Nothing Special   »   [go: up one dir, main page]

AU2001251318A1 - Integrated chemical-mechanical polishing - Google Patents

Integrated chemical-mechanical polishing

Info

Publication number
AU2001251318A1
AU2001251318A1 AU2001251318A AU5131801A AU2001251318A1 AU 2001251318 A1 AU2001251318 A1 AU 2001251318A1 AU 2001251318 A AU2001251318 A AU 2001251318A AU 5131801 A AU5131801 A AU 5131801A AU 2001251318 A1 AU2001251318 A1 AU 2001251318A1
Authority
AU
Australia
Prior art keywords
mechanical polishing
integrated chemical
chemical
integrated
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251318A
Inventor
Gregory H. Bogush
Jeffrey P. Chamberlain
Paul M. Feeney
Steven K. Grumbine
Brian L Mueller
David J. Schroeder
Bradley J. Staley
Alicia F. Walters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of AU2001251318A1 publication Critical patent/AU2001251318A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001251318A 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing Abandoned AU2001251318A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19574400P 2000-04-07 2000-04-07
US60195744 2000-04-07
PCT/US2001/011026 WO2001076819A1 (en) 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing

Publications (1)

Publication Number Publication Date
AU2001251318A1 true AU2001251318A1 (en) 2001-10-23

Family

ID=22722606

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251318A Abandoned AU2001251318A1 (en) 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing

Country Status (9)

Country Link
US (1) US20010037821A1 (en)
EP (1) EP1272311A1 (en)
JP (1) JP2003530227A (en)
KR (1) KR20020088428A (en)
CN (1) CN1422200A (en)
AU (1) AU2001251318A1 (en)
IL (1) IL151862A0 (en)
TW (1) TW555615B (en)
WO (1) WO2001076819A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398141B1 (en) * 2000-10-12 2003-09-13 아남반도체 주식회사 Chemical mechanical polishing slurry composition and planarization method using same for semiconductor device
US6485355B1 (en) * 2001-06-22 2002-11-26 International Business Machines Corporation Method to increase removal rate of oxide using fixed-abrasive
EP1425357A1 (en) * 2001-09-03 2004-06-09 Showa Denko K.K. Polishing composition
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US7077880B2 (en) * 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US7182882B2 (en) * 2002-01-02 2007-02-27 Intel Corporation Method of improving chemical mechanical polish endpoint signals by use of chemical additives
US7524346B2 (en) * 2002-01-25 2009-04-28 Dupont Air Products Nanomaterials Llc Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
US7513920B2 (en) * 2002-02-11 2009-04-07 Dupont Air Products Nanomaterials Llc Free radical-forming activator attached to solid and used to enhance CMP formulations
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6732017B2 (en) 2002-02-15 2004-05-04 Lam Research Corp. System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
CN100369210C (en) * 2002-02-20 2008-02-13 株式会社荏原制作所 Polising method and device
KR100497608B1 (en) * 2002-08-05 2005-07-01 삼성전자주식회사 A slurry composition, a method for manufacturing the same and a method for polishing using the same
US20040074517A1 (en) * 2002-10-22 2004-04-22 Texas Instruments Incorporated Surfactants for chemical mechanical polishing
US7163444B2 (en) * 2003-01-10 2007-01-16 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
JP4336550B2 (en) * 2003-09-09 2009-09-30 花王株式会社 Polishing liquid kit for magnetic disk
KR100630678B1 (en) 2003-10-09 2006-10-02 삼성전자주식회사 Chemical mechanical polishingCMP slurry for aluminum layer, CMP method using the CMP slurry and forming method for aluminum wiring using the CMP method
US7344988B2 (en) * 2003-10-27 2008-03-18 Dupont Air Products Nanomaterials Llc Alumina abrasive for chemical mechanical polishing
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
KR100554517B1 (en) * 2004-04-14 2006-03-03 삼성전자주식회사 Cleaning solution for silicon germanium layer and cleaning method using the same
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
US7279424B2 (en) * 2004-08-27 2007-10-09 Hitachi Global Storage Technologies Netherlands B.V. Method for fabricating thin film magnetic heads using CMP with polishing stop layer
US20060191871A1 (en) * 2005-02-25 2006-08-31 Sheng-Yu Chen Cmp slurry delivery system and method of mixing slurry thereof
KR100643628B1 (en) * 2005-11-04 2006-11-10 제일모직주식회사 Chemical mechanical polishing slurry for polishing poly-silicon film and method for producing thereof
KR100827594B1 (en) * 2006-11-07 2008-05-07 제일모직주식회사 Chemical mechanical polishing slurry compositions for polishing poly-silicon film and method for preparing the same
US7294576B1 (en) * 2006-06-29 2007-11-13 Cabot Microelectronics Corporation Tunable selectivity slurries in CMP applications
JP5060755B2 (en) * 2006-09-29 2012-10-31 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer rough polishing method and semiconductor wafer polishing apparatus
US9343330B2 (en) * 2006-12-06 2016-05-17 Cabot Microelectronics Corporation Compositions for polishing aluminum/copper and titanium in damascene structures
US8448880B2 (en) 2007-09-18 2013-05-28 Flow International Corporation Apparatus and process for formation of laterally directed fluid jets
US7981221B2 (en) * 2008-02-21 2011-07-19 Micron Technology, Inc. Rheological fluids for particle removal
KR20110102378A (en) * 2008-11-26 2011-09-16 어플라이드 머티어리얼스, 인코포레이티드 Two-line mixing of chemical and abrasive particles with endpoint control for chemical mechanical polishing
TWI467645B (en) * 2010-08-25 2015-01-01 Macronix Int Co Ltd Chemical mechanical polishing method and system
KR102022139B1 (en) * 2012-03-16 2019-09-17 가부시키가이샤 후지미인코퍼레이티드 Polishing composition
CA2783349A1 (en) * 2012-07-18 2014-01-18 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Environment Decontamination of radionuclides on construction materials
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
RU2545295C1 (en) * 2014-02-03 2015-03-27 Открытое акционерное общество "НПО "Орион" Method for chemical-mechanical polishing of gallium arsenide plates
KR101693473B1 (en) * 2014-10-07 2017-01-10 한국생산기술연구원 Alumina composition for jet scrubbing process
US11117239B2 (en) * 2017-09-29 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing composition and method
CN109943235B (en) * 2017-12-20 2021-03-23 蓝思科技（长沙）有限公司 Water-based composite polishing solution for ceramic polishing and preparation method thereof
JP7339824B2 (en) * 2019-09-17 2023-09-06 株式会社ディスコ Flow rate adjustment method and pressure adjustment method
CN112225470A (en) * 2020-07-30 2021-01-15 河南镀邦光电股份有限公司 Cover plate glass cleaning solvent proportioning process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059929A (en) * 1976-05-10 1977-11-29 Chemical-Ways Corporation Precision metering system for the delivery of abrasive lapping and polishing slurries
DE69529751D1 (en) * 1994-07-19 2003-04-03 Applied Chemical Solutions Hol DEVICE AND METHOD FOR USE IN CHEMICAL-MECHANICAL POLISHING
WO1999034956A1 (en) * 1998-01-12 1999-07-15 Conexant Systems, Inc. Economic supply and mixing method for multiple component cmp slurries

Also Published As

Publication number Publication date
EP1272311A1 (en) 2003-01-08
IL151862A0 (en) 2003-04-10
US20010037821A1 (en) 2001-11-08
JP2003530227A (en) 2003-10-14
TW555615B (en) 2003-10-01
KR20020088428A (en) 2002-11-27
WO2001076819A1 (en) 2001-10-18
CN1422200A (en) 2003-06-04

Similar Documents

Publication Publication Date Title
AU2001251318A1 (en) Integrated chemical-mechanical polishing
AU2002360661A1 (en) Polishing pad
AU2001247107A1 (en) Sanding sponge
AU4309601A (en) Chemical-mechanical polishing method
EP1354017A4 (en) Ready-to-use stable chemical-mechanical polishing slurries
AU2001294082A1 (en) Polycrystalline abrasive grit
SG87198A1 (en) Polishing composition
AU4311100A (en) Magnetic polishing fluids
SG90227A1 (en) Polishing slurry
AU2001296713A1 (en) Chemical-mechanical polishing slurry and method
AU2001275229A1 (en) Polishing pad window for a chemical-mechanical polishing tool
SG106633A1 (en) Polishing system
EP1346798A4 (en) Polishing device
SG91348A1 (en) Hybrid polishing slurry
AU2001253180A1 (en) A chemical-mechanical polishing system for the manufacture of semiconductor devices
AU2002253902A1 (en) Chemical-mechanical planarization using ozone
AU2002334406A1 (en) Polishing composition
AU1784001A (en) Abrasives for chemical mechanical polishing
AU2001233474A1 (en) Grinding wheel
SG82086A1 (en) Submerge chemical-mechanical polishing
AU2001278101A1 (en) Abrasive pad
SG96553A1 (en) Abrasive
AU2001291046A1 (en) Non-wax superior gloss polishing compound
AU2001266742A1 (en) Orbital polishing apparatus
AUPQ652300A0 (en) Surface finishing pad