Nothing Special   »   [go: up one dir, main page]

Deenadayalan et al., 2024 - Google Patents

Packaged Tunable Single Mode III-V Laser Hybrid Integrated on a Silicon Photonic Integrated Chip using Photonic Wire Bonding

Deenadayalan et al., 2024

Document ID
16226955684997918615
Author
Deenadayalan V
Thornton E
Nelson G
McGarvey P
King J
Patel J
Bickford J
Mitchell M
Chrostowski L
Shekhar S
Kemal J
Skacel S
Ciminelli M
Preble S
Publication year
Publication venue
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

External Links

Snippet

Photonic wire bonding is a passive laser-PIC integration process applicable at the wafer scale that offers relaxed alignment and mode mismatch tolerance. We present the first demonstration of a complete laser-PIC package operating in a single mode, with integrated …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/10Light guides of the optical waveguide type
    • G02B6/12Light guides of the optical waveguide type of the integrated circuit kind
    • G02B6/122Light guides of the optical waveguide type of the integrated circuit kind basic optical elements, e.g. light-guiding paths
    • G02B6/1221Light guides of the optical waveguide type of the integrated circuit kind basic optical elements, e.g. light-guiding paths made from organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031Edge-emitting structures
    • H01S5/4043Edge-emitting structures with vertically stacked active layers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S3/00Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
    • H01S3/05Construction or shape of optical resonators; Accomodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Similar Documents

Publication Publication Date Title
US11394465B2 (en) Laser module for optical data communication system within silicon interposer
US6704337B2 (en) Wavelength-variable semiconductor laser, optical integrated device utilizing the same, and production method thereof
US10168474B2 (en) Method of manufacturing optical input/output device
JP2016500451A (en) Optical fiber coupler array
CN106092080B (en) PLC chip and lithium niobate modulator hybrid integrated optical device
US8285151B2 (en) Method and system for hybrid integrated 1XN DWDM transmitter
CN107924033A (en) Self-assembled vertically aligned multi-chip assembly
JP2019504357A (en) Photonic integrated circuit using chip integration
CN111474745B (en) Photoelectric monolithic integrated system based on multi-material system
Barkai et al. Integrated silicon photonics for optical networks
US11934007B2 (en) Assembly of an active semiconductor component and of a silicon-based passive optical component
Deenadayalan et al. Packaged Tunable Single Mode III-V Laser Hybrid Integrated on a Silicon Photonic Integrated Chip using Photonic Wire Bonding
CN117055152A (en) Photoelectric fusion integrated chip based on silicon-silicon oxide-erbium-doped lithium niobate heterogeneous wafer and method
Yegnanarayanan et al. Integrated microwave photonic subsystems
Uemura et al. A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics
WO2023084610A1 (en) Optical module and creation method for same
CN221746334U (en) Multi-array heterogeneous integrated dense wavelength division multiplexing photoelectric device
US20230361532A1 (en) Silicon photonic hybrid distributed feedback laser with built-in grating
Snyder et al. Developments in packaging and integration for silicon photonics
CN218383383U (en) Optical assembly and optical chip comprising same
US20240348006A1 (en) Silicon photonic symmetric distributed feedback laser
TW202327115A (en) Systems and methods for integration of thin film optical materials in silicon photonics
KR20230004199A (en) High bandwidth photonic integrated circuit with etalon compensation
Van Thourhout et al. Heterogeneously integrated SOI compound semiconductor photonics
Stopiński et al. Hybrid Integration of a Single-Frequency Ring Laser with a Microelectronic Driver