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ATE272101T1 - Selbstklebefolie - Google Patents

Selbstklebefolie

Info

Publication number
ATE272101T1
ATE272101T1 AT99100971T AT99100971T ATE272101T1 AT E272101 T1 ATE272101 T1 AT E272101T1 AT 99100971 T AT99100971 T AT 99100971T AT 99100971 T AT99100971 T AT 99100971T AT E272101 T1 ATE272101 T1 AT E272101T1
Authority
AT
Austria
Prior art keywords
self
adhesive film
adhesive sheet
laminated
image
Prior art date
Application number
AT99100971T
Other languages
English (en)
Inventor
Masatoshi Matsumoto
Mitsugu Moike
Hitoshi Maruhashi
Yoshihisa Mineura
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of ATE272101T1 publication Critical patent/ATE272101T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1481—Dissimilar adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1486—Ornamental, decorative, pattern, or indicia
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/2419—Fold at edge
    • Y10T428/24215—Acute or reverse fold of exterior component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Materials For Medical Uses (AREA)
  • Steroid Compounds (AREA)
AT99100971T 1998-01-21 1999-01-20 Selbstklebefolie ATE272101T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02394898A JP3903447B2 (ja) 1998-01-21 1998-01-21 粘着シート

Publications (1)

Publication Number Publication Date
ATE272101T1 true ATE272101T1 (de) 2004-08-15

Family

ID=12124783

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99100971T ATE272101T1 (de) 1998-01-21 1999-01-20 Selbstklebefolie

Country Status (9)

Country Link
US (1) US6235366B1 (de)
EP (1) EP0932196B1 (de)
JP (1) JP3903447B2 (de)
KR (1) KR100570549B1 (de)
CN (1) CN1214457C (de)
AT (1) ATE272101T1 (de)
DE (1) DE69918872T2 (de)
SG (1) SG101919A1 (de)
TW (1) TW402771B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3763710B2 (ja) * 1999-09-29 2006-04-05 信越化学工業株式会社 防塵用カバーフィルム付きウエハ支持台及びその製造方法
KR20020061737A (ko) * 2001-01-17 2002-07-25 삼성전자 주식회사 반도체 제조장치 및 반도체 제조장치의 웨이퍼 가공방법
JP4538242B2 (ja) * 2004-01-23 2010-09-08 株式会社東芝 剥離装置及び剥離方法
US7015064B1 (en) 2004-04-23 2006-03-21 National Semiconductor Corporation Marking wafers using pigmentation in a mounting tape
US7135385B1 (en) 2004-04-23 2006-11-14 National Semiconductor Corporation Semiconductor devices having a back surface protective coating
US7101620B1 (en) * 2004-09-07 2006-09-05 National Semiconductor Corporation Thermal release wafer mount tape with B-stage adhesive
US8030138B1 (en) 2006-07-10 2011-10-04 National Semiconductor Corporation Methods and systems of packaging integrated circuits
US7749809B2 (en) * 2007-12-17 2010-07-06 National Semiconductor Corporation Methods and systems for packaging integrated circuits
US8048781B2 (en) * 2008-01-24 2011-11-01 National Semiconductor Corporation Methods and systems for packaging integrated circuits
US20100015329A1 (en) * 2008-07-16 2010-01-21 National Semiconductor Corporation Methods and systems for packaging integrated circuits with thin metal contacts
US20100161143A1 (en) * 2008-12-18 2010-06-24 Christopher Lawrence Smith Dispensing system
CN111655470A (zh) * 2018-01-24 2020-09-11 琳得科株式会社 长条层叠片及其卷料
WO2021071956A1 (en) * 2019-10-07 2021-04-15 H.B. Fuller Company Spindle free tape article and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
US5714029A (en) * 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
KR900001236B1 (ko) * 1984-05-29 1990-03-05 미쓰이도오아쓰 가가꾸 가부시끼가이샤 웨이퍼 가공용필름
KR930009213B1 (ko) * 1988-09-29 1993-09-24 이노우에 다카오 접착 테이프
DE9211645U1 (de) * 1992-05-20 1993-09-23 Beiersdorf Ag, 20253 Hamburg Gefaltetes etikett
EP0571649A1 (de) * 1992-05-26 1993-12-01 Nitto Denko Corporation Unterstützungsfilm zum Schneiden und Befestigen von Halbleiterplättchen und dessen Verwendung in einem Verfahren zur Chipherstellung
FR2695071B1 (fr) * 1992-09-02 1994-11-18 Moore Business Forms Inc Ensemble d'enveloppes constitué d'une bande dont les faces avant et arrière portent des plages d'adhésif.
TW311927B (de) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg

Also Published As

Publication number Publication date
JPH11209703A (ja) 1999-08-03
KR100570549B1 (ko) 2006-04-12
CN1224238A (zh) 1999-07-28
JP3903447B2 (ja) 2007-04-11
KR19990068024A (ko) 1999-08-25
TW402771B (en) 2000-08-21
EP0932196B1 (de) 2004-07-28
US6235366B1 (en) 2001-05-22
DE69918872D1 (de) 2004-09-02
DE69918872T2 (de) 2005-01-20
EP0932196A2 (de) 1999-07-28
EP0932196A3 (de) 2000-05-17
CN1214457C (zh) 2005-08-10
SG101919A1 (en) 2004-02-27

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties