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Lee et al., 2002 - Google Patents

Bonding of silicon scanning mirror having vertical comb fingers

Lee et al., 2002

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Document ID
14722598645784550323
Author
Lee J
Ko Y
Choi B
Kim J
Jeon D
Publication year
Publication venue
Journal of Micromechanics and Microengineering

External Links

Snippet

A 1500 μm× 1200 μm silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]

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