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ATE25295T1 - Abziehzusammensetzungen und resistabziehverfahren. - Google Patents

Abziehzusammensetzungen und resistabziehverfahren.

Info

Publication number
ATE25295T1
ATE25295T1 AT83108673T AT83108673T ATE25295T1 AT E25295 T1 ATE25295 T1 AT E25295T1 AT 83108673 T AT83108673 T AT 83108673T AT 83108673 T AT83108673 T AT 83108673T AT E25295 T1 ATE25295 T1 AT E25295T1
Authority
AT
Austria
Prior art keywords
peeling
compositions
methods
resist
stripping compositions
Prior art date
Application number
AT83108673T
Other languages
English (en)
Inventor
Irl Eugene Ward Jr
Lisa Gail Hallquist
Thomas Joseph Hurley
Original Assignee
Baker Chem Co J T
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker Chem Co J T filed Critical Baker Chem Co J T
Application granted granted Critical
Publication of ATE25295T1 publication Critical patent/ATE25295T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Epoxy Compounds (AREA)
  • ing And Chemical Polishing (AREA)
AT83108673T 1982-09-02 1983-09-02 Abziehzusammensetzungen und resistabziehverfahren. ATE25295T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/413,995 US4403029A (en) 1982-09-02 1982-09-02 Stripping compositions and methods of stripping resists
EP83108673A EP0102628B1 (de) 1982-09-02 1983-09-02 Abziehzusammensetzungen und Resistabziehverfahren

Publications (1)

Publication Number Publication Date
ATE25295T1 true ATE25295T1 (de) 1987-02-15

Family

ID=23639517

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83108673T ATE25295T1 (de) 1982-09-02 1983-09-02 Abziehzusammensetzungen und resistabziehverfahren.

Country Status (12)

Country Link
US (1) US4403029A (de)
EP (1) EP0102628B1 (de)
JP (1) JPS5949538A (de)
AT (1) ATE25295T1 (de)
AU (1) AU555161B2 (de)
CA (1) CA1194764A (de)
DE (1) DE3369576D1 (de)
HK (1) HK33988A (de)
IE (1) IE54405B1 (de)
IL (1) IL69400A0 (de)
SG (1) SG17088G (de)
ZA (1) ZA835588B (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
US4491530A (en) * 1983-05-20 1985-01-01 Allied Corporation Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper
US4828960A (en) * 1985-01-07 1989-05-09 Honeywell Inc. Reflection limiting photoresist composition with two azo dyes
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
US4806458A (en) * 1985-10-28 1989-02-21 Hoechst Celanese Corporation Composition containing a mixture of hexa-alkyl disilazane and propylene glycol alkyl ether and/or propylene glycol alkyl ether acetate
US4692398A (en) * 1985-10-28 1987-09-08 American Hoechst Corporation Process of using photoresist treating composition containing a mixture of a hexa-alkyl disilazane, propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4983490A (en) * 1985-10-28 1991-01-08 Hoechst Celanese Corporation Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate
IE59971B1 (en) * 1986-11-10 1994-05-04 Baker J T Inc Stripping compositions and their use for stripping resists from substrates
US4770713A (en) * 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
US4824763A (en) * 1987-07-30 1989-04-25 Ekc Technology, Inc. Triamine positive photoresist stripping composition and prebaking process
US5166039A (en) * 1988-02-25 1992-11-24 Hoya Corporation Peeling solution for photo- or electron beam-sensitive resin and process for peeling off said resin
JPH02981A (ja) * 1988-02-25 1990-01-05 Hoya Corp 感光性樹脂用剥離液及びこれを用いる感光性樹脂の剥離方法
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US7205265B2 (en) 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
FR2691713B1 (fr) * 1992-06-02 1997-12-26 Atochem Elf Sa Composition pour decaper les peintures.
US6001192A (en) * 1992-06-02 1999-12-14 Elf Atochem S.A. Paint stripping composition
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5417802A (en) * 1994-03-18 1995-05-23 At&T Corp. Integrated circuit manufacturing
US5591702A (en) * 1995-05-25 1997-01-07 Henkel Corporation Stripping compositions with mixtures or organic solvents and uses thereof
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
KR100271761B1 (ko) * 1997-11-21 2000-12-01 윤종용 반도체장치 제조용 현상장치 및 그의 제어방법
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6368421B1 (en) 1998-07-10 2002-04-09 Clariant Finance (Bvi) Limited Composition for stripping photoresist and organic materials from substrate surfaces
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
JP4959095B2 (ja) 2000-07-10 2012-06-20 イーケイシー テクノロジー インコーポレーテッド 半導体デバイスの有機及びプラズマエッチング残さの洗浄用組成物
US7456140B2 (en) * 2000-07-10 2008-11-25 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
CA2331439C (en) * 2001-01-19 2007-01-02 E.Q.U.I.P. International Inc. Paint stripping composition and method of using the same
US7543592B2 (en) * 2001-12-04 2009-06-09 Ekc Technology, Inc. Compositions and processes for photoresist stripping and residue removal in wafer level packaging
JP2005514661A (ja) * 2002-01-11 2005-05-19 クラリアント インターナショナル リミテッド ポジ型またはネガ型フォトレジスト用の洗浄剤組成物
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
WO2003091376A1 (en) * 2002-04-24 2003-11-06 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
US20050089489A1 (en) * 2003-10-22 2005-04-28 Carter Melvin K. Composition for exfoliation agent effective in removing resist residues
US20110146724A1 (en) * 2009-12-19 2011-06-23 Mr. WAI MUN LEE Photoresist stripping solutions
KR20220058069A (ko) 2020-10-30 2022-05-09 주식회사 이엔에프테크놀로지 세정제 조성물 및 이를 이용한 세정방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2891849A (en) * 1956-11-30 1959-06-23 Eastman Kodak Co Solvent composition
US4165295A (en) * 1976-10-04 1979-08-21 Allied Chemical Corporation Organic stripping compositions and method for using same
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
US4395479A (en) * 1981-09-23 1983-07-26 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists

Also Published As

Publication number Publication date
IE831699L (en) 1984-03-02
US4403029A (en) 1983-09-06
EP0102628B1 (de) 1987-01-28
JPH0143947B2 (de) 1989-09-25
EP0102628A1 (de) 1984-03-14
ZA835588B (en) 1984-04-25
CA1194764A (en) 1985-10-08
AU1744183A (en) 1984-03-08
IE54405B1 (en) 1989-09-27
AU555161B2 (en) 1986-09-11
HK33988A (en) 1988-05-13
SG17088G (en) 1988-09-30
JPS5949538A (ja) 1984-03-22
DE3369576D1 (en) 1987-03-05
IL69400A0 (en) 1983-11-30

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEFA Change of the company name
REN Ceased due to non-payment of the annual fee