AU2002247599A1 - Bonder - Google Patents
BonderInfo
- Publication number
- AU2002247599A1 AU2002247599A1 AU2002247599A AU2002247599A AU2002247599A1 AU 2002247599 A1 AU2002247599 A1 AU 2002247599A1 AU 2002247599 A AU2002247599 A AU 2002247599A AU 2002247599 A AU2002247599 A AU 2002247599A AU 2002247599 A1 AU2002247599 A1 AU 2002247599A1
- Authority
- AU
- Australia
- Prior art keywords
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10109009.9 | 2001-02-23 | ||
DE10109009A DE10109009C2 (en) | 2001-02-23 | 2001-02-23 | Bonder |
PCT/DE2002/000570 WO2002067647A2 (en) | 2001-02-23 | 2002-02-19 | Bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002247599A1 true AU2002247599A1 (en) | 2002-09-04 |
Family
ID=7675402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002247599A Abandoned AU2002247599A1 (en) | 2001-02-23 | 2002-02-19 | Bonder |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002247599A1 (en) |
DE (1) | DE10109009C2 (en) |
WO (1) | WO2002067647A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004112100A1 (en) * | 2003-06-02 | 2004-12-23 | Amicra Microtechnologies Gmbh | Bonding device and bonding method |
DE102013104344B4 (en) * | 2013-04-29 | 2015-07-09 | Kilian Tableting Gmbh | Device for inserting inserts in dies of a tablet press |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU548810B2 (en) * | 1982-04-27 | 1986-01-02 | Daiwa Can Company Limited | Method and apparatus for handling metal containers |
GB2250496B (en) * | 1990-12-04 | 1994-07-27 | Nitto Kogyo Kk | Automatic chip separating and feeding apparatus |
FR2670191B1 (en) * | 1990-12-05 | 1996-05-03 | Nitto Kogyo Kk | AUTOMATIC APPARATUS FOR SEPARATING AND FEEDING CHIPS. |
DE19510230C2 (en) * | 1995-03-24 | 1999-08-05 | Michael Geringer | Transfer device for electrical components, in particular chips |
DE19748442A1 (en) * | 1997-11-03 | 1999-05-06 | Georg Sillner | Transporting and/or sorting device for small component |
-
2001
- 2001-02-23 DE DE10109009A patent/DE10109009C2/en not_active Expired - Fee Related
-
2002
- 2002-02-19 WO PCT/DE2002/000570 patent/WO2002067647A2/en not_active Application Discontinuation
- 2002-02-19 AU AU2002247599A patent/AU2002247599A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE10109009A1 (en) | 2002-10-17 |
DE10109009C2 (en) | 2003-12-18 |
WO2002067647A2 (en) | 2002-08-29 |
WO2002067647A3 (en) | 2002-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |