Sargent et al., 2002 - Google Patents
The development of a system for measuring material deformation during the bonding of multilayer printed circuit boardsSargent et al., 2002
- Document ID
- 181190757043530781
- Author
- Sargent K
- Spiller A
- Publication year
- Publication venue
- Circuit World
External Links
Snippet
During the bonding of multi‐layer printed circuit boards (PCBs) the individual layers tend to distort, causing the feature positions to move. While the results of the bonding process are well understood, the processes occurring during bonding that take place within the press are …
- 239000000463 material 0 title description 21
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