Nothing Special   »   [go: up one dir, main page]

Zhang et al., 2022 - Google Patents

Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding

Zhang et al., 2022

View PDF
Document ID
3333691739446113745
Author
Zhang Y
Liu Z
Yang L
Xiong Y
Publication year
Publication venue
Journal of Manufacturing Processes

External Links

Snippet

InSn-50Ag composite solder joints doping Ni-coated carbon nanotubes (Ni-CNTs) were fabricated by transient liquid phase (TLP) bonding, and then the effect of Ni-CNTs contents (x= 0, 0.01, 0.03, 0.05, 0.07, 0.1 wt%) on the microstructure and shear property of the …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making alloys
    • C22C1/10Alloys containing non-metals
    • C22C1/1036Alloys containing non-metals starting from a melt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
    • B22F1/00Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
    • B22F1/0003Metallic powders per se; Mixtures of metallic powders; Metallic powders mixed with a lubricating or binding agent
    • B22F1/0007Metallic powder characterised by its shape or structure, e.g. fibre structure

Similar Documents

Publication Publication Date Title
Wang et al. Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder
Gain et al. Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
Gu et al. Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates
Sharma et al. Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy
Chen et al. Bonding technology based on solid porous Ag for large area chips
Tsao et al. Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3. 5Ag0. 5Cu solder
Jiang et al. Recent advances on SnBi low-temperature solder for electronic interconnections
Chen et al. Performance of Sn–3.0 Ag–0.5 Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing
Shen et al. Research advances in nano-composite solders
Zhu et al. Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0. 3Ag0. 7Cu-CNTs solder
Salleh et al. Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates
Zhao et al. Effect of γ-Fe2O3 nanoparticles size on the properties of Sn-1.0 Ag–0.5 Cu nano-composite solders and joints
Wu et al. Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3 Ag-0.7 Cu low-Ag solder
Wen et al. Reliability enhancement of Sn-1.0 Ag-0.5 Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Sun et al. A study of Ag additive methods by comparing mechanical properties between Sn57. 6Bi0. 4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints
Ma et al. Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging
Leong et al. Effect of nano-TiO 2 addition on the microstructure and bonding strengths of Sn3. 5Ag0. 5Cu composite solder BGA packages with immersion Sn surface finish
Chen et al. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles
Wu et al. Effects of α-Al 2 O 3 nanoparticles-doped on microstructure and properties of Sn–0.3 Ag–0.7 Cu low-Ag solder
Zhao et al. Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn–3.0 Ag–0.5 Cu solder joints
Zhang et al. Microstructure and shear property of Ni-coated carbon nanotubes reinforced InSn-50Ag composite solder joints prepared by transient liquid phase bonding
Pal et al. Investigation of the electroless nickel plated sic particles in sac305 solder matrix
Yin et al. Interfacial microstructure evolution and properties of Sn-0.3 Ag-0.7 Cu–xSiC solder joints
Wang et al. Enhancement of structure and properties of Sn58Bi solder by AlN ceramic particles
Hu et al. Effect of Cu 6 Sn 5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3. 0Ag0. 5Cu solder alloys