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AUPS297902A0 - A method of producing a lamp - Google Patents

A method of producing a lamp

Info

Publication number
AUPS297902A0
AUPS297902A0 AUPS2979A AUPS297902A AUPS297902A0 AU PS297902 A0 AUPS297902 A0 AU PS297902A0 AU PS2979 A AUPS2979 A AU PS2979A AU PS297902 A AUPS297902 A AU PS297902A AU PS297902 A0 AUPS297902 A0 AU PS297902A0
Authority
AU
Australia
Prior art keywords
lamp
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AUPS2979A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lednium Technology Pty Ltd
Original Assignee
SYSTEMAX Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SYSTEMAX Pty Ltd filed Critical SYSTEMAX Pty Ltd
Priority to AUPS2979A priority Critical patent/AUPS297902A0/en
Publication of AUPS297902A0 publication Critical patent/AUPS297902A0/en
Assigned to LEDNIUM PTY LIMITED reassignment LEDNIUM PTY LIMITED Change of Name of Applicant under S 104 Assignors: SYSTEMAX PTY. LTD.
Priority to JP2004514135A priority patent/JP4620458B2/en
Priority to CNA2008100919133A priority patent/CN101320699A/en
Priority to EP08005654A priority patent/EP1939939A3/en
Priority to NZ531587A priority patent/NZ531587A/en
Priority to KR1020087013930A priority patent/KR20080064904A/en
Priority to AU2003233248A priority patent/AU2003233248B2/en
Priority to CA002488904A priority patent/CA2488904A1/en
Priority to US10/487,040 priority patent/US7704762B2/en
Priority to PCT/AU2003/000724 priority patent/WO2003107423A1/en
Priority to EP03727013A priority patent/EP1552560A4/en
Priority to CA002634288A priority patent/CA2634288A1/en
Priority to CN038138530A priority patent/CN1663044A/en
Priority to TW092115951A priority patent/TWI297219B/en
Priority to ZA200409679A priority patent/ZA200409679B/en
Priority to JP2008109234A priority patent/JP2008205501A/en
Priority to US12/722,487 priority patent/US20100163913A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
AUPS2979A 2002-06-14 2002-06-14 A method of producing a lamp Abandoned AUPS297902A0 (en)

Priority Applications (17)

Application Number Priority Date Filing Date Title
AUPS2979A AUPS297902A0 (en) 2002-06-14 2002-06-14 A method of producing a lamp
CA002634288A CA2634288A1 (en) 2002-06-14 2003-06-11 Led packaging method and packaged led
CN038138530A CN1663044A (en) 2002-06-14 2003-06-11 Lamp and method of producing a lamp
CA002488904A CA2488904A1 (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
EP03727013A EP1552560A4 (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
EP08005654A EP1939939A3 (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
NZ531587A NZ531587A (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
KR1020087013930A KR20080064904A (en) 2002-06-14 2003-06-11 An led packaging method and a packaged led
AU2003233248A AU2003233248B2 (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
JP2004514135A JP4620458B2 (en) 2002-06-14 2003-06-11 Lamp and method of manufacturing lamp
US10/487,040 US7704762B2 (en) 2002-06-14 2003-06-11 Lamp and method of producing a lamp
PCT/AU2003/000724 WO2003107423A1 (en) 2002-06-14 2003-06-11 A lamp and method of producing a lamp
CNA2008100919133A CN101320699A (en) 2002-06-14 2003-06-11 LED packaging method and packaged LED
TW092115951A TWI297219B (en) 2002-06-14 2003-06-12 A lamp and a method of producing a lamp
ZA200409679A ZA200409679B (en) 2002-06-14 2004-11-30 A lamp and method of producing a lamp
JP2008109234A JP2008205501A (en) 2002-06-14 2008-04-18 Method of packaging led, and packaged led
US12/722,487 US20100163913A1 (en) 2002-06-14 2010-03-11 Lamp and method of producing a lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AUPS2979A AUPS297902A0 (en) 2002-06-14 2002-06-14 A method of producing a lamp

Publications (1)

Publication Number Publication Date
AUPS297902A0 true AUPS297902A0 (en) 2002-07-04

Family

ID=3836540

Family Applications (1)

Application Number Title Priority Date Filing Date
AUPS2979A Abandoned AUPS297902A0 (en) 2002-06-14 2002-06-14 A method of producing a lamp

Country Status (3)

Country Link
CN (1) CN101320699A (en)
AU (1) AUPS297902A0 (en)
ZA (1) ZA200409679B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103094267B (en) * 2011-11-01 2018-05-25 日亚化学工业株式会社 Light-emitting device, ligthing paraphernalia
CN103162100A (en) * 2011-12-08 2013-06-19 苏州市世纪晶源电力科技有限公司 Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip
CN102595788B (en) * 2012-03-05 2015-02-04 蔡子丰 Manufacturing method of three-dimensional metal-based Printed Circuit Board (PCB) assembly structure in light-emitting
TWI601909B (en) * 2014-02-11 2017-10-11 晶元光電股份有限公司 Light-emitting device and method of making the same

Also Published As

Publication number Publication date
ZA200409679B (en) 2006-06-28
CN101320699A (en) 2008-12-10

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Legal Events

Date Code Title Description
TC Change of applicant's name (sec. 104)

Owner name: LEDNIUM PTY LIMITED

Free format text: FORMER NAME: SYSTEMAX PTY. LTD.