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AU5926396A - Rigid-flex printed circuit boards - Google Patents

Rigid-flex printed circuit boards

Info

Publication number
AU5926396A
AU5926396A AU59263/96A AU5926396A AU5926396A AU 5926396 A AU5926396 A AU 5926396A AU 59263/96 A AU59263/96 A AU 59263/96A AU 5926396 A AU5926396 A AU 5926396A AU 5926396 A AU5926396 A AU 5926396A
Authority
AU
Australia
Prior art keywords
rigid
printed circuit
circuit boards
flex printed
flex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU59263/96A
Inventor
Jeffrey Flammer
Richard Gerrie
Russel Griffith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynaco Corp
Original Assignee
Dynaco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynaco Corp filed Critical Dynaco Corp
Publication of AU5926396A publication Critical patent/AU5926396A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU59263/96A 1995-05-22 1996-05-22 Rigid-flex printed circuit boards Abandoned AU5926396A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44560295A 1995-05-22 1995-05-22
US445602 1995-05-22
PCT/US1996/007478 WO1996038026A1 (en) 1995-05-22 1996-05-22 Rigid-flex printed circuit boards

Publications (1)

Publication Number Publication Date
AU5926396A true AU5926396A (en) 1996-12-11

Family

ID=23769544

Family Applications (1)

Application Number Title Priority Date Filing Date
AU59263/96A Abandoned AU5926396A (en) 1995-05-22 1996-05-22 Rigid-flex printed circuit boards

Country Status (2)

Country Link
AU (1) AU5926396A (en)
WO (1) WO1996038026A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL343028A1 (en) * 1998-03-20 2001-07-30 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and aramid fibers
SG121839A1 (en) * 2003-12-08 2006-05-26 Gul Technologies Singapore Ltd Rigid-flex printed circuit boards
CN103281864B (en) * 2013-05-02 2016-03-23 深圳崇达多层线路板有限公司 A kind of static state is destroyed or force to yield the manufacture method of ladder wiring board
KR102442838B1 (en) * 2015-09-24 2022-09-15 주식회사 기가레인 Flexible printed circuit board having three dielectric substance layer and four ground layer
KR102432541B1 (en) * 2015-09-24 2022-08-17 주식회사 기가레인 Flexible printed circuit board having improved bending durabiliy and manufacturing method thereof
KR102497358B1 (en) * 2015-09-24 2023-02-10 주식회사 기가레인 Flexible printed circuit board having improved bending durabiliy
CN111970858B (en) * 2020-07-14 2022-04-15 深圳崇达多层线路板有限公司 High-offset rigid-flex PCB and manufacturing method thereof
CN114375105B (en) * 2021-12-16 2023-10-24 黄石西普电子科技有限公司 Suspended reverse-release manufacturing method for multilayer soft and hard combined HDl plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024896A (en) * 1989-07-06 1991-06-18 International Business Machines Corporation Collimated metal deposition
DE4108986A1 (en) * 1990-03-19 1991-09-26 Hitachi Ltd Mfg. interconnected stacked multilayer plates - comprises forming insulating layers between conducting boards and hardening lacquer filling
US5262594A (en) * 1990-10-12 1993-11-16 Compaq Computer Corporation Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
US5499444A (en) * 1994-08-02 1996-03-19 Coesen, Inc. Method of manufacturing a rigid flex printed circuit board

Also Published As

Publication number Publication date
WO1996038026A1 (en) 1996-11-28

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