooling plate is contacted on this surface. In this

This solution eliminates the need for internal module cooling. The disadvantage, however, is that the

The surfaces of the heat sink and the module must be very flat and rigid so that the thermal transition works effectively. This means that they require a considerable amount of material, which is associated with weight and cost, and must be mechanically reworked, for example by face milling.

Furthermore, the two surfaces on the heat sink and the module must be

Contact to ensure heat transport. This connection must be permanent and independent of thermal expansion, vibrations and other mechanical stresses, for example through screwing. And even if this is achieved, the heat-conducting paths are longer and thus the thermal resistance greater compared to cooling within the module. Finally, the cooling plate is expensive because corrosion-resistant and heat-conducting materials (copper, stainless steel, aluminum) are used, and complex because milling,

Thread inserts and seals can be manufactured.

The invention is therefore based on the object of making contact with

To simplify heat exchange, especially in computer circuits, power electronic components and their heat distributors (technical term:

Alternatively or additionally, the task is to reduce weight and material costs as well as simplify handling.

The task or tasks are assigned the characteristics of the independent

Claims are solved. Appropriate embodiments and advantageous further developments of the invention are specified in the dependent claims.

Embodiments of the invention are described below with partial reference to the figures.

According to a first aspect, a device for heat exchange comprises a

Heat exchanger designed to dissipate heat from at least one electrical and/or electronic module. The device further comprises a

Receiving device with at least one receptacle which is designed to receive the at least one electrical and/or electronic module. At least one heat-absorbing component of the heat exchanger takes up a first volume in a first state. The heat-absorbing component of the

Heat exchanger occupies a second volume in a second state, wherein the second volume is larger than the first volume. The at least one heat-absorbing component of the heat exchanger is arranged in the second state to establish thermal contact with a surface of the at least one absorbable electrical and/or electronic module for

Dissipation of heat.

This can advantageously increase the thermal contact between the heat-absorbing

Components of the heat exchanger and the electrical and/or electronic module accommodated in the holder can be simplified, flexible in shape and/or reversible (i.e. detachable).

For example, the at least one heat-absorbing component of the

Heat exchanger in the second state has a thermal contact with the surface of the at least one electrical and/or electronic module for dissipating the

Heat if at least one module is accommodated in the respective recording.

Due to the smaller first volume, the at least one heat-absorbing component of the heat exchanger can be arranged in the first state to release (i.e. open) the thermal (and optionally mechanical) contact with the surface of the at least one absorbable module. For example, the heat-absorbing component of the heat exchanger in the first state is separated from the

Surface of the at least one recordable module.

Alternatively or additionally, the heat-absorbing component of the

Heat exchanger in the second state due to the larger second volume extend to the surface of the at least one accommodateable module and/or nestle against the surface of the at least one module (for example, molding).

The surface of the at least one module does not have to be flat and/or does not have to be a surface of a housing. Due to the expansion from the first to the second volume, the heat-absorbing component can extend into the installation space of the respective module and/or directly contact individual components and assemblies. Optionally, the heat-absorbing component acts in the second

In the first state, the module is not only thermally but also positively and/or frictionally connected to the respective module, so that the respective module is mechanically secured against removal in the second state.

By contracting from the second to the first volume, the heat absorption

Component a positive and/or frictional engagement in the respective

Module. The first and second state can be determined, for example, by the

Pressure of a cooling medium in the heat-absorbing component (e.g. 5 a system pressure).

The cooling medium can be a coolant (e.g. a cooling liquid) or a

refrigerant.

The use of the first and second volumes can mean taking up the respective volume or having the respective volume. The at least one electrical and/or electronic module is also referred to as the at least one module or simply as the module. The dissipated heat can also be referred to as waste heat.

The mounting device can be a (electrical or electronic) control cabinet, an electronics cabinet (also known as a rack), a

supply column or something similar.

The device can be used in the mounting device for cooling components and

Assemblies (for example power components) in at least one module. Due to the increase in volume during the transition from the first to the second state, the heat-absorbing component of the heat exchanger can contact the components and assemblies (for example power components) directly in order to dissipate the heat. For this purpose, the at least one module can be housingless or open towards the heat-absorbing component of the heat exchanger.

The device for heat exchange may comprise a plurality of components. The components may include the heat-absorbing

Component of the heat exchanger (short: heat-absorbing

heat exchanger component) to absorb the waste heat. A

Transport component can be used to transport a cooling medium flowing through the heat exchanger component (for example a coolant or a

The coolant can be a cooling liquid. A heat-emitting component of the heat exchanger can be used to cool the

The heat-emitting heat exchanger component can be arranged outside the receiving device, for example to release the

Heat from ambient air, river water or groundwater.

The device may comprise a closed cooling system (i.e. a cooling circuit). In this case, the heat-absorbing component of the

M heat exchanger is spatially separated from the heat-emitting component of the heat exchanger, for example by arranging these components in separate rooms or inside or outside a housing of the receiving device. The connection of the heat-absorbing and heat-emitting

Components can be realized by the transport component, for example hoses with the cooling medium (i.e. coolant or refrigerant). The cooling medium can be in the hoses between the heat-absorbing and heat-emitting

components. The circulation can be achieved by a circulation pump for the

Cooling medium (for example as part of the transport component) can be driven or supported. However, circulation can also be maintained by gravity and/or (for example thermally driven) convection.

The heat-absorbing component of the heat exchanger, which is designed to dissipate heat from at least one electrical and/or electronic module, can also be referred to as a (for example molded) heat sink. It can take up different volumes.

The heat-absorbing component can have a stretchable outer skin (also: cover or surface) with elastic properties. Without the influence of

Forces, for example in the form of increased system pressure, optionally pressure of the

cooling medium (e.g. the coolant or the refrigerant), the

outer skin, so that the volume of the heat-absorbing

Component is reduced (for example to the first volume). If the heat-absorbing component is arranged in the receiving device (for example in an electronic control cabinet or a supply column), the reduced first volume can enable the installation or removal of at least one electrical and/or electronic module in corresponding guides or receptacles. If, however, the system pressure, optionally the pressure of the cooling medium (for example the coolant or the refrigerant), is increased, the outer skin of the heat-absorbing component expands so that the

Volume of the heat absorbing component is increased to the second volume.

The enlarged heat-absorbing component now contacts the at least one electrical and/or electronic module that can be installed in the holder by pressing its outer skin against a certain pressure (for example, the difference between the pressure of the cooling medium and a surface tension of the

outer skin) is in contact with the module (for example, its components or assemblies). This creates the thermal contact (also known as a thermal bridge) through which the heat can be dissipated.

In embodiments, in the device for heat exchange, the heat-absorbing component of the heat exchanger can be arranged in the receiving device above and/or below the receiving device of the electrical and/or electronic

module. The heat exchanger component can preferably be mounted. In the first state of the heat exchanger component, a

Removing or adding at least one electrical or electronic

Module into the holder of the mounting device.

Advantageously, the electrical and/or electronic module can be inserted and/or removed and/or replaced without further

Consideration of a heat sink or work steps for connecting a

Water cooling. Further advantageously, components of the electrical and/or electronic module that are to be cooled can be located in the top and/or bottom of the

module.

Heat sinks can also be arranged on the top and bottom of the module. The heat sink, the so-called component of the heat exchanger, reduces its volume in such a way that the installation space in the device for

The electrical and/or electronic module can be accommodated in a space that is

The module and the heat sink with a small volume can be arranged next to each other without contact.

In further embodiments, the at least one electrical or electronic module that can be accommodated can comprise power components to be cooled. In other words, the surface to be cooled can comprise areas of the

Power components. The thermal contact with the electrical and/or electronic module can comprise a thermal contact with an assembly or components (for example the power components to be cooled) or the power components to be cooled. Alternatively or additionally, the thermal contact can be designed as a pressure contact. A contact pressure of the thermal contact can depend on a pressure of the cooling medium in the heat-absorbing component.

Advantageously, good heat dissipation can be achieved through direct contact between the heat-absorbing component (i.e. the deformable heat sink) and the component or assembly (e.g. the power component), without having to rely on heat conduction from other components (e.g. housing or heat spreader). Heat-conducting paths can thus be shorter and thermal resistance reduced.

Power components can be components of power electronics and

computing circuits. Power electronics is a sub-area of

Electrical engineering, which deals with the conversion of electrical energy using switching electronic components. Typical applications are converters (or frequency converters) in the field of electrical drive technology,

Solar inverters and converters for wind turbines for feeding renewable energy into the grid or switching power supplies. Also power components for

Charging stations for electrically powered vehicles fall under this category. Furthermore, the power components can be high-power lasers and components for exciting an optically active medium of such a laser. Examples of

Computing circuits include processors and memory.

The thermal contact can include a variety of locations in the module.

In other embodiments, the device for heat exchange may comprise a thermal contact with a heat-conducting outer surface of the electrical and/or electronic module. The thermal contact may be

pressure contact. Optionally, the heat-conducting outer surface can be designed as

be made of aluminium sheet, preferably rolled aluminium sheet.

This makes it possible to advantageously form a large-area contact point for dissipating large amounts of heat. Furthermore, cooling structures can be formed within the module for various components, which no longer need to be directly contacted by individual solid heat sinks and/or provided with water cooling inlets and outlets.

The cooling structure inside the module can be thermally connected to the heat-conducting outer surface of the module. It can comprise a metal structure that is firmly connected, for example screwed, to the components to be cooled and the heat-conducting outer surface. A plurality of heat-conducting

outer surfaces on a module. They can also be arranged on an upper

surface of the module and/or on a lower surface of the module.

In addition, power components of the module can also be supplied directly from the

Heat sink must be able to be contacted in a thermally conductive manner.

Furthermore, the heat-conducting outer surfaces or the power components can have a certain surface roughness and/or unevenness. Even then, a high degree of heat can still be dissipated through thermal pressure contact.

In further embodiments, the component of the heat exchanger can assume the first state at a first system pressure in the heat exchanger. The

Component of the heat exchanger can change the second state at a second

system pressure in the heat exchanger, with the second system pressure being higher than the first system pressure. The expansion of a surface of the component of the heat exchanger varies depending on the system pressure. The component of the

Heat exchanger can optionally have a pillow shape.

Advantageously, the expansion of the component of the heat exchanger, which serves as

Heat sink can be checked.

The pressure-dependent expansion of the elastic surface can be several

pressure levels that can correspond to different strains.

Alternatively or additionally, the elastic surface can consist of several

Partial surfaces can be constructed. Zones with lower elongation and

Zones with greater stretching can be included. Thus, zones parallel to the electrical and/or electronic module to be accommodated can have a greater stretchability than zones essentially perpendicular to the electrical and/or electronic module to be accommodated. Thus, the contact surface to the

Further increase heat dissipation without further increasing the system pressure.

In embodiments, the surface can have at least one of the properties of being impermeable to coolant or refrigerant, frost-proof, puncture-proof, temperature-resistant from -40°C to +100°C, durable and electrically insulating.

This advantageously results in a particularly robust heat sink.

The tightness against coolant or refrigerant fluid includes all

operating pressures and temperatures occurring in the heat exchanger. It also covers the liquid and gaseous state of the cooling liquid. Sufficient tear resistance is provided over the service life of the surface. It protects the heat sink against incorrect use of tools and against incorrect assembly, for example of the electrical and/or electronic module. Sufficient

Puncture resistance ensures the appropriate robustness against punctures, for example in the case of incorrect tool use. The temperature resistance from -40°C to +100°C enables operation with various coolants and cooling liquids. Water can be used as a coolant, but also ammonia. The

Refrigerant fluids R134a, R513A and R450A are suitable for applications down to -25°C evaporation temperature. For deep-freeze applications, R404A,

R507A and R422A down to -45°C. The electrical insulation is advantageous at every expansion level of the surface and at every temperature in order to avoid electrical short circuits in the module or its components and

components to be avoided.

In other embodiments, the surface of the component of the

Heat exchanger retains its basic geometric shape in the first volume and in the second volume.

It is advantageous to choose a basic shape that allows a compact design for the first volume and a large-area support for the second volume. This can, for example, be the shape of a box-shaped cushion, where the height of the cushion is essentially the same for the first volume and the second volume.

cushion is constant over the area of width and height of the cushion and is therefore free of protruding parts with a greater height. This shape can also be called a box-shaped cushion shape. In the first volume, the

Cushion height is lower than in the second volume, while the area of the

The width and height of the cushion remain unchanged. The basic shape of the box-shaped

The shape of the cushion can be triangle, square, hexagon or polygon. It can also be circular or oval. Alternatively, the

The height of the cushion decreases locally in the first volume and also in the second volume, creating indentations in the surface.

In further embodiments, the heat-absorbing component of the

Heat exchanger have a plate-shaped spatial extension. The heat-absorbing component of the heat exchanger has a central solid body (for example a support structure) and a shell covering the surface, whereby the central solid body surrounds the shell in longitudinal and

transverse direction. Optionally, the central solid body can be made of sheet metal with

recesses or as a thin plastic body, for example <= 5mm, with

recesses must be made.

Advantageously, a variety of basic shapes of the heat sink can be used

Component of the heat exchanger must be precisely specified.

As already mentioned, this basic shape can be used as a box-shaped pillow as

Triangle, square, hexagon or polygon. It can also be designed as a circular or oval basic shape. However, the

The central solid body filling the shell in the longitudinal and transverse direction can be larger and can take on any desired length and/or width and/or geometric shape. This also allows local

Recesses and/or local additions or extensions of the area from

Length and width possible. By using sheet metal, the central fixed

Body should be compact, especially with a lower height than a

Plastic version. In a plastic version, the

Corrosion resistance to the coolant or refrigerant fluid must be improved.

The optional recesses of the central solid body are designed as holes in the

The holes can be evenly distributed on the central solid body. Alternatively,

Hole centers on the central solid body should be provided, which

For example, in the middle of the plate an increased flow of the coolant or the

The central solid body can also be used as a surrounding solid

Edge can be designed with a centrally arranged grid that is attached to the edge. In other embodiments, it is possible to deviate from the flat extension in length and width. For example, a stepped design,

Provide ramps and/or holes in the length and width directions.

In embodiments, the casing of the heat-absorbing component of the

The heat exchanger with its top and bottom can be positioned closer to the central solid body in the first state. The shell with its top and bottom can be positioned further away from the central solid body in the second state.

Advantageously, the basic shape of the heat-absorbing component of the heat exchanger, which is designed as a heat sink, can be used in the first and second

For example, a gravity-induced

Sagging of the deformable heat sink or blocking of the respective

Recording, especially in the first state, can be avoided. This can be achieved by elastic elements between the surface and the central solid body. In this way, even with uneven, non-flat central solid bodies, a close positioning of the surface to the central solid body can be achieved. In addition or alternatively, this close positioning can also be achieved by the elasticity of the surface, which in the first state clings to the central solid body, for example with low pressure of the

coolant.

The recording device can be stationary. Alternatively or in addition,

The recording device's recordings must be arranged vertically one above the other.

In the same or other embodiments, in the

Recording device the vertical distance of the recordings (e.g. the space for

Holder) for the electrical and/or electronic module of a rack

Height unit h, for example h=4.445 cm (for example for a 19-

inch rack). The sum of the heights of the electrical and/or electronic module and the heat exchanger component can correspond to a single or multiple height unit (HE).

Compatibility with the 19-inch industrial standard IEC 60297-3-100 (in Germany DIN 41494), IEC 60297-3-101 / IEEE 1101.11EC

60297-3-102 / IEEE 1101.10/11 a variety of assemblies are used as electrical and/or electronic modules.

In addition, the heat-absorbing component of the heat exchanger (called a deformable heat sink) can also be traded alone for use in the widely used racks (for example for 19-inch modules).

Furthermore, electrical and/or electronic modules to be cooled can increase the height of the heat-absorbing component of the

heat exchanger in their own construction height, so that the

Combination of electrical and/or electronic module and the heat-absorbing component of the heat exchanger in the mentioned

This allows a combination with other modules according to a standard for racks (for example for 19-inch racks) in the device for

Heat exchange is possible.

In further embodiments, the heat-absorbing component of the

The cooling medium can be introduced into the heat-absorbing

component. The cooling medium can be guided in a meandering manner through the heat-absorbing component. The cooling medium can be

exit point from the heat-absorbing component. Optionally, the cooling medium can consist of water (or a water-based solution), oil or a

oil-based solution) or alcohol (e.g. ethanol) or an alcoholic

solution exists.

Advantageously, the waste heat can be efficiently absorbed and dissipated by the cooling medium.

The cooling medium can be designed as a coolant or as a cooling liquid, as already explained above. In the coolant version, the

Cooling medium based on water. The entry point and the exit point into the heat-absorbing component can be formed as a nozzle or tube, which at one end is firmly and impermeably connected to the surface of the

At the other end of the inlet and outlet, a hose can be attached firmly and impermeably to supply or discharge the coolant or cooling liquid. The attachment can be detachable, for example as a twist or screw cap. Alternatively, the attachment can also be non-detachable, for example as an adhesive or as a

Pressing. The entry point and the exit point can be arranged diagonally opposite each other at the ends of the component designed as a heat sink. Alternatively, they can also be arranged next to each other. The meandering

The coolant or refrigerant can be guided in a uniform meander through the heat-absorbing component of the heat exchanger.

Alternatively, the meander can also be unevenly distributed through the heat-absorbing

Component of the heat exchanger, whereby special cooling focuses of the electrical and/or electronic module can be taken into account for increased heat absorption.

In embodiments, the cooling medium can be used as a coolant or as

Refrigerant liquid (i.e. refrigerant), whereby in the case of the design as

Refrigerant a compressor and/or evaporation of the refrigerant during

Cooling process is included.

When using a coolant, it is advantageous to use an environmentally friendly coolant, for example water. When using a

A greater cooling effect can be generated by using a cooling liquid, whereby the pressure change of the cooling liquid during the transition from solid to liquid unit and vice versa is taken into account by means of appropriate expansion tanks.

Water is often used as a coolant because of its general

availability, its already mentioned environmental compatibility and its low

Costs. The cooling fluid can be selected and used depending on the temperature, for example according to the temperature ranges described above.

In other embodiments, the heat exchanger may comprise a heat-emitting

Component for cooling the cooling medium. The cooling medium is used for

Entry into the entry point of the heat-absorbing component is provided by the heat-emitting component. The cooling medium is absorbed by the heat-emitting component after exiting the exit point of the heat-absorbing component. Optionally, the cooling medium is provided between the heat-absorbing component and the heat-emitting component.

Component is passed through hoses, valves and distributors.

This advantageously means that the transport and cooling of the cooling medium is carried out centrally, so that the necessary components only have to be present once, thus reducing installation space and costs.

The hoses for transporting the cooling medium allow a flexible arrangement of the heat-absorbing component of the heat exchanger, which can be designed as a heat sink. Valves and distributors allow individual use of several heat-absorbing components of the heat exchanger, which can be partially taken out of operation or, depending on the design, can even be replaced during operation.

In further embodiments, the valves and/or the distributor are arranged within the receiving device, but outside an area for receiving the electrical and/or electronic module. The hoses can be firmly welded into the heat-absorbing component. The heat exchanger can comprise a compressor and/or a throttle (also: de-compressor) for

Change in the system pressure of the cooling medium.

Optionally, a first and a second electrical and/or electronic

Module can be accommodated in the receiving device, wherein the first and the second electrical and/or electronic module can be assigned a first and a second heat-absorbing component of the heat exchanger. The

System pressure in the first and second heat absorbing components of the

Heat exchangers can be adjusted differently using valves.

The operational reliability of the device can thus be advantageously increased by the various

areas, especially if they are designed to be liquid-tight against each other.

Welding the hoses also increases the operational reliability of the

Device. The compressor and/or de-compressor to change the

System pressure of the cooling medium can have one inlet and one outlet or several inlets and several outlets, whereby in the latter case individual heat-absorbing components of the heat exchanger or groups of heat-absorbing components of the heat exchanger can be supplied separately from each other. Alternatively, this effect can be achieved with valves at the outlet or inlet of the compressor/decompressor.

In embodiments, a system for heat exchange may be designed.

The system comprises an electrical and/or electronic module and a

Device for heat exchange.

The system can advantageously ensure operation with power electronics that need to be cooled by avoiding overheating due to waste heat.

The system can, for example, be designed as a charging station for electrically powered vehicles.

The invention is explained in more detail below with reference to the accompanying drawings using preferred embodiments which can optionally be combined with one another.

Show it:

Fig. 1 is a schematic block diagram of a heat exchanger in a first embodiment,

Fig. 2 is a schematic block diagram of an electrical and/or electronic module with power components,

Fig. 3 is a schematic block diagram of an electrical and/or electronic module with a heat-conducting outer surface,

Fig. 4a is a schematic block diagram of a first embodiment of a heat-absorbing component of the heat exchanger in a first

Perspective,

Fig. 4b is a schematic block diagram of a first embodiment of a heat-absorbing component of the heat exchanger in a second

Perspective,

Fig. 5 is a schematic block diagram of a second embodiment of a heat-absorbing component of the heat exchanger,

Fig.6 is a schematic block diagram of a heat exchange device in a second embodiment,

Fig. 7 is a schematic block diagram of a heat exchanger in a third embodiment,

Fig.8 is a schematic block diagram of a heat exchange system,

Fig. 9 is a schematic block diagram of a heat absorbing

Component of the heat exchanger, and

Fig. 10 is a schematic block diagram of a charging station.

Fig. 1 shows a schematic block diagram of a device, generally designated by reference numeral 100, for heat exchange in a first

Embodiment. It comprises a heat exchanger 200 which is designed to

Heat from at least one electrical and/or electronic module 350. It further comprises a receiving device 300 for receiving at least one electrical and/or electronic module 350. The heat-absorbing component 220 of the heat exchanger 200 occupies a first volume 222 in a first state, and the heat-absorbing

Component of the heat exchanger occupies a second volume 224 in a second state, wherein the second volume is larger than the first volume.

In the second state, the at least one heat-absorbing component 220 of the heat exchanger 200 has a thermal contact 226 to a surface of the at least one absorbable electrical and/or electronic module 350 for dissipating heat.

The heat absorbing component 220 of the heat exchanger 200 in the

Receiving device 300 is above and/or below (not shown) the

Receptacle of the electrical and/or electronic module (350). It is preferably mounted, wherein in the first state of the component 220 of the

Heat exchanger 200, removal or addition of the at least one electrical or electronic module into the receptacle of the receiving device 300 is possible.

Fig. 2 shows a schematic block diagram of an electrical and/or electronic module 350 with power components 360. The at least one accommodateable electrical or electronic module 350 comprises the power components 360 to be cooled. A thermal contact can be established between the power component 360 to be cooled and the heat-absorbing component 220 of the heat exchanger 200 (shown in Fig. 1, not in Fig. 2). The thermal contact can be designed as a pressure contact.

Fig. 3 shows a schematic block diagram of an electrical and/or electronic module 350 with a heat-conducting outer surface 370. The at least one accommodateable electrical or electronic module 350 comprises the heat-conducting outer surface 370 to be cooled. Thermal contact can be established between the heat-conducting outer surface 370 to be cooled and the heat-absorbing component 220 (not shown) of the heat exchanger 200. The thermal contact can be designed as a pressure contact. Optionally, the heat-conducting outer surface 370 can be designed as an aluminum sheet, preferably as a rolled aluminum sheet.

The heat absorbing component 220 of the heat exchanger 200 (shown in Fig. 1, not in Fig. 3) in the first state absorbs a first system pressure in

Heat exchanger 200. The heat absorbing component 220 of the

Heat exchanger 200 assumes in the second state a second system pressure in

Heat exchanger 200, wherein the second system pressure is higher or greater than the first system pressure. The expansion of a surface 230 of the heat-absorbing component 220 of the heat exchanger 200 (not shown) varies depending on the system pressure. Optionally, the heat-absorbing

Component 220 of heat exchanger 200 has a pillow shape (see Fig. 1).

The surface 230 (see Fig. 1) of the heat-absorbing component 220 of the

Heat exchanger 200 has at least one of the properties densely

Coolant or refrigerant liquid, tear-resistant, puncture-resistant, temperature-resistant from -40°C to +100°C, durable and electrically insulating. The surface 230 of the component 220 of the heat exchanger retains its basic geometric shape in the first volume and the second volume.

Fig. 4a teaches a schematic block diagram of a first embodiment of a heat-absorbing component 220 of the heat exchanger 200 in a first

Perspective, the top view. The heat-absorbing component 220 of the

Heat exchanger 200 has a plate-shaped spatial extension. Furthermore, the heat-absorbing component 220 of the heat exchanger 200 has a central solid body 240 and a shell 245 surrounding the surface 230.

The central solid body 240 fills the shell 245 in the longitudinal and transverse directions.

Optionally, the central solid body 240 is designed as a sheet metal with recesses or as a thin plastic body with recesses.

Fig. 4b teaches a schematic block diagram of a first embodiment of a heat-absorbing component 220 of the heat exchanger 200 in a second

Perspective, the front view. In particular, the flat design (plate-shaped) of the central solid body 240 is shown. In addition to Fig. 4a, the inlet point 236 and the outlet point 238 of the liquid of the heat-absorbing component 220 of the heat exchanger are shown.

Fig. 5 shows a schematic block diagram of a second embodiment of a heat-absorbing component 220 of the heat exchanger 200. The shell 245 of the heat-absorbing component 220 of the heat exchanger 200 is positioned with its top and bottom in the first state 246 closer to the central solid body 240. The shell 245 is positioned with its top and bottom in the second state 247 further away from the central solid body 240. In addition, the

Entry point 236 and exit point 238 of the liquid of the heat-absorbing

Component 220 of heat exchanger 200 is shown.

Fig. 6 teaches a schematic block diagram of an apparatus 100 for

Heat exchange in a second embodiment. In the

Receiving device 300, the vertical distance between the receptacles for an electrical and/or electronic module 350 of a 19-inch rack height unit h, in particular h=4.445 cm. The sum of the heights of the electrical and/or electronic module 350 that can be accommodated and the heat-absorbing

Component 220 of the heat exchanger 200 corresponds to the vertical single or multiple distance (not shown) of the mounts of the 19 inch rack

height units.

Fig. 7 teaches a schematic block diagram of an apparatus 100 for

Heat exchange in a third embodiment. The heat-absorbing

Component 220 of heat exchanger 200 comprises a cooling medium flowing through to dissipate heat, wherein the cooling medium enters the heat-absorbing component 220 at an inlet point 236, wherein the cooling medium is guided through the heat-absorbing component 220 in a meandering manner (not shown), and wherein the cooling medium exits the heat-absorbing component 220 at an outlet point 238. Optionally, the cooling medium consists of water or a water-based solution.

The cooling medium can be designed as a coolant or as a cooling liquid. When designed as a cooling liquid, the cooling liquid evaporates during

Cooling process includes. The heat exchanger 200 comprises a heat-emitting

Component 250 for cooling the cooling medium.

The cooling medium for entering the inlet point 236 of the heat-absorbing

Component 220 is provided by heat dissipating component 250.

The cooling medium is absorbed by the heat-emitting component 250 after exiting the exit point 238 of the heat-absorbing component 220. Optionally, the cooling medium is passed between the heat-absorbing component 220 and the heat-emitting component 250 through hoses, valves and/or distributors (not shown).

The valves and/or the manifold may be arranged within the housing 300, but outside an area for receiving the electrical and/or electronic module 350. The hoses in the heat-absorbing

Component 220 are welded in place. The heat exchanger 200 comprises a

Compressor/De-compressor 270 for changing the system pressure of the

Cooling medium. Optionally, a first and a second electrical and/or electronic module 350 (not shown) can be accommodated in the receiving device 300, wherein the first and the second electrical and/or electronic module 350 are provided with a first and a second heat-absorbing

Component 220 (not shown) of the heat exchanger 200. The

System pressure in the first and second heat-absorbing components 220 of the heat exchanger 200 can be adjusted differently from each other by valves (not shown).

Fig. 8 shows a schematic block diagram of a heat exchange system 400. The heat exchange system 400 comprises an electrical and/or electronic module 350 and a heat exchange device 100.

In other words, the invention can be described as follows.

Based on the described prior art, the technical

Effect of simplifying the mechanical contact, reducing the

Weight and material costs as well as simplification of handling are achieved.

At least some embodiments of the device 100 can, as shown in Fig. 9, use a cushion made of soft material as the heat-absorbing

Component 220 of the heat exchanger 200, which is

coolant flows through it, expands due to the pressure of the coolant and adapts to the contours of the surfaces to be cooled. The

Hose connections 236, 238 of the hoses 380 are preferably welded in place.

The deformable heat sink, i.e. the heat-absorbing component 220 of the

Heat exchanger 200, can also be referred to as a cooling bag or in foreign language as a "cool bag".

The heat-absorbing component 220 can, in the second state, be protected against a

Surface of a power module 360 (not shown) and this

Cooling power module 360.

The material specification of the Cool-Bag includes, for example, the following

Properties: Waterproofness, tear resistance, puncture resistance, flexibility with given dimensional stability, temperature resistance for a temperature range up to +100°C, durability and electrical insulation strength.

The following explanation and the example are based on a

Charging station for electrically powered vehicles.

Fig. 10 shows a schematic structure of a charging station 500. The

Power modules 350 (electrical and/or electronic modules) are available in 19 inch

Housings 300 (receiving device for receiving at least one electrical and/or electronic module) stacked on top of each other in a rack (not shown).

Each 350 power unit has a full X*19 inch height in the front panel, but the

The height of the housing is slightly smaller to accommodate a Cool-Bag 220. The Cool-Bags are pre-mounted in a 19-inch rack with brackets (not shown). This can be done, for example, under the rails (not shown). The 19-inch 350 slots are placed in between.

The hoses 380, distributor 385, air-water heat exchanger 386 and the circulation pump 387 are also shown.

The main advantages are as follows: - When the circulation pump 387 is switched off and therefore does not build up pressure, the power modules 350 can be fitted or removed between the Cool-Bags 220. The cooling circuit remains unaffected. This

There is no loss of coolant from the circuit during the entire work process. This means that there is no risk of open liquid in the electronics room. There are also no air pockets in the system. - No valves or plug-in components in the electronics room. The

Connection lines 380 are only connected in the heat exchanger area (heat-emitting

Component 250) connected to the distributor 385 at low cost. No

Risk of leakage. Minimum number of connection points and/or

Sealing levels in the system. - The surfaces for heat exchange are compared to the established

concept by factors larger. For example, the width is approximately 44cm (at 19 inches) multiplied by the depth of the case - The Cool-Bag can compensate for mechanical unevenness.

Example housing surfaces 360, 370 made of rolled aluminum sheet can be used. Or slightly protruding parts or countersunk screws can be bridged.

- No conductive connection between the coolant and the

Power Electronics 360. - Enables a mix of standardized 19-inch rack system (as

Example of the holding device 300) and a powerful cooling medium, which can also be designed as water cooling.

Although the invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted. Furthermore, many modifications may be made to adapt a particular measurement situation or material to the teachings of the invention. Consequently, the invention is not limited to the disclosed embodiments, but includes all embodiments that fall within the scope of the appended claims.

Reference numeral 100 Device for heat exchange 200 Heat exchanger 220 Heat-absorbing component of the heat exchanger, for example molded heat sink 222 First volume of the heat-absorbing component of the heat exchanger 224 Second volume of the heat-absorbing component of the

Heat exchanger 226 Thermal contact 230 Surface of the heat-absorbing component of the heat exchanger 236 Entry point of a cooling medium into the heat-absorbing component of the

Heat exchanger 238 Outlet point of the cooling medium from the heat-absorbing component of the heat exchanger 240 Central solid body of the heat-absorbing component of the

Heat exchanger, for example internal support structure 245 Shell of the heat-absorbing component of the heat exchanger, preferably convex shell encompassing the surface of the heat-absorbing component 246 Shell closer to the central solid body 247 Shell further away from the central solid body 250 Heat-emitting component of the heat exchanger 2/0 Compressor or throttle (de-compressor) of the heat exchanger 300 Receiving device for receiving at least one electrical and/or electronic module 350 Electrical and/or electronic module

360 Components or assemblies, such as power components, of the electrical and/or electronic module

370 Thermally conductive outer surface of the electrical and/or electronic module 380 Hose

385 Distributor 386 Air-water heat exchanger 387 Circulation pump 400 Heat exchange system 500 Charging station

Claims (16)

Expectations 1. Device (100) for heat exchange comprising: a heat exchanger (200) which is designed to dissipate heat from at least one electrical and/or electronic module (350), a receiving device (300) with at least one receptacle which is designed to receive the at least one electrical and/or electronic module (350), wherein at least one heat-absorbing component (220) of the heat exchanger (200) takes up a first volume (222) in a first state (246), and wherein the heat-absorbing component (220) of the heat exchanger (200) takes up a second volume (224) in a second state (247), wherein the second volume (224) is larger than the first volume (222), and wherein the at least one heat-absorbing component (220) of the heat exchanger (200) in the second state (247) is arranged to make thermal contact (226) with a surface of the at least one receivable electrical and/or electronic module (350) for dissipating the heat. 2. Device (100) for heat exchange according to claim 1, wherein the heat-absorbing component (220) of the heat exchanger (200) is arranged, preferably mounted, in the receiving device (300) above and/or below the at least one receptacle of the electrical and/or electronic module (350), and/or wherein the heat-absorbing component (220) of the heat exchanger (200) in the second state (247) engages in the at least one receiving device (300) to establish the thermal contact (226) and/or wherein the heat-absorbing component (220) of the heat exchanger (200) in the first state (246) releases the at least one receiving device (300) for removing or adding the at least one electrical or electronic module in the receiving device (300). 3. Device (100) for heat exchange according to claim 1 or 2, wherein the at least one accommodateable electrical or electronic module (350) comprises components or assemblies to be cooled, optionally power components (360), and wherein the thermal contact (226) comprises a direct thermal contact with the surface of the components or assemblies to be cooled, optionally the power components (360), and/or the thermal contact is a pressure contact. 4. Device (100) for heat exchange according to one of claims 1 to 3, wherein the thermal contact (226) comprises a thermal contact with a heat-conducting outer surface (370) of the electrical and/or electronic module (300), wherein the thermal contact (226) can be designed as a pressure contact, optionally wherein the heat-conducting outer surface can be designed as an aluminum sheet, preferably as a rolled aluminum sheet. 5. Device (100) for heat exchange according to one of claims 1 to 4, wherein the heat-absorbing component (220) of the heat exchanger (200) assumes the first state (246) at a first system pressure in the heat exchanger (200), and wherein the heat-absorbing component (220) of the heat exchanger (200) assumes the second state (247) at a second system pressure in the heat exchanger (200), wherein the second system pressure is greater than the first system pressure, wherein an extension of a surface (230) of the heat-absorbing component (220) of the heat exchanger (200) varies depending on the system pressure, optionally wherein the heat-absorbing component (220) of the heat exchanger (200) has a pillow shape. 6. Device (100) for heat exchange according to one of claims 1 to 5, wherein the surface (230) has at least one of the following properties: - elastic; - fluid-tight with respect to a cooling medium, optionally a coolant or refrigerant; - tear-resistant and/or puncture-resistant; - having a plasticizer to prevent embrittlement; - temperature-resistant from -40°C to +100°C; and - electrically insulating. 7. Device (100) for heat exchange according to one of claims 1 to 6, wherein the surface (230) of the heat-absorbing component (220) of the heat exchanger (200) retains its basic geometric shape in the first volume (222) and the second volume (224). 8. Device (100) for heat exchange according to one of claims 1 to 7, wherein the heat-absorbing component (220) of the heat exchanger (200) has a plate-shaped spatial extension, and/or wherein the heat-absorbing component (220) of the heat exchanger (200) has a central solid body (240) and a casing (245) comprising the surface (230), wherein the central solid body (240) extends in the casing (245) in the longitudinal and transverse directions or, in the first state (246), fills the casing (245) in the longitudinal and transverse directions, optionally wherein the central solid body (240) is or comprises a sheet metal with through-holes or a plastic body with through-holes. 9. The heat exchanging device (100) of claim 8, wherein the shell (245) of the heat-absorbing component (220) of the heat exchanger (200) is positioned with its top and bottom closer to the central solid body (240) in the first state (246), and wherein the shell (245) is positioned with its top and bottom further away from the central solid body (240) in the second state (247). 10. Device (100) for heat exchange according to one of claims 1 to 9, wherein in the receiving device (300) an optionally vertical distance between the receptacles for receiving an electrical and/or electronic module (350) corresponds to a rack height unit h, optionally h=4.445 cm, and wherein the sum of the heights of the electrical and/or electronic module (350) that can be received and the heat-absorbing component (220) of the heat exchanger (220) corresponds to one or more times the rack height units. 11. Device (100) for heat exchange according to one of claims 1 to 10, wherein the heat-absorbing component (220) of the heat exchanger (200) comprises a cooling medium that dissipates the heat and flows through the heat-absorbing component (220), optionally wherein the cooling medium enters the heat-absorbing component (220) at an inlet point (236), the cooling medium is guided in a meandering manner through the heat-absorbing component (220), and the cooling medium exits the heat-absorbing component (220) at an outlet point (238), and/or wherein the cooling medium is a coolant, optionally a cooling liquid, or a refrigerant and/or wherein the cooling medium is water, a water-based solution, ethanol, an ethanol-based solution or an oil. 12. The device (100) for heat exchange according to claim 11, wherein the cooling medium comprises a refrigerant, and wherein the device (100) further comprises a heat-emitting component (250) of the heat exchanger (200) outside the receiving device (300) which is designed to compress and condense the refrigerant, and wherein the heat-absorbing component (220) of the heat exchanger (200) comprises a throttle which is designed to expand and evaporate the refrigerant when absorbing the dissipated heat. 13. Device (100) for heat exchange according to one of claims 1 to 12, wherein the heat exchanger (200) comprises a heat-emitting component (250) for cooling one or the cooling medium, optionally wherein the heat-emitting component (250) is arranged outside the receiving device (300), wherein the heat-emitting component (250) is in fluid communication with the heat-absorbing component (220) for the entry of the cooling medium into the entry point (236) on the heat-absorbing component (220), and wherein the heat-absorbing component (220) is further in fluid communication with the heat-emitting component (250) for the exit of the cooling medium from the exit point (238) of the heat-absorbing component (220), optionally wherein the device (100) further comprises hoses, valves and/or distributors of the heat exchanger (200), which is designed to or are to convey the cooling medium between the heat-absorbing component (220) and the heat-emitting component (250). 14. Device (100) for heat exchange according to claim 13, wherein the valves and/or the distributor are arranged within the receiving device (300) and outside an area for receiving the electrical and/or electronic module (350), and/or wherein the hoses are firmly welded into the heat-absorbing component (220), and/or wherein the heat exchanger (200) comprises a compressor (270) and/or a throttle for changing the system pressure of the cooling medium. 15. Device (100) for heat exchange according to one of claims 1 to 14, wherein a first and a second electrical and/or electronic module (350) are accommodated or can be accommodated in the receiving device (300), wherein the first and the second electrical and/or electronic module (350) are each assigned a first and a second heat-absorbing component (220) of the heat exchanger (200) for dissipating the heat, wherein the system pressure in the first and second heat-absorbing components (220) of the heat exchanger (200) can be adjusted differently from one another by valves. 16. A system for heat exchange (400), comprising: at least one electrical and/or electronic module (350); and a device (100) for heat exchange according to one of claims 1 to 15.