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Gao et al., 2019 - Google Patents

Low temperature Cu interconnect with chip to wafer hybrid bonding

Gao et al., 2019

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Document ID
2273678612179294842
Author
Gao G
Mirkarimi L
Workman T
Fountain G
Theil J
Guevara G
Liu P
Lee B
Mrozek P
Huynh M
Rudolph C
Werner T
Hanisch A
Publication year
Publication venue
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

External Links

Snippet

Current DRAM advanced chip stack packages such as the high bandwidth memory (HBM) use throughsilicon-via (TSV) and thermal compression bonding (TCB) of solder capped micro bumps for the inter-layer connection. The bonding process has low throughput and …
Continue reading at www.academia.edu (PDF) (other versions)

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    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2924/102—Material of the semiconductor or solid state bodies
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    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/01029—Copper [Cu]
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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