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AU2003303155A1 - Localized reflow for wire bonding and flip chip connections - Google Patents

Localized reflow for wire bonding and flip chip connections

Info

Publication number
AU2003303155A1
AU2003303155A1 AU2003303155A AU2003303155A AU2003303155A1 AU 2003303155 A1 AU2003303155 A1 AU 2003303155A1 AU 2003303155 A AU2003303155 A AU 2003303155A AU 2003303155 A AU2003303155 A AU 2003303155A AU 2003303155 A1 AU2003303155 A1 AU 2003303155A1
Authority
AU
Australia
Prior art keywords
wire bonding
flip chip
chip connections
reflow
localized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003303155A
Other versions
AU2003303155A8 (en
Inventor
Hui Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Inc
Original Assignee
ACM Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Inc filed Critical ACM Research Inc
Publication of AU2003303155A8 publication Critical patent/AU2003303155A8/en
Publication of AU2003303155A1 publication Critical patent/AU2003303155A1/en
Abandoned legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2003303155A 2002-12-18 2003-12-18 Localized reflow for wire bonding and flip chip connections Abandoned AU2003303155A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43447402P 2002-12-18 2002-12-18
US60/434,474 2002-12-18
PCT/US2003/040638 WO2004057648A2 (en) 2002-12-18 2003-12-18 Localized reflow for wire bonding and flip chip connections

Publications (2)

Publication Number Publication Date
AU2003303155A8 AU2003303155A8 (en) 2004-07-14
AU2003303155A1 true AU2003303155A1 (en) 2004-07-14

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AU2003303155A Abandoned AU2003303155A1 (en) 2002-12-18 2003-12-18 Localized reflow for wire bonding and flip chip connections

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AU (1) AU2003303155A1 (en)
TW (1) TW200421501A (en)
WO (1) WO2004057648A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3257072B1 (en) * 2015-09-09 2019-03-06 Goertek Inc Repairing method and manufacturing method of micro-led device
TWI698964B (en) * 2019-03-15 2020-07-11 台灣愛司帝科技股份有限公司 Chip fastening structure and chip fastening apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4926022A (en) * 1989-06-20 1990-05-15 Digital Equipment Corporation Laser reflow soldering process and bonded assembly formed thereby
US5946553A (en) * 1991-06-04 1999-08-31 Micron Technology, Inc. Process for manufacturing a semiconductor package with bi-substrate die
US5985693A (en) * 1994-09-30 1999-11-16 Elm Technology Corporation High density three-dimensional IC interconnection
US5731244A (en) * 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6082610A (en) * 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6258627B1 (en) * 1999-01-19 2001-07-10 International Business Machines Corporation Underfill preform interposer for joining chip to substrate
JP2001077524A (en) * 1999-09-03 2001-03-23 Fujitsu Ltd Method and device for reflow soldering
US6426241B1 (en) * 1999-11-12 2002-07-30 International Business Machines Corporation Method for forming three-dimensional circuitization and circuits formed
JP2002151534A (en) * 2000-11-08 2002-05-24 Mitsubishi Electric Corp Method for forming electrode and semiconductor device and substrate for use therein
US6458623B1 (en) * 2001-01-17 2002-10-01 International Business Machines Corporation Conductive adhesive interconnection with insulating polymer carrier

Also Published As

Publication number Publication date
TW200421501A (en) 2004-10-16
WO2004057648A3 (en) 2005-02-17
AU2003303155A8 (en) 2004-07-14
WO2004057648A2 (en) 2004-07-08

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