Nothing Special   »   [go: up one dir, main page]

NL2021145B1 - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents

Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components Download PDF

Info

Publication number
NL2021145B1
NL2021145B1 NL2021145A NL2021145A NL2021145B1 NL 2021145 B1 NL2021145 B1 NL 2021145B1 NL 2021145 A NL2021145 A NL 2021145A NL 2021145 A NL2021145 A NL 2021145A NL 2021145 B1 NL2021145 B1 NL 2021145B1
Authority
NL
Netherlands
Prior art keywords
mold
electronic components
insert
mould
carrier
Prior art date
Application number
NL2021145A
Other languages
Dutch (nl)
Inventor
Hubertus Maria Kersjes Sebastianus
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Priority to NL2021145A priority Critical patent/NL2021145B1/en
Priority to SG11202011472VA priority patent/SG11202011472VA/en
Priority to JP2020569196A priority patent/JP7391051B2/en
Priority to PCT/NL2019/050374 priority patent/WO2019245364A1/en
Priority to TW108121121A priority patent/TWI834678B/en
Priority to KR1020207036958A priority patent/KR102784021B1/en
Priority to CN201980039639.1A priority patent/CN112262461B/en
Application granted granted Critical
Publication of NL2021145B1 publication Critical patent/NL2021145B1/en
Priority to PH12020552144A priority patent/PH12020552144A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to 5 each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulate, wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. The invention further relates to an insert 10 for use in said mould and a method for encapsulating electronic components mounted on a carrier using said mould. 2021145

Description

Θ 2021145 ©B1 OCTROOI (2?) Aanvraagnummer: 2021145 (22) Aanvraag ingediend: 18 juni 2018 (51) Int. Cl.:
H01L 21/56 (2018.01) B29C 45/14 (2019.01) H01L
23/31 (2019.01) (30) Voorrang:
(73) Octrooihouder(s):
BESI NETHERLANDS B.V. te Duiven (Q Aanvraag ingeschreven:
januari 2020 (43) Aanvraag gepubliceerd:
(72) Uitvinder(s):
Sebastianus Hubertus Maria Kersjes te Duiven
Octrooi verleend:
januari 2020 (74) Gemachtigde:
ir. H.Th. van den Heuvel c.s. te 's-Hertogenbosch (45) Octrooischrift uitgegeven:
januari 2020 (54) Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components (57) The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulate, wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. The invention further relates to an insert for use in said mould and a method for encapsulating electronic components mounted on a carrier using said mould.
NLB1 2021145
Dit octrooi is verleend ongeacht het bijgevoegde resultaat van het onderzoek naar de stand van de techniek en schriftelijke opinie. Het octrooischrift komt overeen met de oorspronkelijk ingediende stukken.
Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulated. The invention also provides a method for encapsulating electronic components mounted on a carrier using such a mould, comprising the processing steps of: a) positioning a carrier carrying one or more electronic components between two mould parts such that the electronic components face a mould cavity, b) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the mould parts, the at least one mould cavity is enclosing the electronic components to be encapsulated and the insert contacts at least one of electronic components; c) bringing a moulding material in the mould cavity; and d) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts, thereby also releasing the insert from the electronic components. Furthermore an insert to be used in the mould and method according the present invention are provided, as well as a method to produce such insert.
The encapsulation of electronic components mounted on a carrier, also commonly called a “substrate”, with a moulding material is a known art. On an industrial scale such electronic components are provided with an encapsulation, usually an encapsulation of a curing epoxy or resin to which a filler material is added. There is a trend in the market toward simultaneous encapsulation of larger quantities of electronic components with various dimensions and with still increasing accuracy demands. This may result in products having heterogeneous combinations of electronic components in a single package. Electronic components may be envisaged here such as semiconductors (chips, although LEDs are in this respect also deemed semiconductors) which are generally becoming increasingly smaller. Once the moulding material has been arranged the collectively encapsulated electronic components are situated in an encapsulation (package) which is arranged on one but sometimes also two sides of the carrier. The moulding or encapsulation material often takes the form of a flat layer connected to the carrier in which layer the electronic components are full or partially embedded/encapsulated. The carrier may consist of a lead frame, a multi-layer carrier - manufactured partially from epoxy - (also referred to as board or substrate and so on) or another carrier structure.
During the encapsulation of electronic components mounted on a carrier, usually use is made according to the prior art of encapsulating presses provided with at least two mould halves, into at least one of which is recessed one or plural mould cavities. After placing the carrier with the electronic components for encapsulating between the mould halves, the mould halves are moved towards each other, e.g. such that they clamp the carrier. A, normally heated, liquid moulding material may then be fed to the mould cavities, usually by means of transfer moulding. As an alternative it is also possible to bring the moulding material in the mould cavity before the closure of the mould parts; this alternative process for transfer moulding is called compression moulding. After at least partial (chemical) curing of the moulding material in the mould cavity/cavities, the carrier with encapsulated electronic components is taken out of the encapsulating press and the encapsulated products may be separated from each other during further processing. Foil may be used during the encapsulating process to, among others, screen off a part of the electronic components and so to prevent the foil covered parts of the electronic component to be covered by the moulding material. The partial with moulding material covered electronic components (not over moulded electronic components are referred to as “bare die” or “exposed die” products) may be used in various applications; like for instance various types of sensor components, ultra-low packages or heat dissipating components. This method of encapsulation is practised on large industrial scale and enables well controlled encapsulation of partially uncovered electronic components. A problem of the prior art encapsulation processes of electronic components that result in partially uncovered electronic components is that the process is only suited for the encapsulation of larger quantities of electronic components with identical height of flat areas on the electronic components to be left uncovered. The flexibility in the areas of the electronic components to be left uncovered and the possibilities for the simultaneous partial uncovered encapsulation of electronic components with various heights is limited.
The present invention has for its object to provide an alternative mould and method for encapsulating electronic components that enable the partial uncovered encapsulation of electronic components with various dimensions and/or with variation in the shape of the uncovered parts of the electronic component.
The invention provides for this purpose a mould for encapsulating electronic components mounted on a carrier according the introduction wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. Flexibility of the insert moulding surface is herein to be interpreted as being flexible relative to the inflexible structure of the mould parts. Such an insert, that may also be referred to as a “liner”, enables to realise a contact surface with any shape desired. The moulding surface of the insert is thereto commonly shaped to closely adhere to the shape of the electronic components to be encapsulated. As a contact surface with any desired shape may be realised, the mould according the invention enables far more freedom in the shape of the moulded electronic components, wherein it becomes possible to make the inset fit combinations of various sized electronic components as well as to fit combinations of identical sized electronic components with different “cover rate” demands. For instance various electronic components within a single package having differing heights may be “bare die” moulded leaving for instance the upper surface of a small electronic component as well as the surface of a high electronic component exposed. The flexible three-dimensional moulding surface of the insert is hereto configured to contact during moulding those parts of the electronic components to be left exposed. It is also possible that the insert is configured to contact (part of) the carrier in addition to or instead of contacting one or more of the electronic components such that a part of the carrier remains exposed. Such an exposed part of the carrier may function as a connector and/or as a mounting surface for future mounting of one or more components. Also variations in local heights of the cured moulding material may be realised through the topology of the moulding surface of the insert. Moreover, due to the flexibility of the insert moulding surface, the insert may through deformation compensate for height tolerances of the electronic components. This way, no excessive pressure forces are exerted on the electronic components during moulding, even if the flexible three-dimensional moulding surface does not fully fits to the shape of the electronic components.
In an embodiment of the mould according to the invention the three-dimensional moulding surface of the insert is made from a polymer material, for instance from a vulcanized synthetic rubber, or more specific a fluor-elastomer. In a regular variation, the insert comprises a FKM-type of rubber. The benefit of using a vulcanized synthetic rubber, and specifically a fluor-elastomer for the threedimensional moulding surface of the insert is that this type of material is temperature resistant at the temperatures the moulding material is processed while also being flexible and resistive to chemicals. The temperature resistance is required as normally a processing temperature between 100-200 °C is applied during bringing the moulding material in the mould cavity. Fluor-elastomers normally are even more heat and chemical resistant.
The insert may be detachably connectable to the mould part to allow inserts to be exchangeable. This allows for the encapsulation of electronic components with different layouts between production runs without changing the mould parts and for exchange of worn inserts.
As further solution for increasing the versatility of the mould, the mould may comprises multiple flexible inserts having three-dimensional moulding surfaces facing the electronic components. The three-dimensional moulding surfaces of each of the inserts may hereby have a different layout such that electronic components with different layouts may be moulded concurrently in the same mould. However, if groups of electronic components to be packaged are to be moulded to packages with identical shape form, the moulding surfaces of the inserts may have similar shapes. An additional benefit of using multiple inserts is that the inserts may, in the case of e.g. wear or failure, be replaced independent of each other.
As yet another way of increasing the versatility of the mould, the mould may comprise at least two mutually opposing mould parts with a mould cavity recessed in a contact side thereof, wherein said mould cavities are at least partially formed by an insert having a flexible three-dimensional moulding surface. By providing the contact sides of two mutually opposing mould parts with a mould cavity, a space may be left between the carrier and/or the electronic components on opposing sides of the carrier to be filled with moulding material during moulding. It hereby becomes possible to encapsulate (parts of) the carrier and/or electronic components situated on opposing sides of the carrier simultaneously. Moreover, as both mould cavities may at least partially be formed by an insert having a flexible three-dimensional moulding surface, the freedom in the in the shape of the moulded electronic components and the capability to compensate for height tolerances of the electronic components applies to electronic components mounted on opposing sides of the carrier.
Alternatively, one of the mutually opposed flexible three-dimensional moulding surfaces of a pair of mutually opposing inserts may function as a compliant support surface for the electronic components that may or may not be packaged on one side of the carrier, while the other of the mutually opposed flexible threedimensional moulding surfaces may form at least part of the mould cavity enclosing the electronic components on the other, opposite side of the carrier. The flexible three-dimensional moulding surface that acts as the support surface hereby preferably has a topology that follows the topology of the electrical components and carrier to be supported. A benefit of using the flexible three-dimensional moulding surface of the insert as a support surface is the freedom in the shape of the surfaces that may be supported by said support surface. Moreover, the flexible three-dimensional moulding surface acting as a support surface is able to compensate for dimensional tolerances in the surface that is supported, which is especially useful if the supported surface comprises already encapsulated electrical components. With this embodiment of the mould according to the invention, the electrical components on only one side of a carrier may be encapsulated while said carrier may have electrical components mounted on opposing sides thereof. It is hereby possible that the electrical components on one side of the carrier are left unpackaged. It is however also possible that the electrical components on opposing sides of the carrier are hereby packaged subsequently, wherein the carrier is turned upside down after the first moulding operation.
In a preferred embodiment of the mould according to the invention the threedimensional moulding surface of the insert has a ASTM D2240 type A hardness between 70- 100 Sh-A, preferably between 80 - 90 Sh-A. It is found that a mould surface within this hardness range provides a proper balance between flexibility and dimensional stability. The insert moulding surface should be provided with sufficient flexibility to be compliant with dimensional tolerances of the electronic components. Through its flexibility, the moulding surface is able to contact various parts of the electronic components intended to be left bare after packaging without exerting a high pressure onto the electronic components. On the other hand, the insert moulding surface should have a sufficient rigidity to remain dimensionally stable during the moulding process and especially during insertion of the moulding material in the mould cavity. The moulding surface should hereby adhere closely onto the parts of the electronic components to be kept exposed and thus clear (bare) of moulding material. This ensures that the moulding material will encapsulate the electronic components only there where required.
The insert may comprise an inflexible coupling part carrying the flexible threedimensional moulding surface. The inflexible coupling part may hereby be made from a substantially rigid material such as a metal. Normally the inflexible coupling part will be provided at the opposite side of the side facing the electronic components to be moulded. An inflexible coupling part of the insert will provide controlled support to the flexible moulding surface. This benefits the dimensional stability of the insert. Furthermore the inflexible coupling part may facilitate coupling of the insert to the mould. For easy coupling to ta mould part the inflexible coupling part may be provided with coupling means.
In order to ensure that the moulding material inserted into the mould cavity is retained inside the mould cavity and does not leak away via the insert, it is preferred that the three-dimensional moulding surface of the insert is impermeable for moulding material. By making the moulding surface of the insert impermeable for moulding material, no additional covering of the insert, e.g. in the form of a cover sheet or foil, is necessary to achieve a good seal of the mould cavity.
In a further embodiment of the mould according to the invention, the mould part comprising the mould cavity and configured for receiving the mould insert comprises an opening. Said opening hereby connects the mould cavity and therewith the insert with an outside of the mould. This opening may be connected to underpressure means to create a partial vacuum inside the mould cavity, and in a particular instance at the flexible three-dimensional moulding surface of the insert. In order to connect the opening to said insert moulding surface, a space may be left between the insert and a side of mould cavity recessed in one of the mould parts. Alternatively or additionally, the insert may be provided with suction holes running from the moulding surface to a rear side of the insert opposing the moulding surface. If a foil layer is inserted between the three-dimensional moulding surface of the insert and the electronic components to be encapsulated, an under pressure applied between the moulding surface and the foil layer will suck the foil layer over the moulding surface. This ensures that the foil layer will follow the threedimensional topography of the moulding surface. Said foil layer may - amongst others - be applied to facilitate release of the moulded electronic components from the mould cavity.
The invention further relates to an insert for use in a mould according to the invention, the benefits of which are already explained above in relation to the mould according the present invention.
The invention also relates to a method for producing an insert according to the invention, comprising vulcanizing a polymer material onto an inflexible coupling part by moulding the polymer material together with a curative between the inflexible coupling part and a counter mould. By vulcanizing the polymer material onto the inflexible coupling part, a strong bond between the flexible three-dimensional moulding surface and the inflexible coupling part may be realised. During vulcanisation, crosslinks between the polymer chains are formed that significantly increase the strength and durability of the polymer material and thus the flexible three-dimensional moulding surface of the insert. Post-curing processes such as autoclaving may however be required to achieve an optimum cure.
Finally, the invention relates also to a method for encapsulating electronic components mounted on a carrier using a mould according to the invention, comprising the processing steps of: a) positioning a carrier carrying one or more electronic components between two mould parts such that the electronic components face a mould cavity, b) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the mould parts, the at least one mould cavity is enclosing the electronic components to be encapsulated and the insert contacts at least one of the electronic components and/or the carrier, c) bringing a moulding material in the mould cavity, and d) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts, thereby also releasing the insert from the electronic components. By performing this method, a packaged product is obtained wherein the electronic components and the carrier are at least partially covered with moulding material except for the at least one location where the insert contacted the electronic components and/or the carrier during moulding. As was already mentioned previously, due to the use of a flexible insert moulding surface, the insert may by limited deformation compensate for height tolerances in the dimensions of the electronic components. This will prevent excessive pressure forces to be exerted onto the electronic components during moulding. With the use of an insert according to the invention height tolerances up to 50 pm may even be compensated.
It is possible to bring a foil layer in the mould cavity covering at least partially the flexible three-dimensional moulding surface of the insert before the carrier carrying the one or more electronic components is clamped between the mould parts. Said foil layer may act as a release foil to aid in the release of the partial moulded electronic components from the mould cavity. In particular said foil layer is clamped between the insert and the electronic components and/or the carrier during processing step c) while moving the mould parts towards each other. In a preferred instance, an under-pressure is applied between the foil layer and the flexible threedimensional moulding surface of the insert via an opening in the mould part. This under-pressure ensures that the foil layer closely follows the three-dimensional topography of the moulding surface and is retained on the moulding surface throughout the moulding process.
In an embodiment of the method for encapsulating electronic components mounted on a carrier according to the invention, the moulding material is brought in the mould cavity according method step c) after the mould parts are moved towards each other according method step b) by displacing liquid moulding material to the mould cavity enclosing the electronic component by exerting pressure on the moulding material. This method is also known as “transfer moulding”. The moulding material is hereby at least partially cured before moving the mould parts apart from each other so that the mould shaped product is not losing its shape during the release from the moulded product out of the mould. In an alternative moulding process the encapsulating material may be brought in the mould cavity according method step c) before the mould parts are moved towards each other according method step b). Such moulding process is also known as “compression moulding. The present invention may be practiced independent of the specific type of moulding process. Normally the encapsulating material is heated before and/or during the moulding process but also such is not a limitation for the present invention.
The present invention will be further elucidated on the basis of the non-limitative exemplary embodiments shown in the following figures, wherein:
• figure 1 shows a cross section of a mould according to the invention clamping a carrier with electronic components, • figures 2a - 2d show a schematic representation of the method steps for encapsulating electronic components mounted on one side of a carrier using a mould according to the invention, and • figures 3a - 3d show a schematic representation of the method steps for encapsulating electronic components mounted on two opposing sides of a carrier using a mould according to the invention.
Figure 1 shows a cross section of a mould (1) according to the invention clamping a carrier or substrate (2) carrying multiple electronic components (3) for incorporation in a single package. The mould (1) comprises two mould parts (4, 5), an upper mould part (5) in a contact side (7) of which a mould cavity (6) is recessed. The mould cavity (6) is on one side defined by an insert (8) having a flexible threedimensional moulding surface (9) which surface (9) faces the electronic components (3). On a side opposite the three-dimensional moulding surface (9), that faces the upper mould part (5), the insert (8) comprises an inflexible coupling part (10) which acts as a support for the moulding surface (9). The insert (8) is detachably connected to the upper mould part (5) by bolts (11) acting as coupling means which are thereto provided on the inflexible coupling part (10). The upper mould part (5) is furthermore provided with suction openings (12) that are one end connecting to an outside of the mould (1) connected to under-pressure means (13). The openings (12) debouch inside the mould cavity (6), wherein a space that is left between the insert (8) and a side of mould cavity (6) that ensures that an underpressure is applied between the flexible three-dimensional moulding surface (9) and a foil layer (14). Said foil layer (14) is clamped between the insert (8) on one hand and the electronic components (3) and the carrier (2) on the other hand, thereby covering at least partially the flexible three-dimensional moulding surface (9). The surfaces (15) of the electronic components (3) and the surface (16) of the carrier (2) contacted by the foil layer (14) will be exposed after moulding. The foil layer (14) will act as a release foil when the carrier (2) with the moulded electronic components (3) is released from the mould parts (4, 5).
Figures 2a - 2d show a schematic depiction of the method steps for encapsulating electronic components mounted on one side of a carrier using a mould according to the invention. Throughout these figures, similar elements are designated by similar reference numbers. Like in figure 1, figures 2a - 2d show a mould insert (20) that encloses part of a mould cavity (21) of a mould (not further represented in these figures). The insert (20) comprises a flexible three-dimensional moulding surface (22) and an inflexible coupling part (23) attached to the flexible three-dimensional moulding surface (22). The inflexible coupling part (23) is configured for connecting to a mould part. The flexible three-dimensional moulding surface (22) faces a carrier or substrate (24) provided with multiple electronic components (25, 26, 27) on one side thereof. Figure 2a shows that two of the electric components (26, 27) have a height difference (h), e.g. due to production tolerances and/or variation in electronic components type. Figure 2b depicts the situation after the mould parts are moved towards each other, wherein the flexible three-dimensional moulding surface (22) of the insert (20) contacts the electronic components (25, 26, 27). It can be seen from this figure that the height difference (h) is compensated for by means of the flexible moulding surface (22). After the carrier (24) and the electronic components (25, 26, 27) mounted thereon are enclosed between the mould parts, a moulding material (28) is introduced into the mould cavity (21) as shown in figure 2c, wherein the direction of insertion is indicated by an arrow (29). Following the complete filling of the mould cavity (21), the mould parts are moved apart from each other, lifting the flexible three-dimensional moulding surface (22) off the electronic components (25, 26, 27). Figure 2d shows the packaged product (30) resulting from the method according to the invention, wherein the electronic components (25, 26, 27) are now partly encapsulated by the moulding material (28). The parts of the electronic components (25, 26, 27) covered by the flexible three-dimensional moulding surface (22) during moulding are hereby left bare.
Figures 3a - 3d show a schematic representation of the method steps for encapsulating electronic components (45, 46, 47, 48, 49, 50) mounted on two opposing sides of a carrier or substrate (44) using another embodiment of a mould according to the invention. In these figures, similar elements are again designated by similar reference numbers. The method steps shown in figures 3a - 3d much resemble the method steps as shown in figures 2a - 2d. An important difference however is that the mould (which is not further represented in these figures) now comprises two mould inserts (40, 41) that each form part of a different one of two opposing mould cavities (42, 43). The mould cavities (42, 43) are hereby configured to each enclose one of two opposing sides of a carrier or substrate (44), which opposing sides each comprise electronic components (45, 46, 47, 48, 49, 50) and parts of the carrier (44) to be encapsulated. The inserts (40, 41) both comprise a flexible three-dimensional moulding surface (51,52) and an inflexible coupling part (53, 54) attached to the flexible three-dimensional moulding surface (51,52). Figure 3b depicts the situation after the mould parts are moved towards each other, wherein the flexible three-dimensional moulding surface (51) of one insert (40) contacts the electronic components (45, 46, 47) on one side of the carrier (44) and wherein the flexible three-dimensional moulding surface (52) of the other insert (41) contacts the electronic components (48, 49, 50) on the other side of the carrier (44). In addition, the three-dimensional moulding surface (52) of the last mentioned insert (41) contacts a part (55) of the carrier (44) that will thus be exposed after moulding. Figure 3c shows the consecutive step of introducing a moulding material (56) in the mould cavities (42, 43), the direction of insertion being indicated by arrows (57). Following the complete filling of the mould cavities (42, 43), the mould parts are moved apart from each other, lifting the flexible three-dimensional moulding surfaces (51,52) off the electronic components (45, 46, 47, 48, 49, 50). In figure 3d the resulting packaged product (58) is depicted, wherein the electronic components (45, 46, 47, 48, 49, 50) are now partly encapsulated by the moulding material (56). The parts of the electronic components (45, 46, 47, 48, 49, 50) as well as the part (55) of the carrier (44) covered by the flexible three-dimensional moulding surfaces (51,52) during moulding are hereby exposed.

Claims (18)

ConclusiesConclusions 1. Mal voor het inkapselen van op een drager bevestigde elektronische componenten, omvattende ten minste twee maldelen die ten opzichte van elkaar verplaatsbaar zijn, waarbij in ten minste één van de maldelen een malholte aan een contactzijde is uitgespaard, welke maldelen zijn ingericht om met de malholte aan te grijpen op rondom de in te kapselen elektronische componenten;A mold for encapsulating electronic components mounted on a carrier, comprising at least two mold parts that are movable relative to each other, wherein in at least one of the mold parts a mold cavity on a contact side is recessed, which mold parts are adapted to to engage the mold cavity around the electronic components to be encapsulated; waarbij ten minste een deel van de malholte wordt gevormd door een inzetstuk met een naar de elektronische componenten gericht flexibel driedimensionaal maloppervlak.wherein at least a part of the mold cavity is formed by an insert with a flexible three-dimensional mold surface facing the electronic components. 2. Mal volgens conclusie 1, met het kenmerk dat het driedimensionale maloppervlak van het inzetstuk is gemaakt van een polymeer materiaal, bijvoorbeeld van een gevulcaniseerde synthetische rubber, meer specifiek een fluorelastomeer.Mold according to claim 1, characterized in that the three-dimensional mold surface of the insert is made of a polymeric material, for example of a vulcanized synthetic rubber, more specifically a fluoroelastomer. 3. Mal volgens conclusie 1 of 2, met het kenmerk dat het inzetstuk losmaakbaar met het maldeel verbindbaar is.3. Mold according to claim 1 or 2, characterized in that the insert can be connected releasably to the mold part. 4. Mal volgens één van de voorgaande conclusies, met het kenmerk dat het driedimensionale maloppervlak van het inzetstuk een hardheid heeft tussen 70 en 100 Sh-A, bij voorkeur tussen 80 en 90 Sh-A.Mold according to one of the preceding claims, characterized in that the three-dimensional mold surface of the insert has a hardness between 70 and 100 Sh-A, preferably between 80 and 90 Sh-A. 5. Mal volgens één van de voorgaande conclusies, met het kenmerk dat het inzetstuk een inflexibel koppeldeel omvat dat het flexibele driedimensionale maloppervlak draagt.Mold according to one of the preceding claims, characterized in that the insert comprises an inflexible coupling part that supports the flexible three-dimensional mold surface. 6. Mal volgens conclusie 5, met het kenmerk dat het inflexibele koppeldeel is voorzien van koppelmiddelen.Mold according to claim 5, characterized in that the inflexible coupling part is provided with coupling means. 7. Mal volgens één van de voorgaande conclusies, met het kenmerk dat het driedimensionale maloppervlak van het inzetstuk ondoorlaatbaar is voor gietmateriaal.Mold according to one of the preceding claims, characterized in that the three-dimensional mold surface of the insert is impermeable to casting material. 8. Mal volgens één van de voorgaande conclusies, met het kenmerk dat de mal meerdere flexibele inzetstukken omvat met naar de elektronische componenten gerichte driedimensionale maloppervlakken.Mold according to one of the preceding claims, characterized in that the mold comprises a plurality of flexible inserts with three-dimensional mold surfaces facing the electronic components. 9. Mal volgens conclusie 8, met het kenmerk dat de mal ten minste twee onderling overliggende maldelen omvat waarin een malholte aan een contactzijde daarvan is uitgespaard, waarbij voornoemde malholten ten minste gedeeltelijk zijn gevormd door een inzetstuk met een flexibel driedimensionaal maloppervlak.Mold according to claim 8, characterized in that the mold comprises at least two mutually opposite mold parts in which a mold cavity is recessed on a contact side thereof, said mold cavities being formed at least partially by an insert with a flexible three-dimensional mold surface. 10. Mal volgens één van de voorgaande conclusies, met het kenmerk dat een opening in het maldeel voor het opnemen van het inzetstuk is verbonden met onderdrukmiddelen.Mold according to one of the preceding claims, characterized in that an opening in the mold part for receiving the insert is connected to underpressure means. 11. Inzetstuk voor gebruik in een mal volgens één van de voorgaande conclusies.An insert for use in a mold according to any one of the preceding claims. 12. Werkwijze voor het produceren van een inzetstuk volgens één van de voorgaande conclusies, omvattende het vulcaniseren van een polymeer materiaal op een inflexibel koppeldeel door het polymere materiaal samen met een curatief middel tussen het inflexibele koppeldeel en een contramal te gieten.A method of producing an insert according to any of the preceding claims, comprising vulcanizing a polymeric material on an inflexible coupling member by pouring the polymeric material together with a curative agent between the inflexible coupling member and a counter-jig. 13. Werkwijze voor het inkapselen van op een drager bevestigde elektronische componenten met behulp van een mal volgens één van de conclusies 1-12, omvattende de processtappen:A method for encapsulating electronic components mounted on a carrier with the aid of a mold according to any of claims 1-12, comprising the process steps: a) het zodanig positioneren van een drager, die één of meer elektronische componenten draagt, tussen twee maldelen dat de elektronische componenten naar een malholte zijn gericht,a) positioning a carrier carrying one or more electronic components between two mold parts such that the electronic components are directed towards a mold cavity, b) het zodanig verplaatsen van de maldelen naar elkaar, dat de maldelen de drager tussen de maldelen inklemmen, de ten minste ene malholte de in te kapselen elektronische componenten omsluit en het inzetstuk contact maakt met ten minste één van de elektronische componenten en/of de drager;b) moving the mold parts to each other such that the mold parts clamp the carrier between the mold parts, the at least one mold cavity encloses the electronic components to be encapsulated and the insert makes contact with at least one of the electronic components and / or the carrier; c) het brengen van een gietmateriaal in de malholte; enc) introducing a casting material into the mold cavity; and d) het van elkaar af verplaatsen van de maldelen, en het verwijderen van de drager met gevormde elektronische componenten uit de maldelen, waardoor ook het inzetstuk wordt losgemaakt van de elektronische componenten.d) moving the mold parts away from each other, and removing the carrier with formed electronic components from the mold parts, thereby also releasing the insert from the electronic components. 14. Werkwijze volgens conclusie 13, met het kenmerk dat er een folielaag in de malholte wordt gebracht die ten minste gedeeltelijk het flexibele driedimensionale maloppervlak van het inzetstuk bedekt.A method according to claim 13, characterized in that a film layer is introduced into the mold cavity which at least partially covers the flexible three-dimensional mold surface of the insert. 15. Werkwijze volgens conclusie 14, met het kenmerk dat het folie tijdens processtap c), terwijl de maldelen naar elkaar toe worden gebracht, tussen het inzetstuk en de elektronische componenten en/of de drager wordt ingeklemd.Method according to claim 14, characterized in that during process step c), the film is clamped between the insert and the electronic components and / or the carrier while the mold parts are brought together. 16. Werkwijze volgens conclusie 14 of 15, met het kenmerk dat er via een opening in het maldeel een onderdruk tussen de folielaag en het flexibele driedimensionale maloppervlak van het inzetstuk wordt aangebracht.A method according to claim 14 or 15, characterized in that an underpressure is applied via an opening in the mold part between the foil layer and the flexible three-dimensional mold surface of the insert. 17. Werkwijze volgens één van de conclusies 13 -16, met het kenmerk dat het gietmateriaal in de malholte wordt gebracht volgens werkwijzestap c), nadat de maldelen naar elkaar toe zijn bewogen volgens werkwijzestap b), door het verplaatsen van vloeibaar gietmateriaal naar de de elektronische component omsluitende malholte door middel van het uitoefenen van druk op het gietmateriaal.A method according to any one of claims 13-16, characterized in that the casting material is introduced into the mold cavity according to method step c), after the mold parts have been moved towards each other according to method step b), by moving liquid molding material to the electronic component enclosing mold cavity by exerting pressure on the casting material. 18. Werkwijze volgens één van de conclusies 13 tot en met 17, met het kenmerk dat er een procestemperatuur tussen 100 en 200°C wordt toegepast tijdens het in de malholte brengen van het gietmateriaal.A method according to any one of claims 13 to 17, characterized in that a process temperature between 100 and 200 ° C is applied during the introduction of the molding material into the mold cavity. 1/41/4 2/42/4 3/43/4 Fig. 3bFIG. 3b 4/44/4 Fig. 3dFIG. 3d
NL2021145A 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components NL2021145B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL2021145A NL2021145B1 (en) 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
SG11202011472VA SG11202011472VA (en) 2018-06-18 2019-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
JP2020569196A JP7391051B2 (en) 2018-06-18 2019-06-18 A mold for sealing electronic components, an insert for the mold, a method for manufacturing the insert, and a method for sealing electronic components
PCT/NL2019/050374 WO2019245364A1 (en) 2018-06-18 2019-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
TW108121121A TWI834678B (en) 2018-06-18 2019-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
KR1020207036958A KR102784021B1 (en) 2018-06-18 2019-06-18 Molds for encapsulating electronic components, inserts for such molds, methods for producing inserts and methods for encapsulating electronic components
CN201980039639.1A CN112262461B (en) 2018-06-18 2019-06-18 Mold for encapsulating electronic component, mold insert, method of manufacturing insert, and method of encapsulating electronic component
PH12020552144A PH12020552144A1 (en) 2018-06-18 2020-12-10 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2021145A NL2021145B1 (en) 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Publications (1)

Publication Number Publication Date
NL2021145B1 true NL2021145B1 (en) 2020-01-06

Family

ID=63145170

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2021145A NL2021145B1 (en) 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Country Status (7)

Country Link
JP (1) JP7391051B2 (en)
KR (1) KR102784021B1 (en)
NL (1) NL2021145B1 (en)
PH (1) PH12020552144A1 (en)
SG (1) SG11202011472VA (en)
TW (1) TWI834678B (en)
WO (1) WO2019245364A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254481A (en) * 2001-03-01 2002-09-11 Nec Corp Resin mold die and method for manufacturing resin mold package
US20040063234A1 (en) * 2002-09-27 2004-04-01 Towa Corporation Method of introducing resin for electronic component and apparatus used therefor
US20050054144A1 (en) * 2001-09-26 2005-03-10 Raben Jurgen Leonardus Theodorus Maria Method for encapsulating a chip and/or other article
US20060014328A1 (en) * 2004-07-16 2006-01-19 Towa Corporation Resin encapsulation molding for semiconductor device
US20100132190A1 (en) * 2008-11-26 2010-06-03 Osram Gesellschaft Mit Beschraenkter Haftung Injection tool for encapsulating electronic circuits with light sources, and related encapsulation processes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128303A (en) 2002-10-04 2004-04-22 Towa Corp Underfill resin mold substrate and individual piece, and underfill resin molding method and die
CN101375393B (en) * 2006-02-03 2010-09-22 三井化学株式会社 Resin hollow package and manufacturing method thereof
JP2007288081A (en) 2006-04-20 2007-11-01 Towa Corp Resin seal molding device of electronic component
WO2011118157A1 (en) * 2010-03-25 2011-09-29 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
JP5630652B2 (en) * 2011-01-06 2014-11-26 日立化成株式会社 Epoxy resin molding material for sealing and electronic component device
CN105917451B (en) 2014-01-14 2018-07-06 山田尖端科技株式会社 Resin molded mold and resin molding method
JP2016025198A (en) * 2014-07-18 2016-02-08 マイクロン テクノロジー， インク． Method of manufacturing semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254481A (en) * 2001-03-01 2002-09-11 Nec Corp Resin mold die and method for manufacturing resin mold package
US20050054144A1 (en) * 2001-09-26 2005-03-10 Raben Jurgen Leonardus Theodorus Maria Method for encapsulating a chip and/or other article
US20040063234A1 (en) * 2002-09-27 2004-04-01 Towa Corporation Method of introducing resin for electronic component and apparatus used therefor
US20060014328A1 (en) * 2004-07-16 2006-01-19 Towa Corporation Resin encapsulation molding for semiconductor device
US20100132190A1 (en) * 2008-11-26 2010-06-03 Osram Gesellschaft Mit Beschraenkter Haftung Injection tool for encapsulating electronic circuits with light sources, and related encapsulation processes

Also Published As

Publication number Publication date
TW202000416A (en) 2020-01-01
KR20210022002A (en) 2021-03-02
KR102784021B1 (en) 2025-03-21
PH12020552144A1 (en) 2021-06-21
CN112262461A (en) 2021-01-22
WO2019245364A1 (en) 2019-12-26
TWI834678B (en) 2024-03-11
JP2021531643A (en) 2021-11-18
SG11202011472VA (en) 2020-12-30
JP7391051B2 (en) 2023-12-04

Similar Documents

Publication Publication Date Title
TWI641471B (en) Resin molding die and resin molding method
KR20150126360A (en) Resin molding mold, resin molding device, resin molding method, and resin molding mold evaluation method
JP5817044B2 (en) Resin sealing device and resin sealing method
CN108431948B (en) Press, actuator group and method for encapsulating electronic components with at least two individually controllable actuators
TWI688055B (en) Resin molding device and method for manufacturing resin molded product
TWI688056B (en) Resin molding device and method for manufacturing resin molded product
JP6649752B2 (en) Compression molding method and compression molding apparatus
CN107000288B (en) Mould for controlled over-moulding of a carrier with electronic components, moulding device and method and moulded product
JP6867229B2 (en) Resin mold mold
NL2021145B1 (en) Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
JP3896274B2 (en) Semiconductor resin sealing device
WO2012128444A1 (en) Encapsulating material moulding method
TWI656006B (en) Resin forming device
JP7447050B2 (en) Molding mold, resin molding equipment, and method for manufacturing resin molded products
WO2016125571A1 (en) Resin molding die, resin molding method, and method for producing resin molded article
TW201321214A (en) Embossing method and embossing mold
CN112262461B (en) Mold for encapsulating electronic component, mold insert, method of manufacturing insert, and method of encapsulating electronic component
JP4031881B2 (en) Resin sealing device
JPWO2004052614A1 (en) Manufacturing method of base-integrated rubber
JP6397808B2 (en) Resin molding die and resin molding method
NL2015091B1 (en) Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
EP1589569A2 (en) Injection casting system for encapsulating semiconductor devices and method of use
JP6404734B2 (en) RESIN MOLDING METHOD, RESIN MOLDING MOLD, AND METHOD FOR PRODUCING MOLDED ARTICLE
JPH08142109A (en) Apparatus and method for resin molding
JP6089260B2 (en) Resin molding apparatus and resin molding method