AU2518399A - Method and device for treating tabular substrates, especially silicon wafers forproducing microelectronic elements - Google Patents
Method and device for treating tabular substrates, especially silicon wafers forproducing microelectronic elementsInfo
- Publication number
- AU2518399A AU2518399A AU25183/99A AU2518399A AU2518399A AU 2518399 A AU2518399 A AU 2518399A AU 25183/99 A AU25183/99 A AU 25183/99A AU 2518399 A AU2518399 A AU 2518399A AU 2518399 A AU2518399 A AU 2518399A
- Authority
- AU
- Australia
- Prior art keywords
- forproducing
- treating
- silicon wafers
- microelectronic elements
- especially silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004377 microelectronic Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP1999/000252 WO2000042637A1 (en) | 1999-01-18 | 1999-01-18 | Method and device for treating tabular substrates, especially silicon wafers for producing microelectronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2518399A true AU2518399A (en) | 2000-08-01 |
Family
ID=8167191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU25183/99A Abandoned AU2518399A (en) | 1999-01-18 | 1999-01-18 | Method and device for treating tabular substrates, especially silicon wafers forproducing microelectronic elements |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1153421A1 (en) |
| JP (1) | JP2002535831A (en) |
| KR (1) | KR20020018183A (en) |
| AU (1) | AU2518399A (en) |
| WO (1) | WO2000042637A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6516816B1 (en) | 1999-04-08 | 2003-02-11 | Applied Materials, Inc. | Spin-rinse-dryer |
| WO2003017337A1 (en) * | 2001-08-14 | 2003-02-27 | Applied Materials, Inc. | Shield for capturing fluids displaced from a substrate |
| JP4446875B2 (en) * | 2004-06-14 | 2010-04-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP6040092B2 (en) | 2013-04-23 | 2016-12-07 | 株式会社荏原製作所 | Substrate plating apparatus and substrate plating method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281031A (en) * | 1985-10-03 | 1987-04-14 | Sony Corp | Etching device |
| US4788994A (en) * | 1986-08-13 | 1988-12-06 | Dainippon Screen Mfg. Co. | Wafer holding mechanism |
| JPH02219213A (en) * | 1989-02-20 | 1990-08-31 | Fujitsu Ltd | Resist coating equipment |
| DE9218974U1 (en) * | 1992-02-11 | 1996-08-22 | FAIRCHILD CONVAC GmbH Geräte zur Halbleitertechnologie, 71665 Vaihingen | Device for applying and / or for partially removing a thin layer on or from a substrate |
| US5275690A (en) * | 1992-06-17 | 1994-01-04 | Santa Barbara Research Center | Method and apparatus for wet chemical processing of semiconductor wafers and other objects |
| US6239038B1 (en) * | 1995-10-13 | 2001-05-29 | Ziying Wen | Method for chemical processing semiconductor wafers |
-
1999
- 1999-01-18 EP EP99904791A patent/EP1153421A1/en not_active Withdrawn
- 1999-01-18 KR KR1020017008992A patent/KR20020018183A/en not_active Application Discontinuation
- 1999-01-18 WO PCT/EP1999/000252 patent/WO2000042637A1/en not_active Application Discontinuation
- 1999-01-18 JP JP2000594139A patent/JP2002535831A/en active Pending
- 1999-01-18 AU AU25183/99A patent/AU2518399A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020018183A (en) | 2002-03-07 |
| EP1153421A1 (en) | 2001-11-14 |
| JP2002535831A (en) | 2002-10-22 |
| WO2000042637A1 (en) | 2000-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |