Kiyama et al., 2020 - Google Patents
Quantitative analysis of slip defect generation during thermal processes in GaAs wafersKiyama et al., 2020
- Document ID
- 3191459796180255593
- Author
- Kiyama M
- Takebe T
- Fujita K
- Publication year
- Publication venue
- Compound Semiconductors 1996, Proceedings of the Twenty-Third INT Symposium on Compound Semiconductors held in St Petersburg, Russia, 23-27 September 1996
External Links
Snippet
Slip defect generation in (001) GaAs wafers was quantitatively studied by a newly developed wafer heating apparatus, which can precisely control the radial temperature distribution in a wafer. The critical thermal stress for slip defect generation (CSSG) was …
- 235000012431 wafers 0 title abstract description 53
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