Nothing Special   »   [go: up one dir, main page]

Yoshioka et al., 2001 - Google Patents

Relationship between thermal treatment conditions and minority carrier lifetimes in p-type, FZ Si wafers

Yoshioka et al., 2001

Document ID
366236367024343777
Author
Yoshioka K
Ishikawa S
Mimura M
Saitoh T
Publication year
Publication venue
Solar energy materials and solar cells

External Links

Snippet

Minority-carrier lifetimes in FZ-p Si wafers were evaluated at various thermal treatments to investigate the effect of the recombination centers. Bulk lifetimes became longer in the case of annealing in O2 ambient at around 1000° C, while it decreased drastically in N2 and Ar …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GASES [GHG] EMISSION, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/54Material technologies
    • Y02E10/547Monocrystalline silicon PV cells
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies

Similar Documents

Publication Publication Date Title
Liu et al. Effective impurity gettering by phosphorus-and boron-diffused polysilicon passivating contacts for silicon solar cells
CN101228301A (en) High resistivity silicon structure and a process for the preparation thereof
Karzel et al. Influence of hydrogen on interstitial iron concentration in multicrystalline silicon during annealing steps
LaSalvia et al. Tabula Rasa for n‐Cz silicon‐based photovoltaics
Khedher et al. Gettering impurities from crystalline silicon by phosphorus diffusion using a porous silicon layer
Joshi et al. Extended high temperature Al gettering for improvement and homogenization of minority carrier diffusion lengths in multicrystalline Si
Macdonald et al. Understanding carrier trapping in multicrystalline silicon
Yoshioka et al. Relationship between thermal treatment conditions and minority carrier lifetimes in p-type, FZ Si wafers
Doshi et al. Rapid thermal processing of high-efficiency silicon solar cells with controlled in-situ annealing
Song et al. Controlled cooling process for efficient hydrogenation
Fuma et al. Diffused nitrogen-related deep level in n-type silicon
Zarroug et al. The impact of thermal treatment on gettering efficiency in silicon solar cell
Ciszek et al. Silicon defect and impurity studies using float-zone crystal growth as a tool
Elgamel et al. Hydrogen in polycrystalline silicon solar cell material: Its role and characteristics
Resmi et al. Analysis of variation in recombination characteristics due to light and heat in industrial silicon solar cells
Porrini et al. Minority carrier lifetime of p-type silicon containing oxygen precipitates: influence of injection level and precipitate size/density
Taylor et al. Type conversion in irradiated silicon diodes
Mahfoud et al. Influence of carbon and oxygen on phosphorus and aluminium co-gettering in silicon solar cells
Orpella et al. Phosphorus-diffused silicon solar cell emitters with plasma enhanced chemical vapor deposited silicon carbide
Haug et al. Impact of rapid thermal processing on bulk and surface recombination mechanisms in FZ silicon with fired passivating contacts
Boudaden et al. Comparison of phosphorus gettering for different multicrystalline silicon
Zarroug et al. Enhanced phosphorus gettering of impurities in p-type Czochralski silicon through a variable temperature processing (VTP)
Caballero et al. Influence of P gettering thermal step on light-induced degradation in Cz Si
Dimassi et al. Grooving of grain boundaries in multicrystalline silicon: Effect on solar cell performance
Mittelstädt et al. Hydrogen passivation of defects in EFG ribbon silicon