Nothing Special   »   [go: up one dir, main page]

MA39723A - Agencement de composants électriques - Google Patents

Agencement de composants électriques

Info

Publication number
MA39723A
MA39723A MA039723A MA39723A MA39723A MA 39723 A MA39723 A MA 39723A MA 039723 A MA039723 A MA 039723A MA 39723 A MA39723 A MA 39723A MA 39723 A MA39723 A MA 39723A
Authority
MA
Morocco
Prior art keywords
component assembly
electric component
housing outer
electric
conductive plate
Prior art date
Application number
MA039723A
Other languages
English (en)
Inventor
Roman Jamy
Ernst Prand-Stritzko
Original Assignee
Egston System Electronics Eggenburg Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egston System Electronics Eggenburg Gmbh filed Critical Egston System Electronics Eggenburg Gmbh
Publication of MA39723A publication Critical patent/MA39723A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

L'invention concerne un agencement de composants électriques (1) qui comprend au moins un premier composant semi-conducteur discret (2) pourvu d'un premier boîtier (3) ayant une première surface extérieure de boîtier (4) qui sert de contact électrique pour le premier composant semi-conducteur (2). Selon l'invention, la première surface extérieure de boîtier (4) est reliée de manière électriquement conductrice à une platine (5) électriquement conductrice de l'agencement de composants électriques (1) et la platine (5) électriquement conductrice est reliée de manière électriquement isolée à un dissipateur thermique (6) de l'agencement de composants électriques (1).
MA039723A 2014-03-10 2015-03-10 Agencement de composants électriques MA39723A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATA171/2014A AT515440B1 (de) 2014-03-10 2014-03-10 Elektrische Bauteilanordnung

Publications (1)

Publication Number Publication Date
MA39723A true MA39723A (fr) 2017-01-18

Family

ID=53005436

Family Applications (1)

Application Number Title Priority Date Filing Date
MA039723A MA39723A (fr) 2014-03-10 2015-03-10 Agencement de composants électriques

Country Status (4)

Country Link
EP (1) EP3117458B1 (fr)
AT (1) AT515440B1 (fr)
MA (1) MA39723A (fr)
WO (1) WO2015135010A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202016100481U1 (de) * 2016-02-01 2017-05-04 Gebr. Bode Gmbh & Co. Kg Elektronikmodul mit einer Leistungshalbleiteranordnung
DE102016120071A1 (de) 2016-10-21 2018-04-26 Eaton Industries (Austria) Gmbh Niederspannungs-Schutzschaltgerät
EP3852138B1 (fr) 2020-01-20 2023-11-08 Infineon Technologies Austria AG Module électronique comprenant un boîtier à semi-conducteur connecté à un dissipateur thermique fluide

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US4853828A (en) * 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
DE4025170A1 (de) * 1990-08-08 1992-02-13 Siemens Ag Elektrische baugruppe, insbesondere fuer leistungsverstaerker
DE59005035D1 (de) * 1990-12-12 1994-04-21 Siemens Ag Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte.
JP2005079386A (ja) * 2003-09-01 2005-03-24 Toshiba Corp パワー半導体応用装置
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
JP4826426B2 (ja) * 2006-10-20 2011-11-30 株式会社デンソー 半導体装置
DE102010000082B4 (de) * 2010-01-14 2012-10-11 Woodward Kempen Gmbh Schaltungsanordnung von elektronischen Leistungsschaltern einer Stromerzeugungsvorrichtung
JP5659542B2 (ja) * 2010-04-07 2015-01-28 三菱マテリアル株式会社 絶縁基板及びパワーモジュール
JP5916603B2 (ja) * 2010-04-28 2016-05-11 株式会社豊田自動織機 放熱装置および半導体装置
JP2012174856A (ja) * 2011-02-21 2012-09-10 Hitachi Cable Ltd ヒートシンク及びその製造方法
JP5517988B2 (ja) * 2011-04-22 2014-06-11 日立オートモティブシステムズ株式会社 エンジン始動装置
JP2013123014A (ja) * 2011-12-12 2013-06-20 Toyota Industries Corp 半導体装置
FR2984680B1 (fr) * 2011-12-15 2014-10-31 Valeo Sys Controle Moteur Sas Structure portant un ou plusieurs composants electroniques
US9147637B2 (en) * 2011-12-23 2015-09-29 Infineon Technologies Ag Module including a discrete device mounted on a DCB substrate

Also Published As

Publication number Publication date
EP3117458A1 (fr) 2017-01-18
AT515440A1 (de) 2015-09-15
AT515440B1 (de) 2019-07-15
EP3117458B1 (fr) 2022-01-26
WO2015135010A1 (fr) 2015-09-17

Similar Documents

Publication Publication Date Title
TW201614912A (en) Cable assembly
PH12017501058A1 (en) Monolithic plane with electrical contacts
PH12016501300B1 (en) An aerosol-generating system having a fluid-permeable heater assembly
TW201613207A (en) Electrical connector
GB2577176B (en) Conductive contact structure, electrode assembly, power supply assembly and electronic cigarette having same
MX2016000835A (es) Terminal para contactar un conductor electrico.
MX2016014063A (es) Elemento de conexion electrica para poner en contacto una estructura conductora de electricidad sobre un sustrato.
MX2017006050A (es) Conector de enchufe.
MX2017007722A (es) Conector de enchufe.
EA201792153A1 (ru) Антенная панель
GB201801369D0 (en) Conductive contact structure, electrode assembly, power supply assembly and electronic cigarette having same
MX364087B (es) Dispositivo para contacto de potencia.
NZ727076A (en) An electrical connector
TWD174317S (zh) 同軸電連接器
WO2017021008A8 (fr) Système de mise en contact électrique
MA39723A (fr) Agencement de composants électriques
MX2018016111A (es) Contacto electrico de alta potencia.
MX358087B (es) Elemento de presión y componente eléctrico/electrónico.
WO2017102399A3 (fr) Element d'habillage en zircone a zones selectivement conductrices pour applications électroniques
MX2017005658A (es) Conector electrico tipo hermafrodita.
MX348371B (es) Mecanismos de contacto para montajes de receptáculo eléctrico.
EP3543713A4 (fr) Contact électrique et réceptacle de composant électrique
MX2017006471A (es) Ensamble electrico dentro de un alojamiento de conector.
MX350629B (es) Conjunto de terminal eléctrico de perfil bajo.
MX2016016483A (es) Sistema de barra de distribucion de bajo voltaje.