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NL155600B - PROCEDURE FOR MANUFACTURING A COMPOSITE FOELIE, SO MANUFACTURED COMPOSITE FOELIE, PROCESS FOR PROCESSING THE COMPOUND FOELIE, AND PREPARED PRODUCTION THEREFORE OBTAINED. - Google Patents

PROCEDURE FOR MANUFACTURING A COMPOSITE FOELIE, SO MANUFACTURED COMPOSITE FOELIE, PROCESS FOR PROCESSING THE COMPOUND FOELIE, AND PREPARED PRODUCTION THEREFORE OBTAINED.

Info

Publication number
NL155600B
NL155600B NL7404748.A NL7404748A NL155600B NL 155600 B NL155600 B NL 155600B NL 7404748 A NL7404748 A NL 7404748A NL 155600 B NL155600 B NL 155600B
Authority
NL
Netherlands
Prior art keywords
foelie
composite
procedure
compound
manufacturing
Prior art date
Application number
NL7404748.A
Other languages
Dutch (nl)
Other versions
NL7404748A (en
Original Assignee
Yates Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yates Industries filed Critical Yates Industries
Publication of NL7404748A publication Critical patent/NL7404748A/xx
Publication of NL155600B publication Critical patent/NL155600B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
NL7404748.A 1973-04-25 1974-04-08 PROCEDURE FOR MANUFACTURING A COMPOSITE FOELIE, SO MANUFACTURED COMPOSITE FOELIE, PROCESS FOR PROCESSING THE COMPOUND FOELIE, AND PREPARED PRODUCTION THEREFORE OBTAINED. NL155600B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35419673A 1973-04-25 1973-04-25

Publications (2)

Publication Number Publication Date
NL7404748A NL7404748A (en) 1974-10-29
NL155600B true NL155600B (en) 1978-01-16

Family

ID=23392262

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7404748.A NL155600B (en) 1973-04-25 1974-04-08 PROCEDURE FOR MANUFACTURING A COMPOSITE FOELIE, SO MANUFACTURED COMPOSITE FOELIE, PROCESS FOR PROCESSING THE COMPOUND FOELIE, AND PREPARED PRODUCTION THEREFORE OBTAINED.

Country Status (9)

Country Link
JP (1) JPS542179B2 (en)
BE (1) BE813813A (en)
DE (1) DE2413932C2 (en)
FR (1) FR2227351B1 (en)
GB (1) GB1458260A (en)
IT (1) IT1004196B (en)
LU (1) LU69919A1 (en)
NL (1) NL155600B (en)
SE (1) SE406023C (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434259Y2 (en) * 1974-07-12 1979-10-20
JPS5266962U (en) * 1975-11-12 1977-05-18
DE2659625C3 (en) * 1976-12-30 1981-07-02 Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg Process for the production of base material for the production of printed circuits
US4293617A (en) * 1979-12-26 1981-10-06 Gould Inc. Process for producing strippable copper on an aluminum carrier and the article so obtained
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
GB2091634B (en) * 1981-01-22 1984-12-05 Gen Electric Transfer lamination of vapour deposited copper thin sheets and films
JPS58122865A (en) * 1982-01-14 1983-07-21 高安　清輝 Composite material
US4534831A (en) * 1982-09-27 1985-08-13 Inoue-Japax Research Incorporated Method of and apparatus for forming a 3D article
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
SE9203327L (en) 1992-11-06 1993-12-20 Metfoils Ab Process for the production of printed circuit boards and their use
US6270889B1 (en) 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6319620B1 (en) 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6183880B1 (en) 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
JP3670179B2 (en) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
CN102442025A (en) * 2011-09-08 2012-05-09 深圳市必事达电子有限公司 Manufacturing method of heat dissipation aluminum substrate
KR101944784B1 (en) 2017-01-16 2019-02-08 일진머티리얼즈 주식회사 Copper foil attached to the carrier foil
CN112941478A (en) * 2021-01-29 2021-06-11 山东金宝电子股份有限公司 Ultra-thin copper foil taking micro-arc oxidation treatment aluminum foil as carrier and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2433441A (en) * 1947-12-30 Electrolytic production of thin
US880484A (en) * 1904-06-29 1908-02-25 Edison Storage Battery Co Process of producing very thin sheet metal.
US3468765A (en) * 1966-08-04 1969-09-23 Nasa Method of plating copper on aluminum
US3565771A (en) * 1967-10-16 1971-02-23 Shipley Co Etching and metal plating silicon containing aluminum alloys
US3551122A (en) * 1967-12-18 1970-12-29 Shipley Co Surface finished aluminum alloys
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
US3866022A (en) * 1972-12-26 1975-02-11 Nasa System for generating timing and control signals

Also Published As

Publication number Publication date
LU69919A1 (en) 1974-08-06
FR2227351A1 (en) 1974-11-22
JPS542179B2 (en) 1979-02-03
DE2413932C2 (en) 1984-08-30
SE406023C (en) 1987-05-04
JPS502658A (en) 1975-01-11
DE2413932A1 (en) 1974-11-14
NL7404748A (en) 1974-10-29
BE813813A (en) 1974-08-16
FR2227351B1 (en) 1979-06-15
IT1004196B (en) 1976-07-10
GB1458260A (en) 1976-12-15
SE406023B (en) 1979-01-15

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Legal Events

Date Code Title Description
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: YATES INDUSTR

V4 Discontinued because of reaching the maximum lifetime of a patent