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AU2001250208A1 - A method and system for laser drilling - Google Patents

A method and system for laser drilling

Info

Publication number
AU2001250208A1
AU2001250208A1 AU2001250208A AU5020801A AU2001250208A1 AU 2001250208 A1 AU2001250208 A1 AU 2001250208A1 AU 2001250208 A AU2001250208 A AU 2001250208A AU 5020801 A AU5020801 A AU 5020801A AU 2001250208 A1 AU2001250208 A1 AU 2001250208A1
Authority
AU
Australia
Prior art keywords
laser drilling
drilling
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001250208A
Inventor
Joseph Lobin
Terry Mckee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GSI Lumonics Inc Canada
Original Assignee
GSI Lumonics Inc Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GSI Lumonics Inc Canada filed Critical GSI Lumonics Inc Canada
Publication of AU2001250208A1 publication Critical patent/AU2001250208A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU2001250208A 2000-04-11 2001-04-06 A method and system for laser drilling Abandoned AU2001250208A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US54668100A 2000-04-11 2000-04-11
US09546681 2000-04-11
PCT/CA2001/000505 WO2001076808A2 (en) 2000-04-11 2001-04-06 A method and system for laser drilling

Publications (1)

Publication Number Publication Date
AU2001250208A1 true AU2001250208A1 (en) 2001-10-23

Family

ID=24181521

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001250208A Abandoned AU2001250208A1 (en) 2000-04-11 2001-04-06 A method and system for laser drilling

Country Status (4)

Country Link
US (1) US6657159B2 (en)
AU (1) AU2001250208A1 (en)
TW (1) TW483791B (en)
WO (1) WO2001076808A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001354439A (en) * 2000-06-12 2001-12-25 Matsushita Electric Ind Co Ltd Method for working glass substrate and method for making high-frequency circuit
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6864459B2 (en) * 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
DE50104542D1 (en) * 2001-05-25 2004-12-23 Stork Prints Austria Gmbh Lang Process and device and for producing a printing form
ATE282526T1 (en) * 2001-05-25 2004-12-15 Stork Prints Austria Gmbh METHOD AND DEVICE FOR PRODUCING A PRINTING FORM
DE10144008A1 (en) * 2001-09-07 2003-03-27 Siemens Ag Method and device for producing a hole in a workpiece with laser radiation
DE10210040C1 (en) * 2002-03-07 2003-10-30 Siemens Ag Operating procedures and trolleys for a laser processing system
DE10243147B4 (en) * 2002-09-17 2006-03-16 Siemens Ag Method for introducing a hole contour into a workpiece
US6809289B2 (en) * 2003-03-05 2004-10-26 The Hong Kong Polytechnic University Method of drilling a circuit board
KR20060112587A (en) * 2003-10-06 2006-11-01 신꼬오덴기 고교 가부시키가이샤 Method of forming via hole in resin layer
EP1577048A1 (en) * 2004-03-18 2005-09-21 Trotec Produktions- und Vertriebs GMBH Machining apparatus with two different machining devices and process for controlling the same
US20060107525A1 (en) * 2004-11-22 2006-05-25 Hamburgen William R Method and system for creating alignment holes in a multilayer structure
NL1028588C2 (en) * 2005-03-22 2006-09-25 Fico Bv Method and device for separating products with a controlled cut edge and separated product.
JP5030512B2 (en) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 Laser processing method
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
KR101235617B1 (en) * 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
TWI393508B (en) * 2009-12-17 2013-04-11 Unimicron Technology Corp Circuit board and process for fabricating the same
US8365662B2 (en) * 2010-05-17 2013-02-05 Eastman Kodak Company Direct engraving of flexographic printing plates
US20110278767A1 (en) * 2010-05-17 2011-11-17 David Aviel Direct engraving of flexographic printing plates
CN107414307B (en) 2011-10-21 2020-04-10 苏尔清洁公司 System configured to remove a coating from a substrate using electromagnetic radiation
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
US10149390B2 (en) * 2012-08-27 2018-12-04 Mycronic AB Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
WO2015162445A1 (en) * 2014-04-25 2015-10-29 Arcelormittal Investigación Y Desarrollo Sl Method and device for preparing aluminium-coated steel sheets intended for being welded and then hardened under a press; corresponding welded blank
US20160279737A1 (en) 2015-03-26 2016-09-29 Pratt & Whitney Canada Corp. Laser drilling through multi-layer components
US9972565B1 (en) 2016-06-07 2018-05-15 National Technology & Engineering Solutions Of Sandia, Llc Lateral vias for connections to buried microconductors
KR102174928B1 (en) * 2019-02-01 2020-11-05 레이저쎌 주식회사 Multi-beam laser de-bonding equipment and method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789770A (en) * 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
GB2249279B (en) 1990-10-17 1994-01-05 Rolls Royce Plc Improvements in or relating to drilling turbine blades
US5536579A (en) * 1994-06-02 1996-07-16 International Business Machines Corporation Design of high density structures with laser etch stop
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5744780A (en) 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
FR2745124B1 (en) * 1996-02-15 1998-04-10 Bocherens Eric SPRING STRIP
US5910255A (en) * 1996-11-08 1999-06-08 W. L. Gore & Associates, Inc. Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
DE19719700A1 (en) * 1997-05-09 1998-11-12 Siemens Ag Blind hole production in circuit board
US5837964A (en) 1998-01-16 1998-11-17 Chromalloy Gas Turbine Corporation Laser drilling holes in components by combined percussion and trepan drilling

Also Published As

Publication number Publication date
US6657159B2 (en) 2003-12-02
WO2001076808A3 (en) 2002-02-28
US20030047545A1 (en) 2003-03-13
TW483791B (en) 2002-04-21
WO2001076808A2 (en) 2001-10-18

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