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AU2103895A - Cavity filled metal electronic package - Google Patents

Cavity filled metal electronic package

Info

Publication number
AU2103895A
AU2103895A AU21038/95A AU2103895A AU2103895A AU 2103895 A AU2103895 A AU 2103895A AU 21038/95 A AU21038/95 A AU 21038/95A AU 2103895 A AU2103895 A AU 2103895A AU 2103895 A AU2103895 A AU 2103895A
Authority
AU
Australia
Prior art keywords
electronic package
cavity filled
filled metal
metal electronic
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU21038/95A
Inventor
Paul R. Hoffman
Dexin Liang
Deepak Mahulikar
Arvind Parthasarathi
Anthony M Pasqualoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of AU2103895A publication Critical patent/AU2103895A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU21038/95A 1994-04-05 1995-03-20 Cavity filled metal electronic package Abandoned AU2103895A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22320794A 1994-04-05 1994-04-05
US223207 1994-04-05
PCT/US1995/003468 WO1995027308A1 (en) 1994-04-05 1995-03-20 Cavity filled metal electronic package

Publications (1)

Publication Number Publication Date
AU2103895A true AU2103895A (en) 1995-10-23

Family

ID=22835525

Family Applications (1)

Application Number Title Priority Date Filing Date
AU21038/95A Abandoned AU2103895A (en) 1994-04-05 1995-03-20 Cavity filled metal electronic package

Country Status (5)

Country Link
EP (1) EP0754350A4 (en)
JP (1) JPH09511617A (en)
AU (1) AU2103895A (en)
TW (1) TW358238B (en)
WO (1) WO1995027308A1 (en)

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US6731001B2 (en) 2000-08-10 2004-05-04 Denso Corporation Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
US6782745B1 (en) * 2003-02-21 2004-08-31 Visteon Global Technologies, Inc. Slosh supressor and heat sink
US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
US9112422B1 (en) 2010-03-09 2015-08-18 Vlt, Inc. Fault tolerant power converter
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
US9402319B2 (en) 2011-05-11 2016-07-26 Vlt, Inc. Panel-molded electronic assemblies
CN104350814B (en) * 2012-06-15 2017-10-13 株式会社钟化 Heat-radiating structure, portable data assistance, the repair method of electronic equipment and electronic equipment
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9936580B1 (en) 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads
US10158357B1 (en) 2016-04-05 2018-12-18 Vlt, Inc. Method and apparatus for delivering power to semiconductors

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JPH09511617A (en) 1997-11-18
TW358238B (en) 1999-05-11
EP0754350A1 (en) 1997-01-22
EP0754350A4 (en) 1998-10-07
WO1995027308A1 (en) 1995-10-12

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