AU2002213323A1 - Composite adhesive - Google Patents
Composite adhesiveInfo
- Publication number
- AU2002213323A1 AU2002213323A1 AU2002213323A AU1332302A AU2002213323A1 AU 2002213323 A1 AU2002213323 A1 AU 2002213323A1 AU 2002213323 A AU2002213323 A AU 2002213323A AU 1332302 A AU1332302 A AU 1332302A AU 2002213323 A1 AU2002213323 A1 AU 2002213323A1
- Authority
- AU
- Australia
- Prior art keywords
- composite adhesive
- composite
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24144300P | 2000-10-18 | 2000-10-18 | |
US60241443 | 2000-10-18 | ||
PCT/US2001/032389 WO2002036707A1 (en) | 2000-10-18 | 2001-10-17 | Composite adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002213323A1 true AU2002213323A1 (en) | 2002-05-15 |
Family
ID=22910720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002213323A Abandoned AU2002213323A1 (en) | 2000-10-18 | 2001-10-17 | Composite adhesive |
Country Status (5)
Country | Link |
---|---|
US (2) | US6841615B2 (en) |
EP (1) | EP1326938A1 (en) |
JP (1) | JP2004524383A (en) |
AU (1) | AU2002213323A1 (en) |
WO (1) | WO2002036707A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100487073B1 (en) * | 2001-10-16 | 2005-05-03 | 가부시키가이샤 니프코 | Glass holder and method of mounting the same |
US7202154B2 (en) * | 2004-01-05 | 2007-04-10 | International Business Machines Corporation | Suspension for filling via holes in silicon and method for making the same |
US20060138279A1 (en) * | 2004-12-23 | 2006-06-29 | Nathan Pisarski | Aircraft floor panel |
US7335331B1 (en) | 2005-03-01 | 2008-02-26 | Husnay Dana M | Method for making ceramic plates |
US9520314B2 (en) * | 2008-12-19 | 2016-12-13 | Applied Materials, Inc. | High temperature electrostatic chuck bonding adhesive |
DE102009054910A1 (en) * | 2009-12-17 | 2011-06-22 | Sgl Carbon Se, 65203 | Fiber-reinforced body |
US8663770B2 (en) | 2011-04-28 | 2014-03-04 | Zin Technologies, Inc. | Bonded and stitched composite structure |
US8850775B2 (en) * | 2012-05-04 | 2014-10-07 | Garland Industries, Inc. | Non-welded coping caps and transitions |
KR102235118B1 (en) * | 2013-09-25 | 2021-04-01 | 린텍 가부시키가이샤 | Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same |
US10570257B2 (en) | 2015-11-16 | 2020-02-25 | Applied Materials, Inc. | Copolymerized high temperature bonding component |
CN105907359A (en) * | 2016-05-06 | 2016-08-31 | 金宝丽科技(苏州)有限公司 | High-power LED (light emitting diode) package heat conduction glue and preparation technology thereof |
TWI759506B (en) * | 2017-08-14 | 2022-04-01 | 日商東洋油墨Sc控股股份有限公司 | Composite member |
US11767400B2 (en) * | 2020-08-17 | 2023-09-26 | Baker Hughes Oilfield Operations Llc | Manufacture of degradable polycyanurate bulk molding compositions |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1584801A (en) * | 1977-06-01 | 1981-02-18 | Ciba Geigy Ag | Reinforced composites |
US4931496A (en) | 1987-07-08 | 1990-06-05 | Amoco Corporation | Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition |
JPH02175148A (en) | 1988-12-27 | 1990-07-06 | Sekisui Chem Co Ltd | Long-sized composite molding |
US5143785A (en) | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
US5371178A (en) * | 1990-10-24 | 1994-12-06 | Johnson Matthey Inc. | Rapidly curing adhesive and method |
JP3231814B2 (en) | 1991-07-12 | 2001-11-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Anisotropic conductive film |
US5744557A (en) | 1993-06-16 | 1998-04-28 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
JPH07258542A (en) | 1994-03-25 | 1995-10-09 | Nippon Oil Co Ltd | Resin composition for composite material, intermediate for composite material, and composite material |
CA2188345C (en) | 1995-10-27 | 2003-08-05 | Brian M. Punsly | Metal-filled, plateable structural adhesives for cyanate ester composites |
US5955543A (en) * | 1996-01-11 | 1999-09-21 | International Business Machines Corporation | Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin |
US6056846A (en) | 1996-07-25 | 2000-05-02 | Mcdonnell Douglas Helicopter Co. | Bonded composite structure and its fabrication |
US5936025A (en) | 1997-03-06 | 1999-08-10 | The United States Of America As Represented By The Secretary Of The Navy | Ceramic polymer composite dielectric material |
JP3591758B2 (en) | 1997-10-09 | 2004-11-24 | 住友ベークライト株式会社 | Liquid injection sealing underfill material |
-
2001
- 2001-10-17 JP JP2002539455A patent/JP2004524383A/en active Pending
- 2001-10-17 US US09/978,827 patent/US6841615B2/en not_active Expired - Fee Related
- 2001-10-17 WO PCT/US2001/032389 patent/WO2002036707A1/en not_active Application Discontinuation
- 2001-10-17 US US10/399,541 patent/US20050075438A1/en not_active Abandoned
- 2001-10-17 EP EP01981693A patent/EP1326938A1/en not_active Withdrawn
- 2001-10-17 AU AU2002213323A patent/AU2002213323A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2004524383A (en) | 2004-08-12 |
WO2002036707A1 (en) | 2002-05-10 |
US20020132887A1 (en) | 2002-09-19 |
US20050075438A1 (en) | 2005-04-07 |
EP1326938A1 (en) | 2003-07-16 |
US6841615B2 (en) | 2005-01-11 |
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