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AU2001227663A1 - Dendritic material sacrificial layer micro-scale gap formation method - Google Patents

Dendritic material sacrificial layer micro-scale gap formation method

Info

Publication number
AU2001227663A1
AU2001227663A1 AU2001227663A AU2766301A AU2001227663A1 AU 2001227663 A1 AU2001227663 A1 AU 2001227663A1 AU 2001227663 A AU2001227663 A AU 2001227663A AU 2766301 A AU2766301 A AU 2766301A AU 2001227663 A1 AU2001227663 A1 AU 2001227663A1
Authority
AU
Australia
Prior art keywords
sacrificial layer
formation method
gap formation
layer micro
scale gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001227663A
Inventor
David Beebe
Suh Hyuk-Jeen
Jeffrey S. Moore
Bharathi Pamidighantam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Illinois
Original Assignee
University of Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Illinois filed Critical University of Illinois
Publication of AU2001227663A1 publication Critical patent/AU2001227663A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005Anti-stiction coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936Releasing the movable structure without liquid etchant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102Surface micromachining
    • B81C2201/0105Sacrificial layer
    • B81C2201/0108Sacrificial polymer, ashing of organics

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
AU2001227663A 2000-01-14 2001-01-05 Dendritic material sacrificial layer micro-scale gap formation method Abandoned AU2001227663A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/483,153 US6248668B1 (en) 2000-01-14 2000-01-14 Dendritic material sacrificial layer micro-scale gap formation method
US09483153 2000-01-14
PCT/US2001/000393 WO2001052308A1 (en) 2000-01-14 2001-01-05 Dendritic material sacrificial layer micro-scale gap formation method

Publications (1)

Publication Number Publication Date
AU2001227663A1 true AU2001227663A1 (en) 2001-07-24

Family

ID=23918877

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001227663A Abandoned AU2001227663A1 (en) 2000-01-14 2001-01-05 Dendritic material sacrificial layer micro-scale gap formation method

Country Status (3)

Country Link
US (1) US6248668B1 (en)
AU (1) AU2001227663A1 (en)
WO (1) WO2001052308A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137112B2 (en) * 1999-04-27 2001-02-19 日本電気株式会社 Micromachine switch and method of manufacturing the same
KR100837987B1 (en) * 2000-06-21 2008-06-16 텍사스 인스트루먼츠 인코포레이티드 Re-coating mems devices using dissolved resins
US6649852B2 (en) * 2001-08-14 2003-11-18 Motorola, Inc. Micro-electro mechanical system
US6866764B2 (en) * 2002-02-21 2005-03-15 Michigan Molecular Institute Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings
KR101832221B1 (en) * 2013-09-25 2018-02-27 인텔 코포레이션 Device, system and method for providing mems structures of a semiconductor package
US9567213B1 (en) 2015-08-17 2017-02-14 Texas Instruments Incorporated Hermetically-sealed MEMS device and its fabrication

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371406A (en) * 1965-09-28 1983-02-01 Li Chou H Solid-state device

Also Published As

Publication number Publication date
US6248668B1 (en) 2001-06-19
WO2001052308A1 (en) 2001-07-19

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