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AU2002210859A1 - Control of laser machining - Google Patents

Control of laser machining

Info

Publication number
AU2002210859A1
AU2002210859A1 AU2002210859A AU1085902A AU2002210859A1 AU 2002210859 A1 AU2002210859 A1 AU 2002210859A1 AU 2002210859 A AU2002210859 A AU 2002210859A AU 1085902 A AU1085902 A AU 1085902A AU 2002210859 A1 AU2002210859 A1 AU 2002210859A1
Authority
AU
Australia
Prior art keywords
control
laser machining
increasing
trough
machined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002210859A
Inventor
Adrian Boyle
Kali Dunne
Maria Farsari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xsil Technology Ltd
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Publication of AU2002210859A1 publication Critical patent/AU2002210859A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
  • Dicing (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.
AU2002210859A 2000-10-26 2001-10-26 Control of laser machining Abandoned AU2002210859A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
IE20000865 2000-10-26
IE2000/0865 2000-10-26
IE20001022 2000-12-15
IE20001015 2000-12-15
IE2000/1015 2000-12-15
IE2000/1022 2000-12-15
PCT/IE2001/000136 WO2002034455A1 (en) 2000-10-26 2001-10-26 Control of laser machining

Publications (1)

Publication Number Publication Date
AU2002210859A1 true AU2002210859A1 (en) 2002-05-06

Family

ID=27270594

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002210859A Abandoned AU2002210859A1 (en) 2000-10-26 2001-10-26 Control of laser machining

Country Status (11)

Country Link
US (1) US6586707B2 (en)
EP (1) EP1328372B1 (en)
JP (1) JP2004512690A (en)
KR (1) KR100829876B1 (en)
CN (1) CN100400215C (en)
AT (1) ATE346715T1 (en)
AU (1) AU2002210859A1 (en)
DE (1) DE60124938T2 (en)
HK (1) HK1053999A1 (en)
IE (1) IES20010949A2 (en)
WO (1) WO2002034455A1 (en)

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JP6769146B2 (en) * 2016-07-13 2020-10-14 オムロン株式会社 Laser processing method and laser processing equipment
JP6955932B2 (en) * 2017-08-25 2021-10-27 株式会社ディスコ Laser beam profiler unit and laser processing equipment
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Also Published As

Publication number Publication date
IE20010950A1 (en) 2002-07-10
IES20010949A2 (en) 2002-07-10
DE60124938T2 (en) 2007-09-20
EP1328372B1 (en) 2006-11-29
WO2002034455A1 (en) 2002-05-02
CN1473088A (en) 2004-02-04
ATE346715T1 (en) 2006-12-15
KR20040005850A (en) 2004-01-16
HK1053999A1 (en) 2003-11-14
EP1328372A1 (en) 2003-07-23
CN100400215C (en) 2008-07-09
KR100829876B1 (en) 2008-05-16
JP2004512690A (en) 2004-04-22
US6586707B2 (en) 2003-07-01
DE60124938D1 (en) 2007-01-11
US20020088780A1 (en) 2002-07-11

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