Geng et al., 2022 - Google Patents
A novel non-contacting single-coil electromagnetic hole expansion process to improve the fatigue performance of hole componentGeng et al., 2022
- Document ID
- 16730621167732956737
- Author
- Geng H
- Xu X
- Lai Z
- Cao Q
- Li L
- Publication year
- Publication venue
- International Journal of Fatigue
External Links
Snippet
In this study, a novel non-contacting electromagnetic cold expansion process (SEMCE) was developed to improve the fatigue life of hole component. The deformation mechanism and residual stress distribution around the hole during the SEMCE process was investigated by …
- 238000000034 method 0 title abstract description 123
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