Jia et al., 2023 - Google Patents
Multi-scan picosecond laser welding of non-optical contact soda lime glassJia et al., 2023
- Document ID
- 2880669178965182365
- Author
- Jia X
- Li K
- Li Z
- Wang C
- Chen J
- Cui S
- Publication year
- Publication venue
- Optics & Laser Technology
External Links
Snippet
Nowadays, ultrafast laser welding has been widely used in chip labs, microelectronic systems (MEMS), and micro-medical implantable devices, etc. The welding of the non- optical contact transparent materials has become a new challenge to promote the practical …
- 238000003466 welding 0 title abstract description 200
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/095—Tubes, rods or hollow products
- C03B33/0955—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0054—Working by transmitting the laser beam within the workpiece
- B23K26/0057—Working by transmitting the laser beam within the workpiece by modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Jia et al. | Multi-scan picosecond laser welding of non-optical contact soda lime glass | |
JP6703482B2 (en) | Laser-cut composite glass article and cutting method | |
KR102546692B1 (en) | Laser Cutting and Processing of Display Glass Compositions | |
US10597321B2 (en) | Edge chamfering methods | |
EP3363771B1 (en) | Method of machining and releasing closed forms from a transparent substrate using burst of ultrafast laser pulses | |
KR102230762B1 (en) | Method of and device for the laser-based machining of sheet-like substrates using a laser beam focal line | |
JP6397821B2 (en) | Method and apparatus for workpiece separation | |
Miyamoto et al. | Local melting of glass material and its application to direct fusion welding by ps-laser pulses | |
JP2017528322A (en) | Material processing using non-circular laser beams. | |
JP2019520291A (en) | Laser cutting and removal of contoured shapes from transparent substrates | |
JP5303238B2 (en) | Cleaving method of brittle material substrate | |
CN103030266B (en) | Laser cutting method and device | |
TW201540405A (en) | Edge chamfering methods | |
CN102152003B (en) | Method and device for separating optical crystal by using two laser beams | |
CN102765876A (en) | Glass cutting method by laser self-focusing and wire feeding | |
Liang et al. | Laser drilling of alumina ceramic substrates: A review | |
CN102718398A (en) | Device and method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser | |
CN103058508A (en) | A device and a method for processing a glass ink jet sheet | |
JP2009023885A (en) | Repairing method of part of surface scar on surface of glass substrate by laser irradiation | |
TW201831414A (en) | Methods for laser processing transparent workpieces by forming score lines | |
Li et al. | Analysis and comparison of laser cutting performance of solar float glass with different scanning modes | |
CN203079699U (en) | Device for processing glass inkjet sheet | |
CN202671407U (en) | Ultra-short pulse double-optical path laser special glass cutting device | |
Kang et al. | Experimental investigation on the CO 2 laser cutting of soda-lime glass | |
Li et al. | Dimethicone-aided laser cutting of solar rolled glass |