NL2027621B1 - Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir. - Google Patents
Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir. Download PDFInfo
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- NL2027621B1 NL2027621B1 NL2027621A NL2027621A NL2027621B1 NL 2027621 B1 NL2027621 B1 NL 2027621B1 NL 2027621 A NL2027621 A NL 2027621A NL 2027621 A NL2027621 A NL 2027621A NL 2027621 B1 NL2027621 B1 NL 2027621B1
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- coolant
- cooling
- stirring tank
- temperature control
- control assembly
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- 239000002826 coolant Substances 0.000 title claims abstract description 145
- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 238000010907 mechanical stirring Methods 0.000 title description 2
- 238000003756 stirring Methods 0.000 claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000005086 pumping Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims 7
- 230000003139 buffering effect Effects 0.000 abstract description 8
- 238000002156 mixing Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000411 inducer Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000000960 laser cooling Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/20—Jet mixers, i.e. mixers using high-speed fluid streams
- B01F25/21—Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
- B01F27/80—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis
- B01F27/90—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis with paddles or arms
- B01F27/902—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis with paddles or arms cooperating with intermeshing elements fixed on the receptacle walls
- B01F27/9021—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis with paddles or arms cooperating with intermeshing elements fixed on the receptacle walls the elements being vertically arranged, e.g. fixed on the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/75—Discharge mechanisms
- B01F35/753—Discharging at the upper side of the receptacle, e.g. by pressurising the liquid in the receptacle or by centrifugal force
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
- F28F13/125—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation by stirring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Abstract
A cooling and temperature control assembly for heat sensitive machine parts comprising a closed loop coolant circuit with a cooling device, heat exchanger, pump and a coolant 5 reservoir provided therein that is filled with a buffering volume of liquid coolant. The coolant reservoir comprises a stirring tank (1), a drive unit (7), a stirrer shaft (8), and an impeller (2). The drive unit (7) is configured for driving the impeller (2) inside the stirring tank (1) via the stirrer shaft (8) such that the coolant flowing back from or towards the cooling device gets mixed with the buffering volume of coolant inside the stirring tank (1) such that temperature 10 peaks arising in the machine parts and thus also in the coolant returning from the cooling device get equalized before being supplied back again to the cooling device. + Fig. 2 15
Description
P34861NLOO/RR Title: Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir.
FIELD OF THE INVENTION The present invention relates to cooling and temperature control assemblies for heat sensitive machine parts, in particular for heat sensitive production tools in a semiconductor manufacturing machine.
BACKGROUND TO THE INVENTION Cooling and temperature control assemblies are well known to be used in all kinds of machines that include heat sensitive machine parts. Depending on the amount of heat that is produced in the machine and the heat-sensitivity of some critical machine parts, high demands may be placed on such cooling and temperature control assemblies. In particular, in the semiconductor manufacturing industry truly high demands are placed on cooling and temperature control. For example, the required temperature control range there may vary from -80°C to +150°C. Furthermore, due to the high-precision semiconductor manufacturing process, very specific temperatures of +/-0.1°C (e.g. for etching) to even +0.001°C (e.g. for lithography) are required for some critical production tools, whereas cooling capacities for those critical production tools, can be up to several kilowatts. For that, it is known to equip the semiconductor manufacturing machine with large numbers of cooling devices. Those cooling devices then in particular are installed at the locations of said critical production tools. The cooling devices form part of a coolant circuit, that besides the cooling devices and supply and return lines connecting thereto, also comprises heat exchangers, a coolant reservoir and a pump. During operation, the pump is controlled to pump coolant, for example water, at a certain speed through the circuit. Heat that is produced by the semiconductor manufacturing parts, is taken over by the coolant flowing through the cooling device. From there the coolant flows towards the heat exchangers, that mostly are placed in another room than a cleanroom in which the semiconductor manufacturing machine is placed. There the coolant exchanges heat with another medium or with the environment. The reservoir can be designed as a flow through reservoir or as a standpipe reservoir. A standpipe reservoir introduces additional water to the coolant circuit whenever required,
2. whereas a flow-through reservoir continuously exchanges water that flows through the coolant circuit. For that the reservoir can be provided in either the supply either the return line. Since semiconductor chips have become smaller and smaller, while at a same time having to perform more and more functions, ever increasing demands are placed upon the semiconductor manufacturing machines. Likewise, also ever increasing demands are placed on the designing and building of the liquid based cooling and temperature control assemblies. All demands for those cooling and temperature control assemblies are becoming stricter and stricter, in particular the cooling capacity and efficiency, but also the reliability, cleanliness, required space, serviceability, etc. have become truly important factors that need to be met and that need to keep up with all kinds of other innovations to the semiconductor machine. Only then the quality and profitability of the manufactured semiconductor chips can also be guaranteed in the future.
Another example of extremely heat sensitive machine parts can be found in lasers, including lasers that form part of a semiconductor manufacturing machine. There are also large amounts of heat need to be dissipated. For example CN-104.953.445 discloses a cooling and temperature control assembly for such a laser. The assembly comprises a coolant circuit that includes a large volume water buffer tank into which water flowing out from a plate heat exchanger is introduced. The buffer tank here is foreseen as split in two by means of an orifice plate with a plurality of fluid through holes therein. The aim thereof is to reduce a flow rate of the water inside the buffer tank in order to obtain a more uniform water temperature inside it during operation.
However, a disadvantage hereof is that this slowing down of the water flow deteriorates the laser cooling process. Also it requires a heavier pump in the coolant circuit, larger cooling devices at the location of the laser, larger heat exchangers at the location spaced from the laser and/or a larger buffer tank.
In general it can be said that the ability of present cooling and temperature control assemblies for heat sensitive machine parts leaves much to be improved. In particular the ability of such cooling and temperature control assemblies to deal with suddenly occurring temperature peaks, for example during activation of those heat sensitive machine parts, leaves much to be improved.
23.
BRIEF DESCRIPTION OF THE INVENTION The present invention aims to overcome those disadvantages at least partly or to provide a usable alternative. In particular the present invention aims to provide a reliable cooling and temperature control assembly that is well able to quickly and efficiently deal with temporary suddenly occurring temperature peaks, that for example may occur during activation of new or additional machines or parts thereof. According to the present invention this aim is achieved by a cooling and temperature control assembly for heat sensitive machine parts, in particular in a semiconductor manufacturing machine, according to claim 1. The cooling and temperature control assembly comprises a closed loop coolant circuit, at least one coolant reservoir provided in the coolant circuit and filled with a buffering volume of liquid coolant, at least one cooling device provided in the coolant circuit at a location of the machine parts, and configured for cooling said machine parts by the coolant when flowing through the cooling device take up heat from the machine parts, at least one heat exchanger provided in the coolant circuit at a location spaced from the machine parts, and configured for dissipating the heat taken up by the coolant, and a pump for pumping coolant through the coolant circuit along and through the cooling device, heat exchanger and coolant reservoir. According to the inventive thought the coolant reservoir comprises a stirring tank, a drive unit, a stirrer shaft, and an impeller. The drive unit is configured for driving the impeller inside the stirring tank via the stirrer shaft such that the coolant flowing back from or towards the cooling device gets mixed with the buffering volume of coolant inside the stirring tank such that temperature peaks arising in the machine parts and thus also in the coolant returning from the cooling device get smoothed before being supplied back again to the cooling device. Thus advantageously temperature peaks in the liquid coolant can be quickly and efficiently dealt with. For example when a critical heat sensitive production tool like a laser of a semiconductor manufacturing machine gets activated, and all of a sudden several hundreds of kW cooling capacity is requested in only a few seconds response time, then the present invention has appeared to be well able to deal with that. Thus it is prevented that this temperature peak disturbs the laser itself or other machine parts of the semiconductor manufacturing machine that require a very stable process temperature of £ 0.001 °C or even less. In fact it has even appeared to prevent downtime of the entire machine to occur, which otherwise might have led to loss of valuable production time and delayed planning. Due to the active mixing inside the stirring tank, it has appeared that temperature gradients in the buffering volume of coolant inside the stirring tank can largely be reduced. Due to the mixing, large coolant-circulation loop-shaped flow patterns are formed inside that
-4- are able to quickly stir the entire stirring tank in only a few seconds. The impeller also may lead to turbulence to start occurring. Eddy currents then are able to largely increase the rate at which the heat of the freshly introduced relative hot coolant gets dissipated over the entire volume of relative cold coolant inside the stirring tank. Also those eddy currents are prone to start breaking down into smaller eddy currents. This helps to mix the coolant at smaller scales. Even mixing on a molecular level can then be accomplished.
Owing to the superb mixing of the coolant that thus can continuously be achieved inside the stirring tank, it has become possible to keep on supplying fresh relative cold coolant at almost a same relative low temperature to the cooling devices, even when sudden heat peaks temporarily occur inside the machine that result in a temporary returning of heated relative hot coolant at an increased relative high temperature out of the cooling devices. The additional heat inside the flow of relative hot coolant that then all of a sudden may start flowing into the stirring tank, now can get quickly distributed, dissipated and diffused over the entire stirring tank by means of said stirring, thus quickly equalizing the temperature of the entire volume of coolant inside the stirring tank, before it starts flowing out of the stirring tank again towards the cooling devices.
In a preferred embodiment the impeller can be positioned at an intermediate, in particular central, position inside the stirring tank. Thus advantageously at both sides of the impeller distinctive counter-rotating large coolant-circulation loop-shaped flow patterns are obtained. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further or alternative embodiment the stirring tank may have opposing head end walls and a circumferential wall that extends in between those head end walls around a central axis. In particular the stirring tank can be made cylindrical.
In addition thereto the stirring tank preferably can be placed upright with its central axis extending vertically. Thus advantageously gravitational forces (if present) on the coolant due to temperature differences between the zones may also help to increase the mixing speed efficiency inside the stirring tank.
In a preferred further or alternative embodiment the impeller can be a radial-flow impeller, in particular a flat-blade disc impeller, also referred to as a Rushton turbine. This results in donut-shaped flow patterns starting to flow all around the impeller outwards away therefrom as well as in a clock-wise or counter-clockwise rotational direction, then alongside the stirring tank’s circumferential wall, then inwards towards the central axis, and finally along
-5. the central axis back towards the impeller again. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further or alternative embodiment the stirring tank can be provided with atleast one coolant inlet opening/nozzle that opens out into the stirring tank at a level of the impeller, in particular at an intermediate, more in particular central, level alongside the circumferential wall of the stirring tank. Thus advantageously the incoming flow of relative hot coolant directly gets acted upon by the impeller. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further embodiment the coolant inlet opening/nozzle can be radially and/or tangentially directed in a direction towards the impeller and/or opposite relative to a rotation direction of the impeller. Owing to the impeller induced flow pattern continuously colliding with the incoming flow pattern, advantageously more turbulence gets created inside the stirring tank. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further embodiment a plurality of the coolant inlet openings/nozzles can be provided that open out into the stirring tank at a plurality of positions divided around the circumferential wall of the stirring tank, in particular via a ring-shaped inlet channel that extends around the circumferential wall. Thus advantageously the effect of turbulence increase by said colliding flow patterns gets multiplied.
The coolant outlet opening preferably lies maximally spaced from the coolant inlet opening/nozzle(s). In the preferred embodiment that the impeller is provided at an intermediate, in particular central, position inside the stirring tank, preferably at least two coolant outlet openings are provided that connect to the respective opposing head ends of the stirring tank or end portions of the circumferential wall. Thus advantageously for each of the distinctive counter-rotating large coolant-circulation loop-shaped flow patterns an own coolant outlet opening then is provided.
In a preferred further or alternative embodiment at least one turbulent flow inducer can be provided inside the tank. Thus advantageously more turbulence gets created inside the stirring tank. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further embodiment the turbulent flow inducer may comprise at least one baffle plate that is positioned in front of the coolant inlet opening/nozzle. This brings the
-6- effect that the incoming flow of relative hot coolant immediately gets to impact against the baffle plate. Thus advantageously more turbulence gets created inside the stirring tank. Also this baffle plate then may help to divide the stirring tank in distinctive mixing zones. If for example a plurality of baffle plates are provided that are positioned equally spaced from each other inside the stirring tank and each in front of their own dedicated coolant inlet opening/nozzle, then an equal number of zones is created inside the stirring tank. This further increases the mixing speed and efficiency of the coolant inside the stirring tank.
In a preferred further embodiment the baffle plate can be radially orientated towards the impeller. This helps to direct the incoming relative hot flow of coolant directly towards the impeller, and thus obtain good turbulence.
In a preferred further or alternative embodiment the baffle plate can be axially orientated towards the opposing head ends. This also helps to direct the flow patterns quickly along the circumferential wall towards the head ends of the stirring tank.
In a preferred further or alternative embodiment the baffle plate can be positioned spaced from the circumferential wall, in particular spaced at least 5 mm from the inner side of the circumferential wall. This helps to create eddy currents not only in front of the baffle plate but also directly behind it.
The invention also relates to a method according to claim 15.
Further preferred embodiments of the invention are stated in the dependent subclaims.
DETAILED DESCRIPTION OF THE DRAWINGS The invention shall now be explained in more detail below by means of describing some exemplary embodiments in a non-limiting way with reference to the accompanying drawings, in which: - Fig. 1 shows an embodiment of a cooling and temperature control assembly with two coolant reservoirs incorporated therein; - Fig. 2 shows one of the coolant reservoirs of fig. 1 in a partially cut open perspective view; - Fig. 3 shows a side view of fig. 2; - Fig. 4 shows a cross-sectional view of fig. 2; - Fig. 5 shows the view A-A of fig. 4; - Fig. 6 shows the view B-B of fig. 4; - Fig. 7 shows an enlarged view of section C in fig. 6; and - Fig. 8 and 9 shows some of the flow patterns during operation inside the coolant reservoir.
-7- In fig. 1 it can be seen that the cooling and temperature control assembly is used for cooling heat sensitive machine parts of a semiconductor manufacturing machine M.
Such a semiconductor manufacturing machine M may use up to or even more than 1 Megawatt of energy which almost entirely is transformed into heat.
All this heat needs to be cooled away not only during start-up of the machine M but also during the entire time it keeps on manufacturing chips.
If this is not done properly the temperature of the machine may quickly rise with a couple of degrees Celsius in only a few minutes time.
However, a semiconductor machine M is known to comprise machine parts that are truly vulnerable to temperature.
Even a 0.001 °C drop or rise in temperature may already lead to crucial faults in the guiding patterns that are produced on the chips with for example a laser.
In order to prevent this, large amounts of up to more than 1000 I/sec of coolant, for example water, need to get pumped through the machine M, in particular along the most heat sensitive parts thereof.
For that the assembly comprises a closed-loop process-cooling-water coolant circuit PCW through which a coolant, for example water, is pumped around by means of a pump P1. The coolant circuit PCW comprises one or more cooling devices CD at the location of one or more heat sensitive parts of the machine M.
During activation of the machine M, those parts themselves or other parts of the machine M may start producing heat that needs to be guided away in order to prevent the heat sensitive part of the machine M to get negatively influenced by warming up due to this heat.
The cooling device CD is of a flow-through type.
During pumping of the coolant through the coolant circuit PCW and through the cooling device CD it is able to take up the produced excessive heat and thus cool the machine part and keep its operating temperature substantially constant.
The coolant circuit PCW further comprises a primary side of a heat exchanger HE at a location spaced from the machine M.
The primary side of the heat exchanger HE is of a flow- through type.
During pumping of the coolant through the coolant circuit PCW and through the primary side of the heat exchanger HE, it is able to dissipate the previously taken up produced excessive heat to a heating medium that is pumped by means of a pump P2 through a secondary side of the heat exchanger HE that forms part of a heating loop GKW.
The heating/cooling loop GKW further comprises a primary side of a heatpump HP at a location spaced from the heat exchanger HE.
The primary side of the heatpump HP is of a flow-through type.
During pumping of the heating medium through the heating loop GKW and through the primary side of the heatpump HP, it is able to dissipate previously taken up heat to yet another cooling medium that is pumped by means of a pump P3 through a secondary side of the heatpump HP that forms part of a so-called heat destroy loop HDL.
It is noted that the heating loop GKW can be used for all kinds of purposes, like helping to heat up a building or the like.
-8- The heat destroy loop HDL is provided for being able to dissipate all non-used heat to the environment, and for that here further comprises a cooling tower CT at a location spaced from the heat exchanger HE. This cooling tower CT is of a flow-through type. During pumping of the cooling medium through the heat destroy loop HDL and through the cooling tower CT, it is able to get rid of all excessive heat that could not be used for other purposes to the environment.
The coolant circuit PCW further comprises two coolant reservoirs CR1 and CR2, one that is placed in a return line RL (lading the coolant away from the cooling device CD and towards the heat exchanger HE) of the coolant circuit PCW and one that is placed in a supply line SL (leading the coolant away from the heat exchanger HE and towards the cooling device CD) of the coolant circuit PCW. Each of those coolant reservoirs CR1 and CR2 are filled with a buffering volume of the coolant.
According to the invention those coolant reservoirs CR1 and CR2 are of an actively mixed flow-through type. See also fig. 2-7. For that each coolant reservoir CR1 and CR2 comprises a cylindrical stirring tank 1 with a circumferential wall 3 and flat opposing head end walls 4, 5. The volume of the stirring tank 1 here as an example lies between 5-20 m3. Other volumes are also possible, depending on the expected maximum temperature peaks and flow to be equalized, and depending on the maximum allowed deviation in temperature of “fresh” coolant that gets supplied to the cooling device CD. A flat-blade disc impeller 2 is positioned at a central position in the heart of the stirring tank 1. On top of the stirring tank 1, an electromotor is placed as drive unit 7. This drive unit 7 drives a shaft 8 that projects through the upper head end wall 4 and from there extends along a central axis of the tank 1. The impeller 2 is connected to the free lower end of the shaft 8.
At the height of the impeller 2, that is to say at the central level of the circumferential wall 3, it is provided with four coolant inlet openings 10 that are equally divided around the circumference of the stirring tank 1. A ring-shaped inlet channel 11 extends around the circumferential wall 3. This inlet channel 11 connects to one of the return or supply lines RL, SL of the coolant circuit PCW.
At the two opposing head end walls 4, 5, two coolant outlet openings 15, 16 are provided. The outlet openings 15, 16 connect to lines that come together and connect to the same one of the lines RL or SL in which the tank 1 is placed.
In front of each coolant inlet opening 10 a baffle plate 18 is positioned. Each baffle plate 18 extends in the axial direction towards the head end walls 4, 5. Furthermore, each
-9- baffle plate 18 extends radially inwards into the tank 1 while leaving free a gap of a few mm between the circumferential wall 3 and the plate 18. During operation of the machine M the pumps P1, P2 and P3 of the loops PCW, GKW and HDL are activated such that the coolant, the heating medium and cooling medium start flowing through their respective loops PCW, GKW and HDL, while exchanging heat with the machine M, each other and the environment via their integrated cooling device CD, heat exchanger HE, heatpump HP and cooling tower CT.
When the machine M is switched on, a sudden temperature peak of up to 2,5°C occurs in the coolant that leaves the cooling device CD via the return line RL.
This temperature peak is schematically shown in the graph of fig. 1. In order to equalize this temperature peak in the coolant before the coolant flows back towards the cooling device for a new cycle, the coolant in the embodiment shown gets actively mixed a first time with a buffering volume of coolant inside the coolant reservoirs CR1, Subsequently the coolant is flown through the heat exchanger HE in order to dissipate heat into the GKW loop.
After that the coolant gets mixed a second time with a buffering volume of coolant inside the coolant reservoirs CR2 before it is flown through the cooling device CD again.
During this active mixing inside the specifically designed stirring tanks 1 according to the invention a number of measures are taken that together, via synergetic effects of various main and secondary flow patterns positively influencing each other, have appeared able to together with the heat exchanger HE help equalize sudden temperature peaks of up to +2,5°C in the coolant at the beginning of the return line RL to an acceptable level in the coolant at the end of the supply line SL.
The number of measures and their synergetic effects comprise the following: - active driving of the centrally positioned impeller 2 in rotation via the stirring shaft 8 and drive unit 7, up to speeds of more than 750 rpm, in order to obtain upper and lower loop- shaped flow patterns of the coolant starting clockwise and radially outwardly, then clockwise and axially upwardly/downwardly, then clockwise and radially inwardly, and ending clockwise and axially downwardly/upwardly towards the impeller 2 again; - having the upper and lower loop-shaped flow patterns bumping against and forced to flow around the baffle plates in order to obtain secondary flow patterns around and behind the baffle plates 18 in no less than four upper and four lower quadrants; - pumping the coolant around via the pump P1 at a flow up to 1000 I/sec; - distribution of incoming coolant via the ring-shaped channel 11 over the circumference of the tank 1 in order to divide it over the tank 1;
-10 - - simultaneous injection of the incoming coolant via the four inlet openings 10 divided over the circumference of the tank 1 at the central height of the impeller 2 in order to immediately start mixing/equalizing the incoming coolant in each of the eight quadrants of upper and lower loop-shaped flow patterns of the buffer amount of coolant already present inside the stirring tank 1; - radially inward directed injection of the incoming coolant in each of the eight upper and lower quadrants in counter flow with the clockwise and radially outwardly directed impeller- induced upper and lower flow patterns in order to obtain turbulence; - injection of the incoming coolant at positions behind the baffle plates 18 in each of the eight upper and lower quadrants in order to further induce turbulence; - simultaneous withdrawal of outgoing coolant via the two outlet openings 15, 16 divided over the upper and lower head end walls 4, 5 of the tank 1 at maximum distance of the impeller 2 in more or less dead corner positions of the tank 1 in order to give the incoming coolant as much time as possible to mix/equalize with the buffer amount of coolant already present inside the stirring tank 1 via said split up in eight upper and lower turbulenced flow patterns; - axially outward directed withdrawal of the outgoing coolant, that is to say in a direction substantially perpendicular to the eight upper and lower turbulenced flow patterns in order to further induce mixing/equalizing.
Thus the sudden “starting” temperature peak of up to +2,5°C and a gradient of approx. 100 °C/hr in the coolant that enters into the first upstream coolant reservoir CR1 can be mixed/equalized back to a “pre-equalized” temperature peak of approx. +1,5°C and a gradient of approx. 40 °C/hr in the coolant that leaves this first upstream coolant reservoir CR1. Because the temperature peak and the gradient have been lowered the regulating valves working together with the heat exchanger HE are more capable of reacting on these fast changes. After that the “cooled down” temperature peak in the coolant that enters into the second downstream coolant reservoir CR2 can be further mixed/equalized back to a “post- equalized” temperature peak of approx. 2/3 of the entrance temperature of CR2 and an approx. 80% less steep gradient in the coolant that leaves this second upstream coolant reservoir CR2 and towards the cooling device CD in the machine M again.
Besides the shown and described embodiments, numerous variants are possible. For example the dimensions and shapes of the various parts can be altered. Also it is possible to make combinations between advantageous aspects of the shown embodiments. Instead of placing the stirring tank in vertical position it can also be positioned lying down or any other orientation. Furthermore the number of baffle plates, inlet openings and outlet openings can be varied. Instead of simple throughgoing inlet openings it is also possible to use inlet
-11 - nozzles. The advantage thereof is that they can be directed in aimed directions more accurately and that they may help to increase the injection speed. Also other types and/or numbers of impellers and positions of them inside the tank are possible in order to obtain other kinds of flow patterns inside the tank. All kinds of materials can be used for the coolant reservoirs and their components, depending on the type of coolant that is foreseen. Instead of two stirring tanks it is also possible to only use one, which then preferably is placed in the return line such that the inventive active mixing/equalizing at least occurs upstream of the heat exchanger. The heat exchanger HE then can react more easily on the flattened temperature peak and gradient of temperature rise shortly before the coolant needs to do its cooling work again inside the machine.
It should be understood that various changes and modifications to the presently preferred embodiments can be made without departing from the scope of the invention, and therefore will be apparent to those skilled in the art. It is therefore intended that such changes and modifications be covered by the appended claims.
Claims (15)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2027621A NL2027621B1 (en) | 2021-02-23 | 2021-02-23 | Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir. |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2027621A NL2027621B1 (en) | 2021-02-23 | 2021-02-23 | Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir. |
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| NL2027621B1 true NL2027621B1 (en) | 2022-09-19 |
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| NL2027621A NL2027621B1 (en) | 2021-02-23 | 2021-02-23 | Cooling and temperature control assembly for heat sensitive machine parts, with a coolant circuit that includes an active mechanical stirring tank as flow-through coolant reservoir. |
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|---|---|---|---|---|
| US3143395A (en) * | 1959-07-14 | 1964-08-04 | Shell Oil Co | Method of operating a fluid mixer with rotating baffles |
| US4316434A (en) * | 1980-02-13 | 1982-02-23 | Bailey Burners, Inc. | Method and apparatus for improving heat transfer |
| US4344479A (en) * | 1978-07-28 | 1982-08-17 | Fuelsaver Company | Process and apparatus utilizing common structure for combustion, gas fixation, or waste heat recovery |
| US6502630B1 (en) * | 2001-12-03 | 2003-01-07 | Pratt & Whitney Canada Corp. | Combined hydraulic fluid cooler/tank |
| KR101039741B1 (en) * | 2011-01-07 | 2011-06-09 | 주식회사 한솔환경산업 | Mechanical Stirred Anaerobic Digester |
| KR20140026949A (en) * | 2012-08-24 | 2014-03-06 | 주식회사 글로벌스탠다드테크놀로지 | Temperature control of semiconductor manufacturing equipment and its control method |
| CN104953445A (en) | 2015-07-01 | 2015-09-30 | 中国电子科技集团公司第十六研究所 | Circulating cooling system for laser and control method of system |
| US20160168046A1 (en) * | 2014-12-12 | 2016-06-16 | Uop Llc | Ionic liquid reactor with heat exchanger |
-
2021
- 2021-02-23 NL NL2027621A patent/NL2027621B1/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3143395A (en) * | 1959-07-14 | 1964-08-04 | Shell Oil Co | Method of operating a fluid mixer with rotating baffles |
| US4344479A (en) * | 1978-07-28 | 1982-08-17 | Fuelsaver Company | Process and apparatus utilizing common structure for combustion, gas fixation, or waste heat recovery |
| US4316434A (en) * | 1980-02-13 | 1982-02-23 | Bailey Burners, Inc. | Method and apparatus for improving heat transfer |
| US6502630B1 (en) * | 2001-12-03 | 2003-01-07 | Pratt & Whitney Canada Corp. | Combined hydraulic fluid cooler/tank |
| KR101039741B1 (en) * | 2011-01-07 | 2011-06-09 | 주식회사 한솔환경산업 | Mechanical Stirred Anaerobic Digester |
| KR20140026949A (en) * | 2012-08-24 | 2014-03-06 | 주식회사 글로벌스탠다드테크놀로지 | Temperature control of semiconductor manufacturing equipment and its control method |
| US20160168046A1 (en) * | 2014-12-12 | 2016-06-16 | Uop Llc | Ionic liquid reactor with heat exchanger |
| CN104953445A (en) | 2015-07-01 | 2015-09-30 | 中国电子科技集团公司第十六研究所 | Circulating cooling system for laser and control method of system |
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