Zhang et al., 2014 - Google Patents
High heat flux, single-phase microchannel coolingZhang et al., 2014
- Document ID
- 1598866095555839689
- Author
- Zhang R
- Hodes M
- Lower N
- Wilcoxon R
- Publication year
- Publication venue
- 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
External Links
Snippet
Microchannel heat sinks are a relevant thermal management technology because the combination of surface area enhancement and small length scales results in low thermal resistance. Previously, a thermal resistance of 0.09° C/W was achieved when a heat flux of …
- 230000004907 flux 0 title abstract description 32
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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