Nothing Special   »   [go: up one dir, main page]

Ho et al., 2015 - Google Patents

Effect of Pd (P) thickness on the soldering reaction between Sn–3Ag–0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad

Ho et al., 2015

Document ID
3547860095051907344
Author
Ho C
Hsu L
Yang C
Yeh T
Lee P
Publication year
Publication venue
Thin Solid Films

External Links

Snippet

The strong effect of the Pd (P) thickness (δ Pd (P)) on the interfacial reaction between Sn– 3Ag–0.5 Cu solder and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu pad was revealed. We observed that the P of the Pd (P) film would redeposit over the Ni (P) platings and formed …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making alloys
    • C22C1/02—Making alloys by melting

Similar Documents

Publication Publication Date Title
Liu et al. Effect of Al content on high temperature oxidation resistance of AlxCoCrCuFeNi high entropy alloys (x= 0, 0.5, 1, 1.5, 2)
Ho et al. Effect of Pd (P) thickness on the soldering reaction between Sn–3Ag–0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad
Ho et al. Pronounced effects of Ni (P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd (P)/Ni (P)/Cu reactive system
Ho et al. IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique
Liu et al. Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders
Wang et al. Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co (P) layer deposited on a Cu substrate
US10494712B2 (en) Copper alloy sputtering target and method for manufacturing same
Tsao et al. Study of interfacial reactions between Sn3. 5Ag0. 5Cu composite alloys and Cu substrate
Ho et al. Sn–Ag–Cu solder reaction with Au/Pd/Ni (P) and Au/Pd (P)/Ni (P) platings
Lee et al. Influence of Pd (P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd (P)/Ni (P)/Cu multilayer
Lee et al. High-speed Cu electrodeposition and its solderability
Ho et al. Reliability evaluation on a submicron Ni (P) thin film for lead-free soldering
Gong et al. Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment
Hlinka et al. Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder
Ho et al. TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system
Chao et al. Phase equilibria of Sn-Co-Ni system and interfacial reactions in Sn/(Co, Ni) couples
Lu et al. Microstructure and orientation evolution of β-Sn and interfacial Cu6Sn5 IMC grains in SAC105 solder joints modified by Si3N4 nanowires
Wu et al. Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd (xP)/Ni (P) reactive system: P content effects
Mohri et al. Crystallization study of amorphous sputtered NiTi bi-layer thin film
Lee et al. High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage
Wu et al. Interfacial reaction and mechanical reliability between Sn-3Ag-0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad
Chun et al. Solid-state interfacial reactions between Sn–3.5 Ag–0.7 Cu solder and electroless Ni-immersion Au substrate during high temperature storage test
Kelly et al. Effect of trace addition of in on Sn-Cu solder joint microstructure under electromigration
Kang et al. Control of interfacial reaction layers formed in Sn–3.5 Ag–0.7 Cu/electroless Ni–P solder joints
Reyes et al. Microstructure characterization of high temperature mechanisms in a Nb–Ti–Si alloy