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AU2002247599A1 - Bonder - Google Patents

Bonder

Info

Publication number
AU2002247599A1
AU2002247599A1 AU2002247599A AU2002247599A AU2002247599A1 AU 2002247599 A1 AU2002247599 A1 AU 2002247599A1 AU 2002247599 A AU2002247599 A AU 2002247599A AU 2002247599 A AU2002247599 A AU 2002247599A AU 2002247599 A1 AU2002247599 A1 AU 2002247599A1
Authority
AU
Australia
Prior art keywords
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002247599A
Inventor
Michael Geringer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2002247599A1 publication Critical patent/AU2002247599A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0056Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
AU2002247599A 2001-02-23 2002-02-19 Bonder Abandoned AU2002247599A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10109009.9 2001-02-23
DE10109009A DE10109009C2 (en) 2001-02-23 2001-02-23 Bonder
PCT/DE2002/000570 WO2002067647A2 (en) 2001-02-23 2002-02-19 Bonder

Publications (1)

Publication Number Publication Date
AU2002247599A1 true AU2002247599A1 (en) 2002-09-04

Family

ID=7675402

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002247599A Abandoned AU2002247599A1 (en) 2001-02-23 2002-02-19 Bonder

Country Status (3)

Country Link
AU (1) AU2002247599A1 (en)
DE (1) DE10109009C2 (en)
WO (1) WO2002067647A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004112100A1 (en) * 2003-06-02 2004-12-23 Amicra Microtechnologies Gmbh Bonding device and bonding method
DE102013104344B4 (en) * 2013-04-29 2015-07-09 Kilian Tableting Gmbh Device for inserting inserts in dies of a tablet press

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU548810B2 (en) * 1982-04-27 1986-01-02 Daiwa Can Company Limited Method and apparatus for handling metal containers
GB2250496B (en) * 1990-12-04 1994-07-27 Nitto Kogyo Kk Automatic chip separating and feeding apparatus
FR2670191B1 (en) * 1990-12-05 1996-05-03 Nitto Kogyo Kk AUTOMATIC APPARATUS FOR SEPARATING AND FEEDING CHIPS.
DE19510230C2 (en) * 1995-03-24 1999-08-05 Michael Geringer Transfer device for electrical components, in particular chips
DE19748442A1 (en) * 1997-11-03 1999-05-06 Georg Sillner Transporting and/or sorting device for small component

Also Published As

Publication number Publication date
DE10109009A1 (en) 2002-10-17
DE10109009C2 (en) 2003-12-18
WO2002067647A2 (en) 2002-08-29
WO2002067647A3 (en) 2002-12-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase