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AU2003242004A1 - Polishing material and method of polishing therewith - Google Patents

Polishing material and method of polishing therewith

Info

Publication number
AU2003242004A1
AU2003242004A1 AU2003242004A AU2003242004A AU2003242004A1 AU 2003242004 A1 AU2003242004 A1 AU 2003242004A1 AU 2003242004 A AU2003242004 A AU 2003242004A AU 2003242004 A AU2003242004 A AU 2003242004A AU 2003242004 A1 AU2003242004 A1 AU 2003242004A1
Authority
AU
Australia
Prior art keywords
polishing
therewith
polishing material
polishing therewith
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003242004A
Inventor
Kazuhisa Arai
Kazunori Ishikawa
Kazuya Miyazaki
Akio Tsumagari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of AU2003242004A1 publication Critical patent/AU2003242004A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C08G18/3893—Low-molecular-weight compounds having heteroatoms other than oxygen containing silicon
    • C08G18/3895—Inorganic compounds, e.g. aqueous alkalimetalsilicate solutions; Organic derivatives thereof containing no direct silicon-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4829—Polyethers containing at least three hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
AU2003242004A 2002-06-04 2003-05-30 Polishing material and method of polishing therewith Abandoned AU2003242004A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-162631 2002-06-04
JP2002162631 2002-06-04
PCT/JP2003/006858 WO2003101668A1 (en) 2002-06-04 2003-05-30 Polishing material and method of polishing therewith

Publications (1)

Publication Number Publication Date
AU2003242004A1 true AU2003242004A1 (en) 2003-12-19

Family

ID=29706609

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003242004A Abandoned AU2003242004A1 (en) 2002-06-04 2003-05-30 Polishing material and method of polishing therewith

Country Status (6)

Country Link
US (1) US20040209554A1 (en)
JP (1) JPWO2003101668A1 (en)
KR (1) KR20050005392A (en)
AU (1) AU2003242004A1 (en)
DE (1) DE10392153T5 (en)
WO (1) WO2003101668A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
US20060046627A1 (en) * 2004-08-25 2006-03-02 Peter Renteln Method of improving planarization of urethane polishing pads, and urethane polishing pad produced by the same
KR20070057157A (en) * 2004-08-25 2007-06-04 제이.에이치.로데스 컴퍼니, 인코퍼레이티드 How to Improve Polishing Pads and Pad Removal Speed and Flattening
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
JP4729896B2 (en) * 2004-09-17 2011-07-20 ソニー株式会社 Semiconductor thin film surface treatment method
US7255631B2 (en) * 2005-03-02 2007-08-14 Extrude Hone Corporation Orbital polishing apparatus and method
TW200717635A (en) * 2005-09-06 2007-05-01 Komatsu Denshi Kinzoku Kk Polishing method for semiconductor wafer
JP4853042B2 (en) 2006-02-17 2012-01-11 株式会社Ｓｕｍｃｏ Wafer and manufacturing method thereof
US8523968B2 (en) * 2008-12-23 2013-09-03 Saint-Gobain Abrasives, Inc. Abrasive article with improved packing density and mechanical properties and method of making
IL196146A (en) 2008-12-23 2014-01-30 Elta Systems Ltd System and method of transmitting a signal back towards a transmitting source
JP5393434B2 (en) * 2008-12-26 2014-01-22 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
JP5024305B2 (en) * 2009-02-04 2012-09-12 住友電気工業株式会社 Polishing method of GaN substrate
KR101255523B1 (en) * 2011-04-08 2013-04-23 노태욱 Urethane form polishing pad and method of manufacturing the same
BR102012032157A2 (en) * 2012-12-17 2015-07-07 Ct De Tecnologia Mineral Cetem Process for obtaining composite material consisting of polymers of plant origin, mineral filler and abrasive material and use of the composition obtained for polishing rocks
TW201507814A (en) * 2013-08-16 2015-03-01 San Fang Chemical Industry Co Methods for manufacturing polishing pad and polishing apparatus
JP6411759B2 (en) * 2014-03-27 2018-10-24 株式会社フジミインコーポレーテッド Polishing composition, method for using the same, and method for producing a substrate
CN106392911A (en) * 2016-12-14 2017-02-15 方彩燕 Composite grinding wheel
TWI639486B (en) * 2018-05-31 2018-11-01 國立清華大學 Omni-directional integrated conditioner device
US11177183B2 (en) * 2018-09-19 2021-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Thickness measurement system and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391210A (en) * 1993-12-16 1995-02-21 Minnesota Mining And Manufacturing Company Abrasive article
JP3305557B2 (en) * 1995-04-10 2002-07-22 大日本印刷株式会社 Polishing tape, method for producing the same, and coating agent for the polishing tape
JPH11347952A (en) * 1998-06-10 1999-12-21 Hitachi Chem Co Ltd Resin grinding wheel for grinding semi-conductor wafer, and its manufacture
JP4597395B2 (en) * 2001-02-07 2010-12-15 大日本印刷株式会社 Polishing film and method for producing the same
US6645263B2 (en) * 2001-05-22 2003-11-11 3M Innovative Properties Company Cellular abrasive article

Also Published As

Publication number Publication date
KR20050005392A (en) 2005-01-13
DE10392153T5 (en) 2004-08-19
US20040209554A1 (en) 2004-10-21
WO2003101668A1 (en) 2003-12-11
JPWO2003101668A1 (en) 2005-09-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase