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AU2002213323A1 - Composite adhesive - Google Patents

Composite adhesive

Info

Publication number
AU2002213323A1
AU2002213323A1 AU2002213323A AU1332302A AU2002213323A1 AU 2002213323 A1 AU2002213323 A1 AU 2002213323A1 AU 2002213323 A AU2002213323 A AU 2002213323A AU 1332302 A AU1332302 A AU 1332302A AU 2002213323 A1 AU2002213323 A1 AU 2002213323A1
Authority
AU
Australia
Prior art keywords
composite adhesive
composite
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002213323A
Inventor
Clarence A. Andersson
Philip J. Roach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Cubed Technologies Inc
Original Assignee
M Cubed Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Cubed Technologies Inc filed Critical M Cubed Technologies Inc
Publication of AU2002213323A1 publication Critical patent/AU2002213323A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/14Carbides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00Presence of polyamine or polyimide
    • C09J2479/08Presence of polyamine or polyimide polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU2002213323A 2000-10-18 2001-10-17 Composite adhesive Abandoned AU2002213323A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24144300P 2000-10-18 2000-10-18
US60241443 2000-10-18
PCT/US2001/032389 WO2002036707A1 (en) 2000-10-18 2001-10-17 Composite adhesive

Publications (1)

Publication Number Publication Date
AU2002213323A1 true AU2002213323A1 (en) 2002-05-15

Family

ID=22910720

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002213323A Abandoned AU2002213323A1 (en) 2000-10-18 2001-10-17 Composite adhesive

Country Status (5)

Country Link
US (2) US6841615B2 (en)
EP (1) EP1326938A1 (en)
JP (1) JP2004524383A (en)
AU (1) AU2002213323A1 (en)
WO (1) WO2002036707A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100487073B1 (en) * 2001-10-16 2005-05-03 가부시키가이샤 니프코 Glass holder and method of mounting the same
US7202154B2 (en) * 2004-01-05 2007-04-10 International Business Machines Corporation Suspension for filling via holes in silicon and method for making the same
US20060138279A1 (en) * 2004-12-23 2006-06-29 Nathan Pisarski Aircraft floor panel
US7335331B1 (en) 2005-03-01 2008-02-26 Husnay Dana M Method for making ceramic plates
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
DE102009054910A1 (en) * 2009-12-17 2011-06-22 Sgl Carbon Se, 65203 Fiber-reinforced body
US8663770B2 (en) 2011-04-28 2014-03-04 Zin Technologies, Inc. Bonded and stitched composite structure
US8850775B2 (en) * 2012-05-04 2014-10-07 Garland Industries, Inc. Non-welded coping caps and transitions
KR102235118B1 (en) * 2013-09-25 2021-04-01 린텍 가부시키가이샤 Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
US10570257B2 (en) 2015-11-16 2020-02-25 Applied Materials, Inc. Copolymerized high temperature bonding component
CN105907359A (en) * 2016-05-06 2016-08-31 金宝丽科技(苏州)有限公司 High-power LED (light emitting diode) package heat conduction glue and preparation technology thereof
TWI759506B (en) * 2017-08-14 2022-04-01 日商東洋油墨Sc控股股份有限公司 Composite member
US11767400B2 (en) * 2020-08-17 2023-09-26 Baker Hughes Oilfield Operations Llc Manufacture of degradable polycyanurate bulk molding compositions

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1584801A (en) * 1977-06-01 1981-02-18 Ciba Geigy Ag Reinforced composites
US4931496A (en) 1987-07-08 1990-06-05 Amoco Corporation Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition
JPH02175148A (en) 1988-12-27 1990-07-06 Sekisui Chem Co Ltd Long-sized composite molding
US5143785A (en) 1990-08-20 1992-09-01 Minnesota Mining And Manufacturing Company Cyanate ester adhesives for electronic applications
US5371178A (en) * 1990-10-24 1994-12-06 Johnson Matthey Inc. Rapidly curing adhesive and method
JP3231814B2 (en) 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー Anisotropic conductive film
US5744557A (en) 1993-06-16 1998-04-28 Minnesota Mining And Manufacturing Company Energy-curable cyanate/ethylenically unsaturated compositions
JPH07258542A (en) 1994-03-25 1995-10-09 Nippon Oil Co Ltd Resin composition for composite material, intermediate for composite material, and composite material
CA2188345C (en) 1995-10-27 2003-08-05 Brian M. Punsly Metal-filled, plateable structural adhesives for cyanate ester composites
US5955543A (en) * 1996-01-11 1999-09-21 International Business Machines Corporation Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin
US6056846A (en) 1996-07-25 2000-05-02 Mcdonnell Douglas Helicopter Co. Bonded composite structure and its fabrication
US5936025A (en) 1997-03-06 1999-08-10 The United States Of America As Represented By The Secretary Of The Navy Ceramic polymer composite dielectric material
JP3591758B2 (en) 1997-10-09 2004-11-24 住友ベークライト株式会社 Liquid injection sealing underfill material

Also Published As

Publication number Publication date
JP2004524383A (en) 2004-08-12
WO2002036707A1 (en) 2002-05-10
US20020132887A1 (en) 2002-09-19
US20050075438A1 (en) 2005-04-07
EP1326938A1 (en) 2003-07-16
US6841615B2 (en) 2005-01-11

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