AU7672200A - Reinforcement of a chip card module - Google Patents

Reinforcement of a chip card module

Info

Publication number: AU7672200A
Authority: AU; Australia
Prior art keywords: reinforcement; chip card; card module; module; chip
Prior art date: 1999-10-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU76722/00A

Inventor

Henri Boccia

Philippe Patrice

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Gemplus SA

Original Assignee

Gemplus Card International SA

Gemplus SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-10-14

Filing date

2000-10-04

Publication date

2001-04-23

2000-10-04 Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA

2001-04-23 Publication of AU7672200A publication Critical patent/AU7672200A/en

Status Abandoned legal-status Critical Current

Classifications

- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Theoretical Computer Science (AREA)
Credit Cards Or The Like (AREA)

AU76722/00A 1999-10-14 2000-10-04 Reinforcement of a chip card module Abandoned AU7672200A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
FR9913057A FR2799857A1 (en)	1999-10-14	1999-10-14	METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE
FR9913057		1999-10-14
PCT/FR2000/002748 WO2001027872A1 (en)	1999-10-14	2000-10-04	Reinforcement of a chip card module

Publications (1)

Publication Number	Publication Date
AU7672200A true AU7672200A (en)	2001-04-23

Family

ID=9551120

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU76722/00A Abandoned AU7672200A (en)	1999-10-14	2000-10-04	Reinforcement of a chip card module

Country Status (3)

Country	Link
AU (1)	AU7672200A (en)
FR (1)	FR2799857A1 (en)
WO (1)	WO2001027872A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10200382B4 (en) *	2002-01-08	2006-05-04	Infineon Technologies Ag	Chip module for chip cards
DE10208172B4 (en) *	2002-02-26	2005-07-07	Infineon Technologies Ag	Intermediate carrier for insertion into a carrier and carrier with an intermediate carrier
JP2005122678A (en) *	2003-09-26	2005-05-12	Toshiba Corp	Portable electronic device
DE102006060411B3 (en)	2006-12-20	2008-07-10	Infineon Technologies Ag	Chip module and method for producing a chip module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2580416B1 (en) *	1985-04-12	1987-06-05	Radiotechnique Compelec	METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD
DE3639630A1 (en) *	1986-11-20	1988-06-01	Gao Ges Automation Org	DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
DE3924439A1 (en) *	1989-07-24	1991-04-18	Edgar Schneider	CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS
JPH04179595A (en) *	1990-11-14	1992-06-26	Dainippon Printing Co Ltd	Ic card and its manufacture
DE4427309C2 (en) *	1994-08-02	1999-12-02	Ibm	Production of a carrier element module for installation in chip cards or other data carrier cards
EP0766197A4 (en) *	1995-04-13	1999-12-29	Dainippon Printing Co Ltd	Ic card and ic module
JP3914620B2 (en) *	1997-10-16	2007-05-16	シチズン時計株式会社	IC card

1999
- 1999-10-14 FR FR9913057A patent/FR2799857A1/en active Pending
2000
- 2000-10-04 AU AU76722/00A patent/AU7672200A/en not_active Abandoned
- 2000-10-04 WO PCT/FR2000/002748 patent/WO2001027872A1/en active Search and Examination

Also Published As

Publication number	Publication date
FR2799857A1 (en)	2001-04-20
WO2001027872A1 (en)	2001-04-19

Publication	Publication Date	Title
AU1781801A (en)	2001-06-04	Wallet card package
AU4715601A (en)	2001-06-18	Chip card rebate system
AU7097500A (en)	2001-04-24	Configuration state memory for functional blocks on a reconfigurable chip
AU6321200A (en)	2001-03-13	Memory card
GB9928327D0 (en)	2000-01-26	A memory module system
AU1317601A (en)	2001-05-08	Module antenna device
AU6922598A (en)	1998-10-22	Electronic module for chip card
AU5139298A (en)	1998-08-03	Ic card
AU6705700A (en)	2001-02-13	Smart card architecture incorporating peripherals
AU4290899A (en)	2001-01-31	Composite ic card
AU5634100A (en)	2001-01-09	Software smart card
AU1907801A (en)	2001-06-04	A module cover element
AU5342698A (en)	1998-09-09	Ic card
AU2002333726A1 (en)	2003-06-05	Initialization of a chip card
AU4290799A (en)	2001-01-31	Composite ic card
AU7672200A (en)	2001-04-23	Reinforcement of a chip card module
AU2001285165A1 (en)	2002-03-13	Airbag module
AU3215100A (en)	2000-08-07	Integrated adaptor module
AU4974500A (en)	2000-11-10	Chip scale package
AU1051700A (en)	2000-06-19	Chip card loadable with compressed data
AU7968200A (en)	2001-04-30	Electronic name card
AU7770300A (en)	2001-03-26	Chip card and a method for producing a chip card
AU2414701A (en)	2001-06-25	A module including one or more chips
AU2001239167A1 (en)	2001-08-27	Chip card
AU1957701A (en)	2001-06-18	Chip card advertising

Legal Events

Date	Code	Title	Description
2001-09-13	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
2001-10-04	TH	Corrigenda	Free format text: IN VOL 15, NO 32, PAGE(S) 6822-6826 UNDER THE HEADING APPLICATIONS LAPSED, REFUSED OR WITHDRAWN PLEASE DELETE ALL REFERENCE TO APPLICATION NO. 59955/99, 44373/00, 74233/00, 75450/00, 75493/00, 76722/00, 76754/00, 77686/00, 77692/00, 77883/00, 77890/00, 77911/00, 77964/00, 77983/00, 78019/00, 78043/00, 78056/00, 78077/00, 78106/00, 78159/00, 78160/00, 78952/00, 79337/00, 79387/00 AND 79396/00
2002-06-13	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase