Boesenberg, 2011 - Google Patents
Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assemblyBoesenberg, 2011
View PDF- Document ID
- 17550776701452138410
- Author
- Boesenberg A
- Publication year
External Links
Snippet
The global electronic assembly community is striving for a robust replacement for leaded solders due to increased environmental regulations. A family of Pb-free solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise; but reliability issues in certain …
- 229910000679 solder 0 title abstract description 220
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Subramanian et al. | Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications | |
JP5924852B2 (en) | Solder joint | |
Anderson et al. | Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints | |
US10442037B2 (en) | Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder | |
Hao et al. | Properties of Sn3. 8Ag0. 7Cu solder alloy with trace rare earth element Y additions | |
JP6346799B2 (en) | Ni-Cr-Fe base alloy brazing material added with Cu | |
Boesenberg et al. | Development of Sn-Ag-Cu-X solders for electronic assembly by micro-alloying with Al | |
Berent et al. | Thermal and microstructure characterization of Zn-Al-Si alloys and chemical reaction with Cu substrate during spreading | |
Shen et al. | Effects of Cu, Zn on the wettability and shear mechanical properties of Sn-Bi-based lead-free solders | |
JP5973992B2 (en) | Solder alloy | |
Kim et al. | Effects of Co addition on bulk properties of Sn-3.5 Ag solder and interfacial reactions with Ni-P UBM | |
Zhao et al. | Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys | |
El-Daly et al. | Improvement of strength-ductility trade-off in a Sn–0.7 Cu–0.2 Ni lead-free solder alloys through Al-microalloying | |
US20040258556A1 (en) | Lead-free solder alloys and methods of making same | |
Boesenberg | Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly | |
Moon et al. | Accurately determining eutectic compositions: the Sn-Ag-Cu ternary eutectic | |
JPH11221695A (en) | Lead-free solder alloy | |
CN111542624A (en) | Low silver-tin based replacement solder alloys for standard SAC alloys for high reliability applications | |
Hwang et al. | Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating | |
Maalekian et al. | Efect of Bi content on properties of low silver SAC solder | |
Luo et al. | Study on low-Ag content Sn–Ag–Zn/Cu solder joints | |
CN111511494B (en) | Cost-effective lead-free solder alloys for electronic applications | |
KR102669670B1 (en) | Highly reliable lead-free solder alloy for electronic applications in harsh environments | |
Liu et al. | Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate | |
Cho et al. | Undercooling, microstructures and hardness of Sn-rich Pb-free solders on Cu-xZn alloy under bump metallurgies |