AU2001265734A1 - Volume-modified casting compounds based on polymeric matrix resins - Google Patents
Volume-modified casting compounds based on polymeric matrix resinsInfo
- Publication number
- AU2001265734A1 AU2001265734A1 AU2001265734A AU6573401A AU2001265734A1 AU 2001265734 A1 AU2001265734 A1 AU 2001265734A1 AU 2001265734 A AU2001265734 A AU 2001265734A AU 6573401 A AU6573401 A AU 6573401A AU 2001265734 A1 AU2001265734 A1 AU 2001265734A1
- Authority
- AU
- Australia
- Prior art keywords
- epoxy resin
- react
- volume
- curing agent
- siloxane compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005266 casting Methods 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 abstract 8
- 229920000647 polyepoxide Polymers 0.000 abstract 8
- -1 polysiloxane Polymers 0.000 abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 4
- 239000002245 particle Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000010125 resin casting Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Materials For Medical Uses (AREA)
- Graft Or Block Polymers (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Abstract
A volume modified epoxy resin casting composition comprises a three-dimensional cross-linked polysiloxane in dispersed form having a particle size of 0.02-50 mu m that may react with the epoxy resin and/or the curing agent and a linear or branched siloxane compound having reactive groups that may react with the epoxy resin and/or hardener. A volume modified casting composition (I) based on a curable epoxy resin comprising an epoxy resin, curing agent, optionally an accelerator and other additives such as filler, flexibilizing agents and coloring agents is characterized in that the composition (I) comprises (A) a three-dimensional cross-linked polysiloxane in dispersed form having a particle size of 0.02-50 mu m that may react with the epoxy resin and/or the curing agent, (B) a linear or branched siloxane compound having reactive groups that may react with the epoxy resin and/or hardener and optionally (C) a low mol. wt. oligomeric siloxane compound. An Independent claim is included for a process for the production of the composition (I) such that at least a portion of the epoxy group containing components (A) and (B) are pre-mixed and pre-hardened or at least a portion of the hydroxyl, amine or carboxyl containing components (A) and (B) are pre-mixed with the epoxy resin and pre-hardened.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00810620 | 2000-07-14 | ||
EP00810620A EP1172408A1 (en) | 2000-07-14 | 2000-07-14 | Volume modified casting masses based on polymer matrix resins |
PCT/CH2001/000409 WO2002006398A1 (en) | 2000-07-14 | 2001-07-02 | Volume-modified casting compounds based on polymeric matrix resins |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001265734A1 true AU2001265734A1 (en) | 2002-01-30 |
Family
ID=8174806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001265734A Abandoned AU2001265734A1 (en) | 2000-07-14 | 2001-07-02 | Volume-modified casting compounds based on polymeric matrix resins |
Country Status (12)
Country | Link |
---|---|
US (1) | US7268181B2 (en) |
EP (2) | EP1172408A1 (en) |
JP (1) | JP2004504436A (en) |
KR (1) | KR100872758B1 (en) |
CN (1) | CN1229436C (en) |
AT (1) | ATE284432T1 (en) |
AU (1) | AU2001265734A1 (en) |
CA (1) | CA2416020C (en) |
DE (1) | DE50104771D1 (en) |
HU (1) | HUP0302907A3 (en) |
NO (1) | NO20030170L (en) |
WO (1) | WO2002006398A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1336642A1 (en) * | 2002-02-14 | 2003-08-20 | Abb Research Ltd. | Self-healing potting compositions for the production of electrical isolations |
JP2006034042A (en) * | 2004-07-20 | 2006-02-02 | Yaskawa Electric Corp | Thermosetting resin composite for vacuum and its production |
JP5179013B2 (en) * | 2005-03-01 | 2013-04-10 | 日東電工株式会社 | Epoxy resin composition for optical semiconductor element sealing and optical semiconductor device using the same |
JP4799883B2 (en) * | 2005-03-01 | 2011-10-26 | 日東電工株式会社 | Epoxy resin composition cured body, method for producing the same, and optical semiconductor device using the same |
DE102005017112A1 (en) * | 2005-04-13 | 2006-10-26 | Siemens Ag | Moisture-repellent protective layer for a winding head of an electrical machine |
JP5217119B2 (en) * | 2005-06-15 | 2013-06-19 | 日立化成株式会社 | Liquid epoxy resin composition for sealing, electronic component device and wafer level chip size package |
JP2007016094A (en) * | 2005-07-06 | 2007-01-25 | Yokohama Rubber Co Ltd:The | Epoxy resin composition |
DE102007038313A1 (en) * | 2007-08-14 | 2009-02-19 | Evonik Degussa Gmbh | Inorganically-modified polyester binder composition, process for its preparation and its use |
US8093782B1 (en) * | 2007-08-14 | 2012-01-10 | University Of Virginia Patent Foundation | Specialized, high performance, ultrasound transducer substrates and related method thereof |
EP2182527A1 (en) | 2008-10-31 | 2010-05-05 | ABB Research Ltd. | Insulating hollow body for a high voltage insulator |
CA2647967A1 (en) * | 2008-12-19 | 2010-06-19 | Shawcor Ltd. | Epoxy resin compositions and curing agents for thermally insulating ultra-deep sea equipment used for oil and gas production |
JP5185890B2 (en) * | 2009-06-17 | 2013-04-17 | 株式会社日立産機システム | Insulating casting resin for high-voltage electrical equipment and high-voltage electrical equipment using the same |
CN101633772B (en) * | 2009-08-21 | 2011-11-16 | 东莞市康德威变压器有限公司 | Process for epoxy resin composition for casting transformer |
CN101698741B (en) * | 2009-11-06 | 2011-07-06 | 镇江西门子母线有限公司 | Synthetic resin composite for pouring low-voltage bus bar |
KR101719146B1 (en) * | 2010-04-09 | 2017-03-24 | 한국생산기술연구원 | Compound for Hardmask and Composition for Hardmask Comprising the Same |
JP5723557B2 (en) * | 2010-09-09 | 2015-05-27 | ナミックス株式会社 | Epoxy resin composition |
KR101469265B1 (en) * | 2011-12-26 | 2014-12-04 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device, and semiconductor apparatus using the same |
CN102515626B (en) * | 2012-01-06 | 2013-05-29 | 桂林理工大学 | High heat-conductivity epoxy casting material for dry power transformer and preparation method thereof |
WO2013143097A1 (en) * | 2012-03-29 | 2013-10-03 | Dow Global Technologies Llc | Curable compositions |
JP6779476B2 (en) * | 2015-03-19 | 2020-11-04 | ナガセケムテックス株式会社 | Epoxy resin composition for outdoor electrical insulation and member for outdoor electrical insulation |
PL3274390T3 (en) * | 2015-03-26 | 2021-12-27 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
EP3460959A1 (en) * | 2017-09-20 | 2019-03-27 | Siemens Aktiengesellschaft | Electrical insulation material and/or impregnating resin for the roll tape insulation of a medium and/or high voltage machine and an isolation system made from same |
CN113773794A (en) * | 2021-08-27 | 2021-12-10 | 金冠电气股份有限公司 | High-barrier PBT-polysiloxane copolymer-based composite material for packaging lightning arrester |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3859314A (en) | 1967-06-29 | 1975-01-07 | Celanese Coatings Co | Process for preparing glycidyl esters of polycarboxylic acids |
US3892592A (en) * | 1968-01-31 | 1975-07-01 | Matsushita Electric Ind Co Ltd | Method of manufacturing electrodes for fuel cells |
US3843577A (en) | 1972-12-26 | 1974-10-22 | Dow Corning | Siloxane-modified epoxy resin compositions |
US4159367A (en) * | 1978-06-29 | 1979-06-26 | Yardney Electric Corporation | Hydrogen electrochemical cell and rechargeable metal-hydrogen battery |
IT1130955B (en) * | 1980-03-11 | 1986-06-18 | Oronzio De Nora Impianti | PROCEDURE FOR THE FORMATION OF ELECTROCES ON THE SURFACES OF SEMI-PERMEABLE MEMBRANES AND ELECTRODE-MEMBRANE SYSTEMS SO PRODUCED |
DE3126411A1 (en) | 1981-07-04 | 1983-01-13 | Degussa Ag, 6000 Frankfurt | METHOD FOR PRODUCING AROMATIC GLYCIDYL ESTERS |
US4587056A (en) * | 1984-04-26 | 1986-05-06 | Asahi Kasei Kogyo Kabushiki Kaisha | Process for producing an aliphatic isocyanate |
US4624998A (en) * | 1985-12-30 | 1986-11-25 | Dow Corning Corporation | Silicone-modified epoxy resins having improved impact resistance |
DE3634084A1 (en) * | 1986-10-07 | 1988-04-21 | Hanse Chemie Gmbh | MODIFIED REACTION RESIN, METHOD FOR PRODUCING IT AND ITS USE |
JPH07733B2 (en) * | 1986-11-13 | 1995-01-11 | サンスタ−技研株式会社 | Epoxy resin composition |
DE3738634C2 (en) * | 1986-11-13 | 1996-11-14 | Sunstar Engineering Inc | Epoxy resin composition with silicone resin particles dispersed therein |
US4857607A (en) | 1987-05-27 | 1989-08-15 | Ciba-Geigy Corporation | Epoxidized polycycloacetals |
US4804592A (en) * | 1987-10-16 | 1989-02-14 | The United States Of America As Represented By The United States Department Of Energy | Composite electrode for use in electrochemical cells |
JPH01272624A (en) * | 1988-04-25 | 1989-10-31 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic part |
ES2068912T3 (en) | 1988-08-22 | 1995-05-01 | Ciba Geigy Ag | ACETOPHENONE-FORMALDEHYDE RESINS MODIFIED WITH GROUP CONTENT EPOXY. |
JPH02166116A (en) * | 1988-12-20 | 1990-06-26 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
DE3922079C2 (en) | 1989-07-05 | 1996-06-13 | Hanse Chemie Gmbh | Polysiloxane dispersion, process for its preparation and its use |
JPH03210325A (en) * | 1990-01-12 | 1991-09-13 | Hitachi Chem Co Ltd | Semiconductor sealing epoxy resin molding material |
ES2098336T3 (en) | 1990-06-05 | 1997-05-01 | Ciba Geigy | FLUID EPOXY RESIN POWDER COMPOSITIONS. |
JPH074075B2 (en) * | 1991-02-28 | 1995-01-18 | 工業技術院長 | Actuator element |
DE59206927D1 (en) | 1991-03-27 | 1996-09-26 | Ciba Geigy Ag | Crosslinking agent for powder coatings based on polyester |
TW282486B (en) | 1991-10-03 | 1996-08-01 | Ciba Geigy Ag | |
US5319005A (en) * | 1992-01-27 | 1994-06-07 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing of electronic component |
JP3464527B2 (en) * | 1994-05-27 | 2003-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | Curable resin composition and cured resin |
JPH08311165A (en) * | 1995-05-17 | 1996-11-26 | Matsushita Electric Works Ltd | Epoxy resin composition and its production |
AU7671696A (en) * | 1996-01-18 | 1997-08-11 | University Of New Mexico | Soft actuators and artificial muscles |
HU217112B (en) † | 1997-01-21 | 1999-11-29 | Furukawa Electric Institute Of Technology | Electric-insulating compositions based on epoxy-silicon hybridresins |
-
2000
- 2000-07-14 EP EP00810620A patent/EP1172408A1/en not_active Withdrawn
-
2001
- 2001-07-02 AU AU2001265734A patent/AU2001265734A1/en not_active Abandoned
- 2001-07-02 CA CA2416020A patent/CA2416020C/en not_active Expired - Fee Related
- 2001-07-02 AT AT01942942T patent/ATE284432T1/en not_active IP Right Cessation
- 2001-07-02 DE DE2001504771 patent/DE50104771D1/en not_active Expired - Lifetime
- 2001-07-02 JP JP2002512296A patent/JP2004504436A/en not_active Ceased
- 2001-07-02 KR KR1020037000587A patent/KR100872758B1/en not_active IP Right Cessation
- 2001-07-02 HU HU0302907A patent/HUP0302907A3/en unknown
- 2001-07-02 WO PCT/CH2001/000409 patent/WO2002006398A1/en active IP Right Grant
- 2001-07-02 EP EP01942942A patent/EP1303567B2/en not_active Expired - Lifetime
- 2001-07-02 CN CNB018155901A patent/CN1229436C/en not_active Expired - Fee Related
- 2001-07-02 US US10/332,506 patent/US7268181B2/en not_active Expired - Fee Related
-
2003
- 2003-01-13 NO NO20030170A patent/NO20030170L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1172408A1 (en) | 2002-01-16 |
EP1303567B1 (en) | 2004-12-08 |
US7268181B2 (en) | 2007-09-11 |
NO20030170D0 (en) | 2003-01-13 |
KR100872758B1 (en) | 2008-12-08 |
EP1303567A1 (en) | 2003-04-23 |
CA2416020C (en) | 2012-09-11 |
WO2002006398A1 (en) | 2002-01-24 |
DE50104771D1 (en) | 2005-01-13 |
US20040249060A1 (en) | 2004-12-09 |
NO20030170L (en) | 2003-03-14 |
EP1303567B2 (en) | 2007-09-05 |
HUP0302907A2 (en) | 2003-12-29 |
HUP0302907A3 (en) | 2012-09-28 |
CN1229436C (en) | 2005-11-30 |
KR20030022283A (en) | 2003-03-15 |
ATE284432T1 (en) | 2004-12-15 |
JP2004504436A (en) | 2004-02-12 |
CN1455799A (en) | 2003-11-12 |
CA2416020A1 (en) | 2003-01-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001265734A1 (en) | Volume-modified casting compounds based on polymeric matrix resins | |
CA2217834A1 (en) | Curable resin compositions | |
AU6806690A (en) | Water-based composites with superior cure in thick films, and chemical and shock resistance | |
AU7810094A (en) | Epoxy resin composition | |
ATE131842T1 (en) | CURABLE EPOXY RESIN COMPOSITIONS | |
TW200624520A (en) | Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom | |
AU666412B2 (en) | Binder composition for powder paints | |
ES2087069T3 (en) | MIXTURES OF CROSS-CUTTING EPOXY RESINS CONTAINING POLYOXYALKYLENDITIOLS AND POLYAMINS. | |
KR910008003A (en) | Curing agent composition, method for preparing the same and thermosetting epoxy resin composition | |
ATE123502T1 (en) | CURABLE EPOXY RESIN COMPOSITIONS. | |
EP0372983A3 (en) | Epoxy resin composition for semiconductor sealing | |
DE60017631D1 (en) | Thermosetting epoxy powder coatings having improved degassing properties | |
EP1380625A4 (en) | Automotive adhesive | |
ES2137925T3 (en) | POLYOLS MODIFIED WITH EPOXIDIC RESIN AS DISPERSANTS FOR POLYOLES OF POLYMERS WITH HIGH CONTENT IN SOLIDS AND HIGH CONTENT IN STYRENE. | |
MY131556A (en) | Aqueous epoxy resin dispersions | |
TW240238B (en) | ||
EP0459745A3 (en) | Curing agent for epoxy resin | |
WO1996012752A3 (en) | Curable epoxy resin accelerated by boric acid and its analogs | |
MY103755A (en) | Curing agent compositions, laminating varnishes containing same and laminates prepared terefrom | |
ES2069511T1 (en) | HARDENABLE BINDING AGENTS. | |
Bagga | Curable Epoxide Resin Compositions | |
Gouri et al. | Reactive epoxy diluent modification of epoxy-amine system: effect on mechanical, adhesive and thermal properties. | |
Gentzkow et al. | Epoxy Resin Compositions | |
KR910012060A (en) | Epoxy Resin Composition for Sealing Semiconductor Devices |