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MX9605015A - Aleacion de soldadura a baja temperatura y articulos que comprenden la aleacion. - Google Patents

Aleacion de soldadura a baja temperatura y articulos que comprenden la aleacion.

Info

Publication number
MX9605015A
MX9605015A MX9605015A MX9605015A MX9605015A MX 9605015 A MX9605015 A MX 9605015A MX 9605015 A MX9605015 A MX 9605015A MX 9605015 A MX9605015 A MX 9605015A MX 9605015 A MX9605015 A MX 9605015A
Authority
MX
Mexico
Prior art keywords
alloy
low temperature
articles
percent
temperature solder
Prior art date
Application number
MX9605015A
Other languages
English (en)
Inventor
Mark Thomas Mccormack
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Publication of MX9605015A publication Critical patent/MX9605015A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Se describe una aleacion que se funde a baja temperatura a base del sistema de Sn-Pb-Bi (estaño-plomo-bismuto) y artículos unidos con la misma. La nueva composicion, la cual comprende entre aproximadamente 48-52% en peso de Sn, 41-44% de Pb y 7-9% de Bi tiene un rango de fusion estrecho de aproximadamente 169-175 degree C. La adicion de aproximadamente 0.2 a 0.8% de Ag (plata) es efectiva para reducir el rango de fusion a aproximadamente 166-172 degree C.
MX9605015A 1995-10-30 1996-10-22 Aleacion de soldadura a baja temperatura y articulos que comprenden la aleacion. MX9605015A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55014595A 1995-10-30 1995-10-30

Publications (1)

Publication Number Publication Date
MX9605015A true MX9605015A (es) 1997-04-30

Family

ID=24195933

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9605015A MX9605015A (es) 1995-10-30 1996-10-22 Aleacion de soldadura a baja temperatura y articulos que comprenden la aleacion.

Country Status (4)

Country Link
EP (1) EP0770449B1 (es)
JP (1) JP3305596B2 (es)
DE (1) DE69612258T2 (es)
MX (1) MX9605015A (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US20050199323A1 (en) 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
FR2867469A1 (fr) 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
EP1780494A3 (en) 2005-10-04 2008-02-27 Alliant Techsystems Inc. Reactive material enhanced projectiles and related methods
CN105870238B (zh) * 2015-01-23 2018-05-08 比亚迪股份有限公司 一种光伏焊带和一种光伏组件
CN105127611A (zh) * 2015-09-28 2015-12-09 苏州龙腾万里化工科技有限公司 一种低温锡膏

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR939104A (fr) * 1944-03-11 1948-11-04 Philips Nv Soudure douce
FR2496525A1 (fr) * 1980-12-18 1982-06-25 Alliages Etain Derives Procede d'elaboration de soudure mate, notamment destinee a l'electronique ainsi que soudure obtenue par la mise en oeuvre de ce procede
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
SU1500455A1 (ru) * 1987-11-24 1989-08-15 Институт Электросварки Им.Е.О.Патона Припой дл низкотемпературной пайки
JPH0636446A (ja) * 1992-07-20 1994-02-10 Csk Corp プリペイドカード検査装置及び検査方式
JPH07336043A (ja) * 1994-04-15 1995-12-22 Hitachi Ltd はんだ、はんだ接続方法および電子部品の実装構造体

Also Published As

Publication number Publication date
JP3305596B2 (ja) 2002-07-22
EP0770449A1 (en) 1997-05-02
EP0770449B1 (en) 2001-03-28
DE69612258D1 (de) 2001-05-03
JPH09122968A (ja) 1997-05-13
DE69612258T2 (de) 2001-11-15

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