Farraj et al., 2017 - Google Patents
Plasma-induced decomposition of copper complex ink for the formation of highly conductive copper tracks on heat-sensitive substratesFarraj et al., 2017
- Document ID
- 17968869985845705697
- Author
- Farraj Y
- Smooha A
- Kamyshny A
- Magdassi S
- Publication year
- Publication venue
- ACS applied materials & interfaces
External Links
Snippet
The use of Cu-formate–2-amino-2-methyl-1-propanol ink and low-pressure plasma for the formation of highly conductive patterns on heat sensitive plastic substrates was studied. It was found that plasma results in decomposition of copper complex to form metallic copper …
- 239000010949 copper 0 title abstract description 341
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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