AU2001227663A1 - Dendritic material sacrificial layer micro-scale gap formation method - Google Patents
Dendritic material sacrificial layer micro-scale gap formation methodInfo
- Publication number
- AU2001227663A1 AU2001227663A1 AU2001227663A AU2766301A AU2001227663A1 AU 2001227663 A1 AU2001227663 A1 AU 2001227663A1 AU 2001227663 A AU2001227663 A AU 2001227663A AU 2766301 A AU2766301 A AU 2766301A AU 2001227663 A1 AU2001227663 A1 AU 2001227663A1
- Authority
- AU
- Australia
- Prior art keywords
- sacrificial layer
- formation method
- gap formation
- layer micro
- scale gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/0005—Anti-stiction coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00936—Releasing the movable structure without liquid etchant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0108—Sacrificial polymer, ashing of organics
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/483,153 US6248668B1 (en) | 2000-01-14 | 2000-01-14 | Dendritic material sacrificial layer micro-scale gap formation method |
US09483153 | 2000-01-14 | ||
PCT/US2001/000393 WO2001052308A1 (en) | 2000-01-14 | 2001-01-05 | Dendritic material sacrificial layer micro-scale gap formation method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001227663A1 true AU2001227663A1 (en) | 2001-07-24 |
Family
ID=23918877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001227663A Abandoned AU2001227663A1 (en) | 2000-01-14 | 2001-01-05 | Dendritic material sacrificial layer micro-scale gap formation method |
Country Status (3)
Country | Link |
---|---|
US (1) | US6248668B1 (en) |
AU (1) | AU2001227663A1 (en) |
WO (1) | WO2001052308A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3137112B2 (en) * | 1999-04-27 | 2001-02-19 | 日本電気株式会社 | Micromachine switch and method of manufacturing the same |
KR100837987B1 (en) * | 2000-06-21 | 2008-06-16 | 텍사스 인스트루먼츠 인코포레이티드 | Re-coating mems devices using dissolved resins |
US6649852B2 (en) * | 2001-08-14 | 2003-11-18 | Motorola, Inc. | Micro-electro mechanical system |
US6866764B2 (en) * | 2002-02-21 | 2005-03-15 | Michigan Molecular Institute | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings |
KR101832221B1 (en) * | 2013-09-25 | 2018-02-27 | 인텔 코포레이션 | Device, system and method for providing mems structures of a semiconductor package |
US9567213B1 (en) | 2015-08-17 | 2017-02-14 | Texas Instruments Incorporated | Hermetically-sealed MEMS device and its fabrication |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4371406A (en) * | 1965-09-28 | 1983-02-01 | Li Chou H | Solid-state device |
-
2000
- 2000-01-14 US US09/483,153 patent/US6248668B1/en not_active Expired - Fee Related
-
2001
- 2001-01-05 AU AU2001227663A patent/AU2001227663A1/en not_active Abandoned
- 2001-01-05 WO PCT/US2001/000393 patent/WO2001052308A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US6248668B1 (en) | 2001-06-19 |
WO2001052308A1 (en) | 2001-07-19 |
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